公开(公告)号：US20050211750A1

公开(公告)日：2005-09-29

申请号：US10812625

申请日：2004-03-29

申请人： Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

发明人： Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

IPC分类号： H01L21/48 ,  H01L23/50 ,  H05K1/02 ,  H05K1/16 ,  H05K3/34 ,  B23K31/02

CPC分类号： H05K3/3436 ,  H01L21/4853 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0263 ,  H05K1/162 ,  H05K3/3452 ,  H05K2201/09236 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

摘要： Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

摘要翻译： 在电子封装的基板和长度大于宽度的电路板之间产生焊接连接。 焊接连接是通过将功率或接地连接的焊球定位得彼此靠近而形成的，使得当回流到电路板时，焊球组合，产生更大的焊接连接。 然而，信号焊球保持分离。 特定接合焊盘上的电源或接地焊球通过可拆卸焊接掩模的一部分彼此分开，以在焊球附着到电子封装期间使焊球保持球形。 然而，它在回流到电路板之前被去除，从而在电子封装和电路板之间产生更大的更长的焊接连接。

公开(公告)号：US20060109121A1

公开(公告)日：2006-05-25

申请号：US10993895

申请日：2004-11-19

申请人： Terry Dishongh ,  Tom Pearson ,  Dudi Amir

发明人： Terry Dishongh ,  Tom Pearson ,  Dudi Amir

IPC分类号： G08B13/14

CPC分类号： H05K1/0266 ,  G06K19/07749 ,  G06K19/07758 ,  H05K1/16 ,  H05K2201/10098

摘要： A radio frequency identification (RFID) device may incorporate an existing feature on a substrate as an antenna. In some embodiments, the electromagnetic interference (EMI) guard ring on a substrate may form the antenna for the RFID device.

摘要翻译： 射频识别（RFID）设备可以将基板上的现有特征结合为天线。 在一些实施例中，衬底上的电磁干扰（EMI）保护环可以形成用于RFID设备的天线。

公开(公告)号：US20050134507A1

公开(公告)日：2005-06-23

申请号：US10746462

申请日：2003-12-23

申请人： Terrance Dishongh ,  Weston Roth ,  Damion Searls ,  Tom Pearson

发明人： Terrance Dishongh ,  Weston Roth ,  Damion Searls ,  Tom Pearson

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L21/8238 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/66 ,  H01Q1/40

CPC分类号： H01L23/66 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3731 ,  H01L2223/6677 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01Q1/40 ,  H01L2924/00 ,  H01L2224/05599

摘要： Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.

摘要翻译： 嵌入在陶瓷材料（如低温共烧陶瓷）中的天线的制造装置和方法。 这种陶瓷材料具有低的热膨胀系数，其减小了可能导致信号传输频率改变并从而影响适当的信号传输的伸缩应力。

公开(公告)号：US20050090041A1

公开(公告)日：2005-04-28

申请号：US10998307

申请日：2004-11-24

申请人： Terrance Dishongh ,  Tom Pearson

发明人： Terrance Dishongh ,  Tom Pearson

IPC分类号： H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K7/10 ,  H01L21/44

CPC分类号： H01L23/50 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/3442 ,  H05K7/1092 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.

摘要翻译： 提供电子组件，其具有在BGA焊球之间互连的电容器。 当BGA焊球焊接到主板上的电焊盘时，将电容器放置在母板上并焊接到BGA焊球。

公开(公告)号：US20050067178A1

公开(公告)日：2005-03-31

申请号：US10676546

申请日：2003-09-30

申请人： Tom Pearson ,  Terry Dishongh ,  Damion Searls

发明人： Tom Pearson ,  Terry Dishongh ,  Damion Searls

IPC分类号： H01L23/10 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K13/04 ,  H01L23/02 ,  H02G3/00

CPC分类号： H01L23/40 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0465

摘要： According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

摘要翻译： 根据本发明的一个方面，提供一种用于构造电子组件的电子组件和方法。 绝缘体将散热板或支撑板和多个支撑构件互连以形成散热器组件。 散热器组件与半导体封装一起放置在电路板上。 整个电路板被加热以将散热器组件和半导体封装焊接到电路板。 绝缘体将散热板和支撑构件热分离，使得热量不会从支撑构件传导到散热板，并且散热板和半导体封装可以以一步加热方式附接到电路板 处理。

公开(公告)号：US20050218035A1

公开(公告)日：2005-10-06

申请号：US10814528

申请日：2004-03-31

申请人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

发明人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

IPC分类号： H02H7/06 ,  H02P11/00 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/3494 ,  H05K3/303 ,  H05K2201/09127 ,  H05K2201/10325 ,  H05K2203/081 ,  H05K2203/082

摘要： A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.

摘要翻译： 盖可以设置在集成电路插座的铰接盖上，以被表面安装到印刷电路板。 在插入集成电路之前，盖可以保护插座。 也可以方便将插座表面安装到印刷电路板上。 它可能至少有两种方式。 盖可以通过在盖中提供一系列开口来促进对流加热。 盖也可以是红外透射的，使得来自表面安装的烘箱的红外辐射通过盖以加热插座。 结果，在一些实施例中，实现更好的回流并且可能导致更高的焊球可靠性。

公开(公告)号：US20050014419A1

公开(公告)日：2005-01-20

申请号：US10918081

申请日：2004-08-12

申请人： Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

发明人： Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

IPC分类号： H05K1/14 ,  H05K3/34 ,  H01R9/22

CPC分类号： H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

摘要： A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

摘要翻译： 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US20060049479A1

公开(公告)日：2006-03-09

申请号：US10937080

申请日：2004-09-08

申请人： Tom Pearson ,  Terry Dishongh ,  David Amir ,  Damion Searls

发明人： Tom Pearson ,  Terry Dishongh ,  David Amir ,  Damion Searls

IPC分类号： H01L29/00

CPC分类号： H01L23/66 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/00

摘要： A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

摘要翻译： 描述了用于半导体管芯封装的侧装式电容器。 在一个实施例中，基板具有可以附接有IC（集成电路）的裸片侧和与裸片侧相邻的边。 旁路电容器连接到封装衬底边缘。

公开(公告)号：US06747873B1

公开(公告)日：2004-06-08

申请号：US10387654

申请日：2003-03-12

申请人： Damion Searls ,  Tom Pearson ,  James Jackson

发明人： Damion Searls ,  Tom Pearson ,  James Jackson

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

摘要翻译： 公开了通道散热装置和制造方法的许多实施例。 在一个实施例中，通道散热装置包括具有散热面和基本上相对的安装表面的基部以及限定在基部中的至少一个通道，其中所述至少一个通道从所述耗散表面延伸到所述安装表面 。

公开(公告)号：US06906921B2

公开(公告)日：2005-06-14

申请号：US10756703

申请日：2004-01-12

申请人： Damion Searls ,  Tom Pearson ,  James Jackson

发明人： Damion Searls ,  Tom Pearson ,  James Jackson

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

摘要翻译： 公开了通道散热装置和制造方法的许多实施例。 在一个实施例中，通道散热装置包括具有耗散表面和基本上相对的安装表面的基部以及限定在基部中的至少一个通道，其中所述至少一个通道从所述耗散表面延伸到所述安装表面 。