Invention Grant
US08446726B2 Semiconductor module having an insert and method for producing a semiconductor module having an insert
有权
具有插入件的半导体模块和用于制造具有插入件的半导体模块的方法
- Patent Title: Semiconductor module having an insert and method for producing a semiconductor module having an insert
- Patent Title (中): 具有插入件的半导体模块和用于制造具有插入件的半导体模块的方法
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Application No.: US12914171Application Date: 2010-10-28
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Publication No.: US08446726B2Publication Date: 2013-05-21
- Inventor: Ralf Schloerke , Thilo Stolze
- Applicant: Ralf Schloerke , Thilo Stolze
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; F28F7/00
Abstract:
A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.
Public/Granted literature
- US20120106086A1 SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AN INSERT Public/Granted day:2012-05-03
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