公开(公告)号：US20170012019A1

公开(公告)日：2017-01-12

申请号：US15276196

申请日：2016-09-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Su-Chun YANG ,  Chung-Jung WU ,  Hsiao-Yun CHEN ,  Yi-Li HSIAO ,  Chih-Hang TUNG ,  Da-Yuan SHIH ,  Chen-Hua YU

IPC: H01L23/00 ,  C22C13/00 ,  B23K35/26 ,  B23K1/00 ,  B23K35/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/40 ,  B23K2103/08 ,  C22C13/00 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/16507 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8193 ,  H01L2224/81947 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/3841

Abstract: A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.

Abstract translation: 一种制造焊料凸点接头的方法包括将包含锡的焊料凸点加热到焊锡凸块的熔化温度以上，其中焊料凸块包括共晶Sn-Bi化合物，并且共晶Sn-Bi化合物不含Ag。 该方法还包括拉伸焊料凸起以增加焊料凸块的高度，其中拉伸焊料凸点形成具有小于90°的接触角的层状结构。 该方法还包括冷却焊料凸块。