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    ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT
    2.
    发明申请
    ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT 有权
    具有热分离支持的电子组件

    公开(公告)号：US20050067178A1

    公开(公告)日：2005-03-31

    申请号：US10676546

    申请日：2003-09-30

    申请人： Tom Pearson ,  Terry Dishongh ,  Damion Searls

    发明人： Tom Pearson ,  Terry Dishongh ,  Damion Searls

    IPC分类号： H01L23/10 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K13/04 ,  H01L23/02 ,  H02G3/00

    CPC分类号： H01L23/40 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0465

    摘要： According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

    摘要翻译： 根据本发明的一个方面，提供一种用于构造电子组件的电子组件和方法。 绝缘体将散热板或支撑板和多个支撑构件互连以形成散热器组件。 散热器组件与半导体封装一起放置在电路板上。 整个电路板被加热以将散热器组件和半导体封装焊接到电路板。 绝缘体将散热板和支撑构件热分离，使得热量不会从支撑构件传导到散热板，并且散热板和半导体封装可以以一步加热方式附接到电路板 处理。

    Electronic assembly with thermally separated support
    4.
    发明授权
    Electronic assembly with thermally separated support 有权
    具有热分离支架的电子组件

    公开(公告)号：US06903271B2

    公开(公告)日：2005-06-07

    申请号：US10676546

    申请日：2003-09-30

    申请人： Tom E. Pearson ,  Terry Dishongh ,  Damion Searls

    发明人： Tom E. Pearson ,  Terry Dishongh ,  Damion Searls

    IPC分类号： H01L23/10 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K13/04 ,  H01L23/02

    CPC分类号： H01L23/40 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3447 ,  H05K13/0465

    摘要： According to one aspect of the invention, an electronic assembly and a method for constructing an electronic assembly are provided. Insulating bodies interconnect a heat sink plate, or support plate, and a plurality of support members to form a heat sink assembly. The heat sink assembly is placed on a circuit board along with a semiconductor package. The entire circuit board is heated to solder the heat sink assembly and the semiconductor package to the circuit board. The insulating bodies thermally separate the heat sink plate and the support members so that heat is not conducted from the support members to the heat sink plate, and the heat sink plate and semiconductor package may be attached to the circuit board in a one-step heating process.

    摘要翻译： 根据本发明的一个方面，提供一种用于构造电子组件的电子组件和方法。 绝缘体将散热板或支撑板和多个支撑构件互连以形成散热器组件。 散热器组件与半导体封装一起放置在电路板上。 整个电路板被加热以将散热器组件和半导体封装焊接到电路板。 绝缘体将散热板和支撑构件热分离，使得热量不会从支撑构件传导到散热板，并且散热板和半导体封装可以以一步加热方式附接到电路板 处理。

    Infrared transmissive integrated circuit socket cap
    6.
    发明申请
    Infrared transmissive integrated circuit socket cap 审中-公开
    红外透射集成电路插座盖

    公开(公告)号：US20050218035A1

    公开(公告)日：2005-10-06

    申请号：US10814528

    申请日：2004-03-31

    申请人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

    发明人： Tom Pearson ,  Robert Martinson ,  Terry Dishongh

    IPC分类号： H02H7/06 ,  H02P11/00 ,  H05K3/30 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  H05K3/303 ,  H05K2201/09127 ,  H05K2201/10325 ,  H05K2203/081 ,  H05K2203/082

    摘要： A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.

    摘要翻译： 盖可以设置在集成电路插座的铰接盖上，以被表面安装到印刷电路板。 在插入集成电路之前，盖可以保护插座。 也可以方便将插座表面安装到印刷电路板上。 它可能至少有两种方式。 盖可以通过在盖中提供一系列开口来促进对流加热。 盖也可以是红外透射的，使得来自表面安装的烘箱的红外辐射通过盖以加热插座。 结果，在一些实施例中，实现更好的回流并且可能导致更高的焊球可靠性。

    Monitoring handrails to reduce falls
    8.
    发明授权
    Monitoring handrails to reduce falls 有权
    监控扶手以减少跌倒

    公开(公告)号：US08205735B2

    公开(公告)日：2012-06-26

    申请号：US12214092

    申请日：2008-06-17

    申请人： Julie Behan ,  Terry Dishongh ,  Karol O'Donovan ,  Adrian Burns ,  Simon Roberts

    发明人： Julie Behan ,  Terry Dishongh ,  Karol O'Donovan ,  Adrian Burns ,  Simon Roberts

    IPC分类号： B66B29/04 ,  G01N15/06

    CPC分类号： B66B29/005 ,  E04F11/1802 ,  E04F2011/1872

    摘要： A monitor, which may be closely associated with a handrail, may determine the amount of force applied to the handrail. The monitor may also determine the pattern in which force is applied to the handrail in order to assess how the user is contacting the handrail. The user's application of force to the handrail can be monitored along the course of movement along the handrail and may be compared to historical usage patterns.

    摘要翻译： 可能与扶手密切相关的监视器可以确定施加到扶手的力的量。 监视器还可以确定施加到扶手的力的模式，以便评估用户如何与扶手接触。 可以沿着扶手的移动过程来监视用户对扶手的施加力，并且可以将其与历史使用模式进行比较。

    Single point location tracking for a mobile device in a communication network
    9.
    发明授权
    Single point location tracking for a mobile device in a communication network 有权
    通信网络中移动设备的单点位置跟踪

    公开(公告)号：US08204515B2

    公开(公告)日：2012-06-19

    申请号：US13178741

    申请日：2011-07-08

    申请人： Terry Dishongh ,  Kevin Rhodes

    发明人： Terry Dishongh ,  Kevin Rhodes

    IPC分类号： H04W24/00

    CPC分类号： G01S5/0252 ,  G01S1/68

    摘要： Briefly, in accordance with one or more embodiments, the location of a mobile device within a floor plan of a building or the like environment may be determined using a single transmission link between transceiver and the mobile device. A bit error rate value and a receiver signal strength indication value are measured for the present location of the mobile device in the floor plan. The coordinates where the mobile device is located may be determined by looking up the measured bit error rate value and the received signal strength indication value in a lookup table. Due to environmental factors of the floor plan, the combination of the bit error rate value and the received signal strength indication value corresponds to a unique coordinate location in the floor plan from which the location of the mobile device may be determined.

    摘要翻译： 简而言之，根据一个或多个实施例，可以使用收发器和移动设备之间的单个传输链路来确定移动设备在建筑物的楼层平面图等环境中的位置。 在平面图中针对移动设备的当前位置测量误码率值和接收机信号强度指示值。 可以通过在查找表中查找测量的比特误码率值和接收的信号强度指示值来确定移动设备所在的坐标。 由于平面图的环境因素，误码率值和接收信号强度指示值的组合对应于可以确定移动设备的位置的平面图中的唯一坐标位置。

    Dynamic movement analysis system
    10.
    发明申请
    Dynamic movement analysis system 审中-公开
    动态运动分析系统

    公开(公告)号：US20100076347A1

    公开(公告)日：2010-03-25

    申请号：US12284792

    申请日：2008-09-25

    申请人： Michael J. McGrath ,  Terry Dishongh

    发明人： Michael J. McGrath ,  Terry Dishongh

    IPC分类号： A61B5/103

    CPC分类号： A61B5/1038 ,  A63B21/4037 ,  A63B24/0075 ,  A63B69/0053 ,  A63B71/0622 ,  A63B2208/0204 ,  A63B2220/51 ,  A63B2225/20 ,  G06F19/3481

    摘要： A movement analysis system may use a force sensing mat to record a pattern of applied force from the user's feet as the user undergoes a series of directed movements. The movements may be directed by the system through indicator lights in the mat and/or directions provided on a display screen. The user's response to these directions may be recorded and analyzed to derive indications of the best exercise regime based on the user's capabilities.

    摘要翻译： 运动分析系统可以使用力感测垫来在用户经历一系列定向运动时记录来自用户的脚的施加力的图案。 移动可以由系统通过垫子中的指示灯和/或显示屏幕上提供的方向来引导。 可以记录和分析用户对这些方向的响应，以基于用户的能力导出最佳运动方式的指示。