专利检索 ap:"The University of California, Los Angeles (UCLA)" 第 1 页

1.

发明授权
Multiband QAM interface for slab waveguide 有权

公开(公告)号：US12062629B2

公开(公告)日：2024-08-13

申请号：US15691941

申请日：2017-08-31

申请人： Taiwan Semiconductor Manufacturing Company Limited , The University of California, Los Angeles (UCLA)

发明人： Huan-Neng Chen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Wen-Shiang Liao , Yanghyo Kim

IPC分类号： H01L23/66 , G02B6/10 , G02B6/42 , G02B6/43 , G02F1/01 , G02F1/025 , H01L23/552 , H01P3/08 , H01P3/16 , H04B10/40

CPC分类号： H01L23/66 , G02B6/102 , G02B6/4274 , G02B6/43 , G02F1/011 , G02F1/0121 , G02F1/025 , H01L23/552 , H01P3/081 , H01P3/16 , H04B10/40

摘要： Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.

2.

发明申请
Multiband QAM Interface for Slab Waveguide 审中-公开

公开(公告)号：US20170365563A1

公开(公告)日：2017-12-21

申请号：US15691941

申请日：2017-08-31

申请人： Taiwan Semiconductor Manufacturing Company Limited , The University of California, Los Angeles (UCLA)

发明人： Huan-Neng Chen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Wen-Shiang Liao , Yanghyo Kim

IPC分类号： H01L23/66 , H01P3/16 , H01P3/08 , H04B10/40 , H01L23/552

CPC分类号： H01L23/66 , G02B6/102 , G02B6/4274 , G02B6/43 , G02F1/011 , G02F1/0121 , G02F1/025 , H01L23/552 , H01P3/081 , H01P3/16 , H04B10/40

摘要： Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.