公开(公告)号：US06431259B1

公开(公告)日：2002-08-13

申请号：US09793352

申请日：2001-02-26

申请人： Horst Hellbrück ,  Ralf Jörke ,  Konstantin Kanelis ,  Manfred Loddenkötter ,  Thilo Stolze

发明人： Horst Hellbrück ,  Ralf Jörke ,  Konstantin Kanelis ,  Manfred Loddenkötter ,  Thilo Stolze

IPC分类号： F28F700

摘要： In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.