知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.025 秒)

    T-flex bonder
    1.
    发明授权
    T-flex bonder 有权
    T型柔性连接机

    公开(公告)号：US09101083B2

    公开(公告)日：2015-08-04

    申请号：US13609248

    申请日：2012-09-10

    申请人： Silvio Grespan ,  Shih-Min Hsu ,  Heng-Hsi Wu ,  Kuo-Hua Sung

    发明人： Silvio Grespan ,  Shih-Min Hsu ,  Heng-Hsi Wu ,  Kuo-Hua Sung

    IPC分类号： B32B41/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/00

    CPC分类号： H05K3/32 ,  B32B41/00 ,  H05K3/0008 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09918 ,  H05K2201/10136 ,  H05K2203/082

    摘要： A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.

    摘要翻译： 具有多个独立安装点的柔性电路可以通过独立（并且同时）通过真空吸盘将安装点定位在x，y和θ（角度旋转）中来安装（焊接）到基板。 在一个实施例中，真空卡盘可以由计算机辅助视觉引导，以便在基板上的基准点上定位和匹配柔性电路上的基准。 在一个实施例中，热棒可以用于随后的接合操作中，以确保柔性电路和衬底之间的粘合剂耦合。

    CURVED TOUCH PANEL
    2.
    发明申请
    CURVED TOUCH PANEL 有权
    弯曲触控面板

    公开(公告)号：US20120111479A1

    公开(公告)日：2012-05-10

    申请号：US12940500

    申请日：2010-11-05

    申请人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    发明人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    IPC分类号： B32B17/04 ,  B29C63/20

    CPC分类号： B32B38/1866 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/10174 ,  B32B17/10211 ,  B32B2457/208

    摘要： A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 μm in thickness, and can be reduced to a desired thickness below 200 μm after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.

    摘要翻译： 公开了一种形成弯曲的触摸表面的方法。 根据实施例，该方法包括将触摸传感器图案沉积在柔性基板上; 并且使用支撑柔性基板的卡盘表面弯曲柔性基板，以符合弯曲盖表面的形状。 然后，弯曲的柔性基板可以层压或以其他方式粘附到盖表面。 柔性基板可以是厚度大于200μm的玻璃基板，并且可以在其上沉积触摸传感器图案之后将其减小到低于200μm的期望厚度。 柔性基板可以通过将柔性基板支撑在卡盘表面上而弯曲，使得柔性基板符合卡盘表面的形状，或者将柔性基板强制抵靠盖表面，使得柔性基板符合 弯曲的盖面。

    Method of making a curved touch panel
    5.
    发明授权
    Method of making a curved touch panel 有权
    制作弯曲触摸屏的方法

    公开(公告)号：US08808483B2

    公开(公告)日：2014-08-19

    申请号：US12940500

    申请日：2010-11-05

    申请人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    发明人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    IPC分类号： B32B37/18

    CPC分类号： B32B38/1866 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/10174 ,  B32B17/10211 ,  B32B2457/208

    摘要： A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 μm in thickness, and can be reduced to a desired thickness below 200 μm after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.

    摘要翻译： 公开了一种形成弯曲的触摸表面的方法。 根据实施例，该方法包括将触摸传感器图案沉积在柔性基板上; 并且使用支撑柔性基板的卡盘表面弯曲柔性基板，以符合弯曲盖表面的形状。 然后，弯曲的柔性基板可以层压或以其他方式粘附到盖表面。 柔性基板可以是厚度大于200μm的玻璃基板，并且可以在其上沉积触摸传感器图案之后将其减小到低于200μm的期望厚度。 柔性基板可以通过将柔性基板支撑在卡盘表面上而弯曲，使得柔性基板符合卡盘表面的形状，或者将柔性基板强制抵靠盖表面，使得柔性基板符合 弯曲的盖面。

    Optoelectronic device and method for producing an optoelectronic device
    8.
    发明授权
    Optoelectronic device and method for producing an optoelectronic device 有权
    光电器件及其制造方法

    公开(公告)号：US08330053B2

    公开(公告)日：2012-12-11

    申请号：US12144516

    申请日：2008-06-23

    申请人： Silvio Grespan

    发明人： Silvio Grespan

    IPC分类号： H05K1/16

    CPC分类号： H05K1/147 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/524 ,  H05K3/361 ,  H05K2201/10128 ,  Y10T156/10

    摘要： An optoelectronic device includes an optoelectronic component, the optoelectronic component having an active region and at least one first conductive path on a first substrate, wherein the first conductive path is electrically connected to the active region. Further, the optoelectronic device comprises a second substrate with at least one second conductive path, wherein the first conductive path and the second conductive path are electrically connected to one another.

    摘要翻译： 光电子器件包括光电子部件，光电子部件具有有源区和在第一衬底上的至少一个第一导电路径，其中第一导电路径电连接到有源区。 此外，光电子器件包括具有至少一个第二导电路径的第二衬底，其中第一导电路径和第二导电路径彼此电连接。

    Encapsulated electronic device
    9.
    发明授权
    Encapsulated electronic device 有权
    封装电子设备

    公开(公告)号：US08830695B2

    公开(公告)日：2014-09-09

    申请号：US11766028

    申请日：2007-06-20

    申请人： Silvio Grespan

    发明人： Silvio Grespan

    IPC分类号： H01R12/16 ,  H01L51/52 ,  H01L23/04

    CPC分类号： H01L51/5237 ,  H01L23/04 ,  H01L51/524 ,  H01L51/525 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/00

    摘要： An electronic device includes a substrate (1), an electronic component (2) seated on the substrate (1), and a cover (3) across the electronic component (2) with a space (330) between the cover (3) and the electronic component (2). The cover (3) is configured on an inside (32) facing the electronic component (2) in such fashion that the cover (3) has at least one support structure (4, 40) protruding into the space (330).

    摘要翻译： 电子设备包括基板（1），安置在基板（1）上的电子部件（2）和跨越电子部件（2）的盖子（3），盖子（3）和盖子 电子部件（2）。 盖（3）以面对电子部件（2）的内侧（32）构造成使得盖（3）具有突出到空间（330）中的至少一个支撑结构（4,40）的方式。

    Water jet shaping of displays and structures for electronic devices
    10.
    发明授权
    Water jet shaping of displays and structures for electronic devices 有权
    用于电子设备的显示器和结构的喷水成型

    公开(公告)号：US08801889B2

    公开(公告)日：2014-08-12

    申请号：US13021526

    申请日：2011-02-04

    申请人： Jun Qi ,  Wayne H. Fu ,  Chenhui Wang ,  Kuanying Lin ,  Nathan K. Gupta ,  Victor H. Yin ,  Silvio Grespan

    发明人： Jun Qi ,  Wayne H. Fu ,  Chenhui Wang ,  Kuanying Lin ,  Nathan K. Gupta ,  Victor H. Yin ,  Silvio Grespan

    IPC分类号： B32B38/00 ,  B32B38/04 ,  B32B38/10 ,  G02F1/1333 ,  B26F3/00

    CPC分类号： B26F3/00 ,  G02F1/133351 ,  Y10T83/0591 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1062

    摘要： Structures such as display structures and other electronic device structures may be shaped using water jet cutting equipment. The water jet cutting equipment may be used to produce a water jet. The water jet may be used to cut layer of material such as display layers and other structures. Water jet cutting may form edge cuts, cuts for openings in the structures, chamfers, and other features. Multiple layers may be simultaneously cut using water jet cutting. Positioning equipment may be used to control the position of a workpiece relative to a water jet nozzle. The positioning equipment may be controlled using a control unit. During water jet cutting operations, the workpiece may be trimmed, openings may be formed, and features such as chamfers may be created. A workpiece may include a cover glass, a color filter array, a thin-film transistor layer, and other display layers and device structures.

    摘要翻译： 诸如显示结构和其他电子设备结构的结构可以使用水射流切割设备成型。 喷水切割设备可用于生产水射流。 水射流可用于切割诸如显示层和其它结构的材料层。 水射流切割可以形成边缘切割，用于结构中的开口的切口，倒角和其它特征。 可以使用水射流切割同时切割多层。 定位设备可用于控制工件相对于喷水嘴的位置。 定位设备可以使用控制单元进行控制。 在水射流切割操作期间，可以修剪工件，可以形成开口，并且可能产生诸如倒角的特征。 工件可以包括盖玻璃，滤色器阵列，薄膜晶体管层以及其它显示层和器件结构。