发明授权
- 专利标题： T-flex bonder
- 专利标题（中）： T型柔性连接机
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申请号： US13609248申请日： 2012-09-10
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公开(公告)号： US09101083B2公开(公告)日： 2015-08-04
- 发明人: Silvio Grespan , Shih-Min Hsu , Heng-Hsi Wu , Kuo-Hua Sung
- 申请人： Silvio Grespan , Shih-Min Hsu , Heng-Hsi Wu , Kuo-Hua Sung
- 申请人地址： US CA Cupertino
- 专利权人： APPLE INC.
- 当前专利权人： APPLE INC.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Downey Band LLP
- 主分类号： B32B41/00
- IPC分类号： B32B41/00 ; H05K3/32 ; H05K3/36 ; H05K3/00
摘要：
A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
公开/授权文献
- US20140069567A1 T-FLEX BONDER 公开/授权日：2014-03-13
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