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    Soldered heat sink anchor and method of use
    3.
    发明授权
    Soldered heat sink anchor and method of use 失效

    公开(公告)号：US06734371B2

    公开(公告)日：2004-05-11

    申请号：US09964812

    申请日：2001-09-28

    申请人： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    发明人： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    IPC分类号： H05K116

    CPC分类号： H05K3/308 ,  H01L23/4093 ,  H01L2224/16

    摘要： An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

    Method and apparatus for facilitating detection of solder opens of SMT components
    4.
    发明授权
    Method and apparatus for facilitating detection of solder opens of SMT components 失效
    便于检测SMT部件的焊料开口的方法和装置

    公开(公告)号：US5966020A

    公开(公告)日：1999-10-12

    申请号：US741053

    申请日：1996-10-30

    申请人： Thomas Rampone ,  George Arrigotti

    发明人： Thomas Rampone ,  George Arrigotti

    IPC分类号： G01R31/04 ,  H05K1/02 ,  H05K1/11 ,  G01R31/26

    CPC分类号： G01R31/048 ,  H05K1/111 ,  H05K1/0268 ,  H05K2201/09663 ,  H05K2201/10325 ,  H05K2201/10689 ,  Y02P70/611

    摘要： A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and second mounting pads coupled to a single electrical contact. The mounting pads are further coupled to corresponding access pads so that a first access pad is coupled to the first mounting pad while a second access pad is coupled to the second mounting pad. Electrical testing of the single electrical contact is possible through the completed circuit between the two access pads.

    摘要翻译： 分离焊盘焊盘图案，其被配置为便于对表面安装技术部件的单个电触头与印刷电路板之间的互连进行电气测试。 分离焊盘焊盘图案包括至少一个分离安装焊盘，其至少包括耦合到单个电触头的第一和第二安装焊盘。 安装垫还被耦合到对应的接入垫，使得第一接入焊盘耦合到第一安装焊盘，而第二接入焊盘联接到第二安装焊盘。 通过两个通路板之间的完整电路可以对单个电气触点进行电气测试。

    Zero insertion force heat-activated retention pin
    5.
    发明授权
    Zero insertion force heat-activated retention pin 有权
    零插入力热启动保持针

    公开(公告)号：US06764325B2

    公开(公告)日：2004-07-20

    申请号：US10152144

    申请日：2002-05-20

    申请人： George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

    发明人： George Arrigotti ,  Raiyomand Aspandiar ,  Christopher D. Combs ,  Tom E. Pearson

    IPC分类号： H01R1362

    CPC分类号： H05K3/306 ,  H01R4/01 ,  H01R12/7035 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10856 ,  H05K2203/306

    摘要： The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

    摘要翻译： 本发明涉及用于最小化载体基底和与其连接的部件之间的开放电连接的装置和方法，其由于暴露于将部件固定到基板而遇到的增加的热分布而由于在基板中的下垂而发生。 零插入力热活化固定销在升温过程中膨​​胀或弯曲，在印刷电路板上产生向上的力。 该向上的力抵抗向下的下垂力，并使载体基板保持与所连接部件的共面关系。

    Soldered heat sink anchor and method of use
    7.
    发明授权
    Soldered heat sink anchor and method of use 失效
    焊接散热器锚和使用方法

    公开(公告)号：US07183496B2

    公开(公告)日：2007-02-27

    申请号：US10843408

    申请日：2004-05-11

    申请人： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    发明人： George Arrigotti ,  Tom E. Pearson ,  Raiyomand F. Aspandiar ,  Christopher D. Combs

    IPC分类号： H05K1/16

    CPC分类号： H05K3/308 ,  H01L23/4093 ,  H01L2224/16

    摘要： An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

    摘要翻译： 提供一种用于将组件固定到印刷电路板的锚定机构和方法。 锚固机构可以包括环，从环延伸的第一腿和从环延伸的第二腿。 第一支腿可以穿过印刷电路板的第一孔，并且包括可插入第一孔中的压缩部分，并且在穿过第一孔之后膨胀。 第一腿部的可压缩部分可以支撑锚定机构和第一孔之间的焊料。 类似地，第二支腿可以安装在印刷电路板的第二孔中，并且包括可插入到第二孔中的可压缩部分，并在通过第二孔之后膨胀。 第二腿的可压缩部分可以支撑锚定机构和第二孔之间的焊料。