公开(公告)号：US08446726B2

公开(公告)日：2013-05-21

申请号：US12914171

申请日：2010-10-28

申请人： Ralf Schloerke ,  Thilo Stolze

发明人： Ralf Schloerke ,  Thilo Stolze

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/24 ,  H01L23/10 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48132 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T29/41 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.

摘要翻译： 功率半导体模块包括在其顶侧具有密封环的模块壳体。 与模块壳体配合的密封环和连接到功率半导体模块的印刷电路板密封地密封模块壳体顶侧的馈通位置，以通过功率半导体模块的电端子供电。 在密封环的模块的底侧上，密封环密封模块壳体的底侧。

公开(公告)号：US08338932B2

公开(公告)日：2012-12-25

申请号：US12970342

申请日：2010-12-16

申请人： Georg Borghoff ,  Thilo Stolze

发明人： Georg Borghoff ,  Thilo Stolze

IPC分类号： H01L23/24

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor module includes a package having a first package portion and a second package portion. The side of the first package portion facing the second package portion has an anchoring element with a first recess. The second package portion includes a second recess with an indentation which receives the anchoring element. To produce a mechanically firm connection between the first package portion and the second package portion, a plug-in element is inserted in the first recess and the second recess. The plug-in element displaces the anchoring element transversely with respect to the plug-in direction, causing the anchoring element to engage the indentation so that a form-fit connection is produced between the first package portion and the second package portion. The plug-in element prevents the anchoring element from disengaging the indentation.

摘要翻译： 功率半导体模块包括具有第一封装部分和第二封装部分的封装。 面向第二包装部分的第一包装部分的侧面具有带有第一凹部的锚定元件。 第二包装部分包括具有凹陷的第二凹部，其接纳锚定元件。 为了在第一包装部分和第二包装部分之间产生机械牢固的连接，插入元件插入第一凹部和第二凹部中。 插入元件相对于插入方向横向地移动锚定元件，使得锚定元件接合凹陷，使得在第一包装部分和第二包装部分之间产生形状配合连接。 插件元件防止锚固元件脱离凹槽。

公开(公告)号：US08159822B2

公开(公告)日：2012-04-17

申请号：US12789251

申请日：2010-05-27

申请人： Peter Kanschat ,  Olaf Hohlfeld ,  Thilo Stolze

发明人： Peter Kanschat ,  Olaf Hohlfeld ,  Thilo Stolze

IPC分类号： H05K7/20

CPC分类号： H01L23/24 ,  H01L23/3735 ,  H01L23/4006 ,  H01L24/48 ,  H01L25/072 ,  H01L2023/4062 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.

摘要翻译： 本发明涉及一种功率半导体模块，其包括模块壳体和至少一个填充有至少一个功率半导体芯片的衬底。 模块壳体具有在垂直方向上与底侧间隔开的底侧和顶侧。 此外，衬底具有背向模块壳体内部的底侧。 衬底布置在模块壳体的开口中，其构造在其底侧，并通过弹性粘合剂附接到模块壳体，用于相对于模块壳体平行于垂直方向的衬底的运动自由。 在功率半导体模块的非安装状态下，基板相对于模块壳体呈现静止位置。 为了使基板从平行于垂直方向的静止位置偏转，施加0.1N至100N / mm的偏转力。

公开(公告)号：US08134837B2

公开(公告)日：2012-03-13

申请号：US12777656

申请日：2010-05-11

申请人： Olaf Hohlfeld ,  Peter Kanschat ,  Thilo Stolze

发明人： Olaf Hohlfeld ,  Peter Kanschat ,  Thilo Stolze

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L23/3107 ,  H01L25/072 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.

摘要翻译： 功率半导体模块系统包括功率半导体模块，散热器和至少一个紧固件。 功率半导体模块包括具有第一热接触表面的底侧，散热器包括具有第二热接触表面的顶侧。 功率半导体模块通过至少一个紧固件与散热器结合。 功率半导体模块包括N1≥1的第一定位元件和散热器，第二定位元件的数量N2≥1。 第一定位元件中的每一个对应于第二定位元件中的一个并且与其形成一对。 功率半导体模块和散热器可相对于彼此对齐，使得当功率半导体模块安装在散热器上时，每对的两个定位元件互相配合。

公开(公告)号：US20100284153A1

公开(公告)日：2010-11-11

申请号：US12777656

申请日：2010-05-11

申请人： Olaf Hohlfeld ,  Peter Kanschat ,  Thilo Stolze

发明人： Olaf Hohlfeld ,  Peter Kanschat ,  Thilo Stolze

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/4006 ,  H01L23/3107 ,  H01L25/072 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.

摘要翻译： 功率半导体模块系统包括功率半导体模块，散热器和至少一个紧固件。 功率半导体模块包括具有第一热接触表面的底侧，散热器包括具有第二热接触表面的顶侧。 功率半导体模块通过至少一个紧固件与散热器结合。 功率半导体模块包括N1≥1的第一定位元件和散热器，第二定位元件的数量N2≥1。 第一定位元件中的每一个对应于第二定位元件中的一个并且与其形成一对。 功率半导体模块和散热器可相对于彼此对准，使得当功率半导体模块安装在散热器上时，每对的两个定位元件互相配合。

公开(公告)号：US20090021916A1

公开(公告)日：2009-01-22

申请号：US11780790

申请日：2007-07-20

申请人： Thilo Stolze

发明人： Thilo Stolze

IPC分类号： H05K7/14

CPC分类号： H01L23/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L23/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01068 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.

摘要翻译： 公开了半导体组件，功率半导体模块，壳体和用于组装功率半导体壳体的方法。 一个实施例提供了一种电绝缘基板，其具有内壳体，该内壳体具有盖和周边边缘，以及邻近周边边缘的侧面布置的至少一个压力元件。 压力元件弹性地联接到内壳体。

公开(公告)号：US20070202721A1

公开(公告)日：2007-08-30

申请号：US11682483

申请日：2007-03-06

申请人： Thilo Stolze ,  Richard Boettcher

发明人： Thilo Stolze ,  Richard Boettcher

IPC分类号： H01R13/648

CPC分类号： H01L23/32 ,  H01L23/4006 ,  H01L24/48 ,  H01L25/072 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element (18, 19) which is permanently connected to the power semiconductor module. When mounted, the pressure element (18) presses the heat-dissipation contact surface (16) against the cooling element (17).

摘要翻译： 功率半导体模块具有用于与冷却元件（17）的导热连接的散热接触面（16）。 该模块可以简单，经济高效地可靠地固定到冷却元件，以通过永久连接到功率半导体模块的至少一个压力元件（18,19）将热量传导到后者。 当安装时，压力元件（18）将散热接触表面（16）压靠在冷却元件（17）上。

公开(公告)号：US06431259B1

公开(公告)日：2002-08-13

申请号：US09793352

申请日：2001-02-26

申请人： Horst Hellbrück ,  Ralf Jörke ,  Konstantin Kanelis ,  Manfred Loddenkötter ,  Thilo Stolze

发明人： Horst Hellbrück ,  Ralf Jörke ,  Konstantin Kanelis ,  Manfred Loddenkötter ,  Thilo Stolze

IPC分类号： F28F700

摘要： In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.

公开(公告)号：US08215008B2

公开(公告)日：2012-07-10

申请号：US13006588

申请日：2011-01-14

申请人： Olaf Kirsch ,  Thilo Stolze

发明人： Olaf Kirsch ,  Thilo Stolze

IPC分类号： H05K3/30

CPC分类号： H01L23/049 ,  H01L23/3735 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2076 ,  H01L2924/3011 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/48

摘要： A method for producing a housing part for a power semiconductor module includes providing a connecting lug having a lower end with a foot region, providing a housing having a side wall with a lead-in bevel, and inserting the connecting lug into the lead-in bevel so that the foot region projects inward into an interior of the housing. The method further includes encapsulating at least a portion of the foot region of the connecting lug inserted into the lead-in bevel with a first plastic to produce a positively locking first connection between the connecting lug and the side wall.

摘要翻译： 一种用于制造用于功率半导体模块的壳体部件的方法，包括：提供具有下端与脚部区域的连接凸耳，提供具有带有引入斜面的侧壁的壳体，以及将连接凸耳插入到引入部 斜面使得脚部区域向内突出到壳体的内部。 该方法还包括将插入到引入斜面中的连接凸耳的足部区域的至少一部分用第一塑料封装，以在连接凸耳和侧壁之间产生正向锁定的第一连接。

公开(公告)号：US20120106086A1

公开(公告)日：2012-05-03

申请号：US12914171

申请日：2010-10-28

申请人： Ralf Schloerke ,  Thilo Stolze

发明人： Ralf Schloerke ,  Thilo Stolze

IPC分类号： H05K7/20 ,  H01L21/02 ,  H05K7/00

CPC分类号： H01L23/24 ,  H01L23/10 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48132 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T29/41 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.

摘要翻译： 功率半导体模块包括在其顶侧具有密封环的模块壳体。 与模块壳体配合的密封环和连接到功率半导体模块的印刷电路板密封地密封模块壳体顶侧的馈通位置，以通过功率半导体模块的电端子供电。 在密封环的模块的底侧上，密封环密封模块壳体的底侧。