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公开(公告)号：US10923439B2
公开(公告)日：2021-02-16
申请号：US16430267
申请日：2019-06-03
发明人： Tetsuyuki Tsuchida
IPC分类号： H01L23/15 , H01L23/00 , H01L21/48 , H01L23/498 , H01L23/64 , H05K1/09 , H01L23/12 , H05K1/16
摘要： A technique for making a glass core substrate that is less prone to cracking. A core substrate of the present invention includes a glass plate and a first conductor pattern provided on a first main surface of the glass plate. The first conductor pattern includes a first nickel plating layer that is provided on the first main surface of the glass plate and has a phosphorus content of 5 mass % or less and a first copper plating layer that is provided on the first nickel plating layer.
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公开(公告)号：US11516907B2
公开(公告)日：2022-11-29
申请号：US17122775
申请日：2020-12-15
发明人： Tetsuyuki Tsuchida
摘要： A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.
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公开(公告)号：US11756846B2
公开(公告)日：2023-09-12
申请号：US15930696
申请日：2020-05-13
发明人： Tetsuyuki Tsuchida
摘要： A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.
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公开(公告)号：US09883586B2
公开(公告)日：2018-01-30
申请号：US14808275
申请日：2015-07-24
IPC分类号： H05K1/09 , H05K3/10 , B23K1/19 , B23K1/00 , C25D7/00 , B23K35/26 , C22C13/02 , H05K3/24 , B23K1/008
CPC分类号： H05K1/09 , B23K1/0008 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K35/262 , C22C13/02 , C25D7/00 , H01L2924/0002 , H05K3/10 , H05K3/244 , H05K2201/0341 , H05K2203/043 , H01L2924/00
摘要： There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.
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公开(公告)号：US09572252B2
公开(公告)日：2017-02-14
申请号：US14444135
申请日：2014-07-28
IPC分类号： B05D5/12 , B28B19/00 , C23C18/00 , H01C17/06 , H05K3/00 , H05K1/09 , C23C18/36 , C23C18/44 , C23C18/16 , H05K3/24 , C23C18/50
CPC分类号： H05K1/09 , C23C18/1651 , C23C18/36 , C23C18/44 , C23C18/50 , H05K3/243 , H05K3/244 , H05K2201/032 , H05K2201/0776 , H05K2203/072
摘要： A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.
摘要翻译： 布线基板包括包含Cu或Cu合金的电极和形成在电极上的化学镀镍层和形成在化学镀镍层上的化学镀金层的镀膜。 化学镀镍层通过Ni，P，Bi和S的共沉淀形成，无电镀镍层的P含量为5质量％以上且小于10质量％，含量 的Bi为1质量ppm〜1000质量ppm，S为1质量ppm〜2000质量ppm，S含量与Bi（S / Bi）含量的质量比为更多 比1.0。
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