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公开(公告)号：US09954488B2
公开(公告)日：2018-04-24
申请号：US13837184
申请日：2013-03-15
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
CPC分类号： H03B5/1256 , H01F2021/125 , H03B5/1212 , H03B5/1228 , H03B2201/0216 , H03J3/20 , H03J3/22
摘要： A varainductor including a signal line disposed over a substrate. The varainductor further includes a first ground plane over the substrate, the first ground plane disposed on a first side of the signal line, and a second ground plane over the substrate, the second ground plane disposed on a second side of the signal line opposite the first side of the signal line. The varainductor further includes a first floating plane over the substrate, the first floating plane disposed between the first ground plane and the signal line, and a second floating plane over the substrate, the second floating plane disposed between the second ground plane and the signal line. The varainductor further includes an array of switches, the array of switches is configured to selectively connect the first ground plane to the first floating plane, and to selectively connect the second ground plane to the second floating plane.
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公开(公告)号：US09812251B2
公开(公告)日：2017-11-07
申请号：US15291520
申请日：2016-10-12
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： H03L7/06 , H01F27/42 , H01F21/12 , H01F27/28 , H01F27/40 , H03B5/12 , H03L7/099 , H01F29/02 , H01L23/522 , H01L23/528 , H01L23/58 , H01L27/06
CPC分类号： H01F27/42 , H01F21/12 , H01F27/2804 , H01F27/40 , H01F29/02 , H01F2021/125 , H01L23/5226 , H01L23/5227 , H01L23/528 , H01L23/585 , H01L27/0688 , H03B5/1212 , H03B5/1228 , H03B5/1256 , H03B2201/0216 , H03L7/099
摘要： A varainductor includes a spiral inductor, a ground ring, and a floating ring. The floating ring is disposed between the ground ring and the spiral inductor and surrounds a ring portion of the spiral inductor. A switching element, controlled by a switch control signal, selectively electrically connects the ground ring to the floating ring. The switching element includes one or more switches. The one or more switches are controlled by one or more signals of the switch control signal to adjust the inductance level of the varainductor.
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公开(公告)号：US09478344B2
公开(公告)日：2016-10-25
申请号：US14132301
申请日：2013-12-18
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
CPC分类号： H01F27/42 , H01F21/12 , H01F27/2804 , H01F27/40 , H01F29/02 , H01F2021/125 , H01L23/5226 , H01L23/5227 , H01L23/528 , H01L23/585 , H01L27/0688 , H03B5/1212 , H03B5/1228 , H03B5/1256 , H03B2201/0216 , H03L7/099
摘要： A varainductor includes a spiral inductor over a substrate, the spiral inductor comprising a ring portion. The varainductor further includes a ground ring over the substrate, the ground ring surrounding at least the ring portion of the spiral inductor and a floating ring over the substrate, the floating ring disposed between the ground ring and the spiral inductor. The varainductor further includes an array of switches, the array of switches is configured to selectively connect the ground ring to the floating ring.
摘要翻译： 变容器包括在衬底上的螺旋电感器，螺旋电感器包括环形部分。 所述变容器还包括在所述衬底上的接地环，所述接地环至少围绕所述螺旋电感器的所述环部分和所述衬底上的浮动环，所述浮动环设置在所述接地环和所述螺旋电感器之间。 变容器还包括开关阵列，开关阵列被配置为选择性地将接地环连接到浮动环。
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公开(公告)号：US10756672B2
公开(公告)日：2020-08-25
申请号：US15950585
申请日：2018-04-11
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
摘要： A varainductor includes a signal line, a ground plane, and a floating plane over a substrate. The ground plane is disposed on a side of the signal line, and the first floating plane is disposed between the ground plane and the signal line. An array of switches includes at least two switches configured to selectively electrically connect the ground plane to the floating plane.
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公开(公告)号：US09831832B2
公开(公告)日：2017-11-28
申请号：US14700546
申请日：2015-04-30
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Tzu-Jin Yeh
CPC分类号： H03F1/0205 , H03F1/0261 , H03F1/223 , H03F1/347 , H03F3/193 , H03F2200/117 , H03F2200/168 , H03F2200/18 , H03F2200/294 , H03F2200/451
摘要： A low noise amplifier (LNA) includes a first transistor and a second transistor. A source of the second transistor is connected to a drain of the first transistor. The LNA further includes a feedback transformer. A gate of the first transistor is connected to a primary winding of the feedback transformer and a gate of the second transistor is connected to a secondary winding of the feedback transformer.
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公开(公告)号：US09098757B2
公开(公告)日：2015-08-04
申请号：US13926596
申请日：2013-06-25
发明人： Tsung-Hsiung Lee , Kuang-Kai Yen , Shi-Hung Wang , Yung-Hsu Chuang , Huan-Neng Chen , Wei-Li Chen , Shih-Hung Lan , Yi-Hsuan Liu , Fan-Ming Kuo , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： G01R31/26 , G06K7/00 , G01R31/265 , G01R31/302
CPC分类号： G06K7/0095 , G01R31/2656 , G01R31/3025
摘要： A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.
摘要翻译： 半导体晶片包括多个管芯。 多个管芯中的每一个都包括射频识别（RFID）标签电路和线圈。 RFID标签电路包括标签芯，RF前端电路，ID解码器，用于唯一ID的比较器和导线。 RF前端电路被配置为通过多个管芯中的每一个中的线圈接收电磁信号，并将接收到的电磁信号转换为命令。 ID解码器被配置为接收命令并产生期望ID。 比较器被配置为将唯一ID与期望ID进行比较以产生比较结果。 布置比较结果来确定标签核心是否配置为接收命令。
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公开(公告)号：US09304164B2
公开(公告)日：2016-04-05
申请号：US13655047
申请日：2012-10-18
发明人： Tsung-Hsiung Li , Kuang-Kai Yen , Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： G01R1/067 , G01R31/20 , G06K7/10 , G01R31/302 , G01R31/3185
CPC分类号： G01R1/06711 , G01R31/2607 , G01R31/28 , G01R31/3025 , G01R31/318511
摘要： A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.
摘要翻译： 半导体晶片包括多个管芯和至少一个测试探针。 多个管芯中的每一个都包括射频识别（RFID）标签电路。 所述至少一个测试探针包括多个探针垫。 多个探针焊盘被配置为将功率信号和数据传送到多个管芯中的每一个，并且从多个管芯中的每一个接收测试结果。 以串行方式将数据发送到多个管芯中的每一个。 多个管芯中的每一个的测试结果也以串行方式传输到多个探针焊盘。
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公开(公告)号：US11711056B2
公开(公告)日：2023-07-25
申请号：US17751005
申请日：2022-05-23
发明人： Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
CPC分类号： H03B5/1256 , H03B5/1212 , H03B5/1228 , H01F2021/125 , H03B2201/0216 , H03J3/20 , H03J3/22
摘要： A method using a phase locked loop (PLL) includes receiving a reference frequency. The method further includes generating a control signal based on the reference frequency. The method further includes adjusting an output signal based on the control signal. Adjusting the output signal includes operating a plurality of switches in response to the control signal, wherein operating the plurality of switches comprises selectively electrically connecting a first ground plane to a first floating plane, wherein the first floating plane is between the first ground plane and the signal line, and the first floating plane is a same distance from a substrate as the first ground plane.
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公开(公告)号：US20160187380A1
公开(公告)日：2016-06-30
申请号：US15065530
申请日：2016-03-09
发明人： Tsung-Hsiung Lee , Kuang-Kai Yen , Yi-Hsuan Liu , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
CPC分类号： G01R1/06711 , G01R31/2607 , G01R31/28 , G01R31/3025 , G01R31/318511
摘要： A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.
摘要翻译： 半导体晶片包括多个管芯和至少一个测试探针。 多个管芯中的每一个都包括射频识别（RFID）标签电路。 所述至少一个测试探针包括多个探针垫。 多个探针焊盘被配置为将功率信号和数据传送到多个管芯中的每一个，并且从多个管芯中的每一个接收测试结果。 以串行方式将数据发送到多个管芯中的每一个。 多个管芯中的每一个的测试结果也以串行方式传输到多个探针焊盘。
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公开(公告)号：US20140145749A1
公开(公告)日：2014-05-29
申请号：US13926596
申请日：2013-06-25
发明人： Tsung-Hsiung Lee , Kuang-Kai Yen , Shi-Hung Wang , Yung-Hsu Chuang , Huan-Neng Chen , Wei-Li Chen , Shih-Hung Lan , Yi-Hsuan Liu , Fan-Ming Kuo , Hsieh-Hung Hsieh , Chewn-Pu Jou , Fu-Lung Hsueh
IPC分类号： G01R31/265
CPC分类号： G06K7/0095 , G01R31/2656 , G01R31/3025
摘要： A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.
摘要翻译： 半导体晶片包括多个管芯。 多个模具中的每一个都包括射频识别（RFID）标签电路和线圈。 RFID标签电路包括标签芯，RF前端电路，ID解码器，用于唯一ID的比较器和导线。 RF前端电路被配置为通过多个管芯中的每一个中的线圈接收电磁信号，并将接收到的电磁信号转换为命令。 ID解码器被配置为接收命令并产生期望ID。 比较器被配置为将唯一ID与期望ID进行比较以产生比较结果。 布置比较结果来确定标签核心是否配置为接收命令。
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