公开(公告)号：US20050067178A1

公开(公告)日：2005-03-31

申请号：US10676546

申请日：2003-09-30

Applicant: Tom Pearson ,  Terry Dishongh ,  Damion Searls

Inventor： Tom Pearson ,  Terry Dishongh ,  Damion Searls

IPC: H01L23/10 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K13/04 ,  H01L23/02 ,  H02G3/00

CPC classification number: H01L23/40 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0465

Abstract: According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

Abstract translation: 根据本发明的一个方面，提供一种用于构造电子组件的电子组件和方法。 绝缘体将散热板或支撑板和多个支撑构件互连以形成散热器组件。 散热器组件与半导体封装一起放置在电路板上。 整个电路板被加热以将散热器组件和半导体封装焊接到电路板。 绝缘体将散热板和支撑构件热分离，使得热量不会从支撑构件传导到散热板，并且散热板和半导体封装可以以一步加热方式附接到电路板 处理。

公开(公告)号：US20060049479A1

公开(公告)日：2006-03-09

申请号：US10937080

申请日：2004-09-08

Applicant: Tom Pearson ,  Terry Dishongh ,  David Amir ,  Damion Searls

Inventor： Tom Pearson ,  Terry Dishongh ,  David Amir ,  Damion Searls

IPC: H01L29/00

CPC classification number: H01L23/66 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Abstract translation: 描述了用于半导体管芯封装的侧装式电容器。 在一个实施例中，基板具有可以附接有IC（集成电路）的裸片侧和与裸片侧相邻的边。 旁路电容器连接到封装衬底边缘。

公开(公告)号：US07057114B2

公开(公告)日：2006-06-06

申请号：US10612872

申请日：2003-07-07

Applicant: Terry Dishongh ,  Prateek Dujari ,  Bin Lian ,  Damion Searls

Inventor： Terry Dishongh ,  Prateek Dujari ,  Bin Lian ,  Damion Searls

IPC: H05K1/00

CPC classification number: H05K1/167 ,  H01L23/49827 ,  H01L23/642 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4046 ,  H05K2201/0187 ,  H05K2201/0323 ,  H05K2201/09536 ,  H01L2924/00

Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Abstract translation: 电路板包括两个平面。 A通道跨越平面，并且阻抗分量被放置在通孔中。 阻抗分量耦合到两个平面。 阻抗分量在平面之间提供阻抗，而不使用部件的迹线或手工焊接。

公开(公告)号：US06903271B2

公开(公告)日：2005-06-07

申请号：US10676546

申请日：2003-09-30

Applicant: Tom E. Pearson ,  Terry Dishongh ,  Damion Searls

Inventor： Tom E. Pearson ,  Terry Dishongh ,  Damion Searls

IPC: H01L23/10 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K13/04 ,  H01L23/02

CPC classification number: H01L23/40 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0465

Abstract: According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

Abstract translation: 根据本发明的一个方面，提供一种用于构造电子组件的电子组件和方法。 绝缘体将散热板或支撑板和多个支撑构件互连以形成散热器组件。 散热器组件与半导体封装一起放置在电路板上。 整个电路板被加热以将散热器组件和半导体封装焊接到电路板。 绝缘体将散热板和支撑构件热分离，使得热量不会从支撑构件传导到散热板，并且散热板和半导体封装可以以一步加热方式附接到电路板 处理。

公开(公告)号：US06775122B1

公开(公告)日：2004-08-10

申请号：US09473128

申请日：1999-12-28

Applicant: Terry Dishongh ,  Prateek Dujari ,  Bin Lian ,  Damion Searls

Inventor： Terry Dishongh ,  Prateek Dujari ,  Bin Lian ,  Damion Searls

IPC: H01G432

CPC classification number: H05K1/167 ,  H01L23/49827 ,  H01L23/642 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4046 ,  H05K2201/0187 ,  H05K2201/0323 ,  H05K2201/09536 ,  H01L2924/00

Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

公开(公告)号：US20050134507A1

公开(公告)日：2005-06-23

申请号：US10746462

申请日：2003-12-23

Applicant: Terrance Dishongh ,  Weston Roth ,  Damion Searls ,  Tom Pearson

Inventor： Terrance Dishongh ,  Weston Roth ,  Damion Searls ,  Tom Pearson

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/8238 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/66 ,  H01Q1/40

CPC classification number: H01L23/66 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3731 ,  H01L2223/6677 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01Q1/40 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.

Abstract translation: 嵌入在陶瓷材料（如低温共烧陶瓷）中的天线的制造装置和方法。 这种陶瓷材料具有低的热膨胀系数，其减小了可能导致信号传输频率改变并从而影响适当的信号传输的伸缩应力。

公开(公告)号：US06906921B2

公开(公告)日：2005-06-14

申请号：US10756703

申请日：2004-01-12

Applicant: Damion Searls ,  Tom Pearson ,  James Jackson

Inventor： Damion Searls ,  Tom Pearson ,  James Jackson

IPC: H01L23/467 ,  H05K7/20

CPC classification number: H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract translation: 公开了通道散热装置和制造方法的许多实施例。 在一个实施例中，通道散热装置包括具有耗散表面和基本上相对的安装表面的基部以及限定在基部中的至少一个通道，其中所述至少一个通道从所述耗散表面延伸到所述安装表面 。

公开(公告)号：US06747873B1

公开(公告)日：2004-06-08

申请号：US10387654

申请日：2003-03-12

Applicant: Damion Searls ,  Tom Pearson ,  James Jackson

Inventor： Damion Searls ,  Tom Pearson ,  James Jackson

IPC: H05K720

CPC classification number: H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract translation: 公开了通道散热装置和制造方法的许多实施例。 在一个实施例中，通道散热装置包括具有散热面和基本上相对的安装表面的基部以及限定在基部中的至少一个通道，其中所述至少一个通道从所述耗散表面延伸到所述安装表面 。

公开(公告)号：US10251273B2

公开(公告)日：2019-04-02

申请号：US12231965

申请日：2008-09-08

Applicant: Damion Searls ,  Weston C. Roth ,  Margaret D. Ramirez ,  James D. Jackson ,  Rainer E. Thomas ,  Charles A. Gealer

Inventor： Damion Searls ,  Weston C. Roth ,  Margaret D. Ramirez ,  James D. Jackson ,  Rainer E. Thomas ,  Charles A. Gealer

IPC: H05K7/00 ,  H01L21/56 ,  H01L23/48 ,  H05K1/18 ,  H01L23/498 ,  H01L25/03 ,  H01L23/552 ,  H01L23/00 ,  H05K3/28

Abstract: Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

公开(公告)号：US20070092689A1

公开(公告)日：2007-04-26

申请号：US11561068

申请日：2006-11-17

Applicant: James Jackson ,  Terrance Dishongh ,  Damion Searls

Inventor： James Jackson ,  Terrance Dishongh ,  Damion Searls

IPC: B32B3/06 ,  G09G3/34 ,  B32B5/16

CPC classification number: G02F1/091 ,  G09F9/375 ,  Y10T428/24008 ,  Y10T428/25

Abstract: A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.

Abstract translation: 一种制造柔性显示器的方法，所述方法包括选择第一柔性片和第二柔性片; 以及在所述第一柔性片和所述第二柔性片之间形成具有磁性可控反射率的多个磁性显示元件。 在一些实施例中，显示器包括具有磁可控反射率的像素。 像素形成在一对柔性非导电片之间。 每个磁性可控像素包括位于柔性非导电片之间的柔性环。 每个磁性可控像素还包括位于柔性环内的磁性颗粒。 磁性颗粒相对于柔性非导电片的位置确定像素的反射率。 显示器特别适用于便携式电子设备的使用。