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公开(公告)号:US12062629B2
公开(公告)日:2024-08-13
申请号:US15691941
申请日:2017-08-31
申请人: Taiwan Semiconductor Manufacturing Company Limited , The University of California, Los Angeles (UCLA)
发明人: Huan-Neng Chen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Wen-Shiang Liao , Yanghyo Kim
IPC分类号: H01L23/66 , G02B6/10 , G02B6/42 , G02B6/43 , G02F1/01 , G02F1/025 , H01L23/552 , H01P3/08 , H01P3/16 , H04B10/40
CPC分类号: H01L23/66 , G02B6/102 , G02B6/4274 , G02B6/43 , G02F1/011 , G02F1/0121 , G02F1/025 , H01L23/552 , H01P3/081 , H01P3/16 , H04B10/40
摘要: Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.
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公开(公告)号:US11509346B2
公开(公告)日:2022-11-22
申请号:US17378956
申请日:2021-07-19
发明人: Huan-Neng Chen , Chewn-Pu Jou , Feng-Wei Kuo , Lan-Chou Cho , William Wu Shen
摘要: A transceiver disposed on a first die in a bidirectional differential die-to-die communication system is disclosed. The transceiver includes a transmission section configured to modulate a first data onto a carrier signal having a first frequency for transmission via a bidirectional differential transmission line; and a reception section configured to receive signals from the bidirectional differential transmission line, the reception section including a filter configured to pass frequencies within a first passband that includes a second frequency, the first frequency being outside of the first passband. According to some embodiments, the reception section is configured to receive, via the bidirectional differential transmission line, modulated data at the second frequency at a same time that the transmission section transmits the modulated data at the first frequency.
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公开(公告)号:US10923417B2
公开(公告)日:2021-02-16
申请号:US15897272
申请日:2018-02-15
发明人: Wen-Shiang Liao , Chih-Hang Tung , Chen-Hua Yu , Chewn-Pu Jou , Feng Wei Kuo
IPC分类号: H01L23/31 , H01L23/522 , H01L49/02 , H01L23/00 , H01L21/683 , H01L23/64 , H01L23/66
摘要: Among other things, a method of fabricating an integrated electronic device package is described. First trace portions of an electrically conductive trace are formed on an electrically insulating layer of a package structure, and vias of the conductive trace are formed in a sacrificial layer disposed on the electrically insulating layer. The sacrificial layer is removed, and a die is placed above the electrically insulating layer. Molding material is formed around exposed surfaces of the die and exposed surfaces of the vias, and a magnetic structure is formed within the layer of molding material. Second trace portions of the electrically conductive trace are formed above the molding material and the magnetic structure. The electrically conductive trace and the magnetic structure form an inductor. The electrically conductive trace may have a coil shape surrounding the magnetic structure. The die may be positioned between portions of the inductor.
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公开(公告)号:US09972995B2
公开(公告)日:2018-05-15
申请号:US14864971
申请日:2015-09-25
发明人: Chewn-Pu Jou , Huan-Neng Chen , Chien-Jung Wang
CPC分类号: H02H7/16 , G11C5/141 , Y10T307/766
摘要: A method includes charging a capacitor connected to an input node, gradually decreasing an output voltage at an output node, and electrically connecting the input node to the output node. A circuit that performs the method is also disclosed. A system that includes the circuit is also disclosed.
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公开(公告)号:US09899991B2
公开(公告)日:2018-02-20
申请号:US15600891
申请日:2017-05-22
发明人: Chewn-Pu Jou , Huan-Neng Chen , Lan-Chou Cho
CPC分类号: H03K3/0322 , H03B5/1212 , H03B5/1228 , H03B5/1243 , H03B5/1265 , H03B5/1296 , H03J2200/10 , H03L7/00 , H03L7/087 , H03L7/0995
摘要: A circuit includes a first and second oscillator, a first and second phase comparator, and a control unit. The first and second oscillators are configured to respectively generate a first and second oscillating signal. The first and second phase comparators are connected between the first and second oscillators. The first phase comparator is configured to generate a first phase error signal according to a first signal associated with the first oscillating signal and a delayed version of a second signal associated with the second oscillating signal. The second phase comparator is configured to generate a second phase error signal according to the second signal and a delayed version of the first signal. The control unit is connected between the first and second phase comparators and configured to generate one of a tuning signal and a pulse signal based on the difference between the first and second phase error signals.
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公开(公告)号:US09761553B2
公开(公告)日:2017-09-12
申请号:US13655695
申请日:2012-10-19
发明人: Chewn-Pu Jou , Chuei-Tang Wang , Fu-Lung Hsueh
IPC分类号: H01F5/00 , H01F27/28 , H01F27/29 , H01F17/06 , H01L27/08 , H01L25/00 , H01L23/00 , H01L23/64 , H01L25/16 , H01F17/00 , H01F41/04 , H01L23/31
CPC分类号: H01L24/18 , H01F17/0033 , H01F41/046 , H01L23/3128 , H01L23/645 , H01L24/20 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/24195 , H01L2924/14 , H01L2924/19042 , H01L2924/19105 , H01L2924/30107 , Y10T29/4902
摘要: Among other things, an inductor comprising a conductive trace and a method for forming the inductor are provided. The inductor comprises a magnetic structure, such as a ferrite core. A molding material, such as a dielectric, is formed around the magnetic structure. A conductive trace, comprising one or more conductive pillars interconnected by one or more upper interconnects and one or more lower interconnects, is formed around the magnetic structure to form the inductor. The conductive trace allows physical limitations associated with winding a wire to be avoided, and thus allows the inductor to be smaller than wire wound inductors. In one example, the inductor is formed within an integrated circuit package comprising an active device, such as an integrated circuit. In this way, the inductor can be connected to the integrated circuit within the integrated circuit package.
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公开(公告)号:US20170257082A1
公开(公告)日:2017-09-07
申请号:US15600891
申请日:2017-05-22
发明人: Chewn-Pu Jou , Huan-Neng Chen , Lan-Chou Cho
CPC分类号: H03K3/0322 , H03B5/1212 , H03B5/1228 , H03B5/1243 , H03B5/1265 , H03B5/1296 , H03J2200/10 , H03L7/00 , H03L7/087 , H03L7/0995
摘要: A circuit includes a first and second oscillator, a first and second phase comparator, and a control unit. The first and second oscillators are configured to respectively generate a first and second oscillating signal. The first and second phase comparators are connected between the first and second oscillators. The first phase comparator is configured to generate a first phase error signal according to a first signal associated with the first oscillating signal and a delayed version of a second signal associated with the second oscillating signal. The second phase comparator is configured to generate a second phase error signal according to the second signal and a delayed version of the first signal. The control unit is connected between the first and second phase comparators and configured to generate one of a tuning signal and a pulse signal based on the difference between the first and second phase error signals.
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公开(公告)号:US09502886B2
公开(公告)日:2016-11-22
申请号:US14046951
申请日:2013-10-05
CPC分类号: H02H7/16 , Y10T307/766
摘要: One or more systems and techniques for managing one or more electronic devices are provided. A determination is made that a first capacitor in a set of one or more capacitors has a defect. Responsive to the determination, the first capacitor is disabled, and a second capacitor is enabled.
摘要翻译: 提供了一种或多种用于管理一个或多个电子设备的系统和技术。 确定一组或多个电容器中的第一电容器具有缺陷。 响应于确定,第一电容器被禁用,并且第二电容器被使能。
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公开(公告)号:US09385731B2
公开(公告)日:2016-07-05
申请号:US14332548
申请日:2014-07-16
发明人: Feng Wei Kuo , Kuang-Kai Yen , Huan-Neng Chen , Lee Tsung Hsiung , Chewn-Pu Jou , Robert Bogdan Staszewski
CPC分类号: H03L7/093 , H03L7/095 , H03L2207/50
摘要: A phase-locked loop (PLL) is provided. The PLL comprises a clock adjuster configured to receive an initial clock signal having an initial frequency and a mode control signal. The clock adjuster is configured to modify the initial clock signal into a modified clock signal based on the mode control signal. The PLL is configured such that a loop bandwidth is equal to a specified bandwidth. When the modified clock signal is changed, a loop gain of a loop filter is adjusted such that the loop bandwidth is substantially equal to the specified bandwidth. When the modified clock signal is changed, an oscillator tuning word (OTW) signal is modified into a normalized OTW signal such that the loop bandwidth is substantially equal to the specified bandwidth.
摘要翻译: 提供锁相环(PLL)。 PLL包括被配置为接收具有初始频率和模式控制信号的初始时钟信号的时钟调整器。 时钟调整器被配置为基于模式控制信号将初始时钟信号修改为修改的时钟信号。 PLL被配置为使得环路带宽等于指定的带宽。 当修改的时钟信号改变时,调整环路滤波器的环路增益,使得环路带宽基本上等于指定的带宽。 当修改的时钟信号改变时,振荡器调谐字(OTW)信号被修改为归一化OTW信号,使得环路带宽基本上等于指定的带宽。
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公开(公告)号:US11869991B2
公开(公告)日:2024-01-09
申请号:US17189379
申请日:2021-03-02
发明人: Chih-Tsung Shih , Hau-Yan Lu , Felix Tsui , Stefan Rusu , Chewn-Pu Jou
IPC分类号: H01L31/0232 , H01L31/18 , H01L31/0352
CPC分类号: H01L31/02327 , H01L31/035281 , H01L31/18
摘要: A semiconductor device is provided. The semiconductor device includes a waveguide over a first dielectric layer. A first portion of the waveguide has a first width and a second portion of the waveguide has a second width larger than the first width. The semiconductor device includes a first doped semiconductor structure and a second doped semiconductor structure. The second portion of the waveguide is between the first doped semiconductor structure and the second doped semiconductor structure.
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