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    T-flex bonder
    1.
    发明授权
    T-flex bonder 有权
    T型柔性连接机

    公开(公告)号：US09101083B2

    公开(公告)日：2015-08-04

    申请号：US13609248

    申请日：2012-09-10

    申请人： Silvio Grespan ,  Shih-Min Hsu ,  Heng-Hsi Wu ,  Kuo-Hua Sung

    发明人： Silvio Grespan ,  Shih-Min Hsu ,  Heng-Hsi Wu ,  Kuo-Hua Sung

    IPC分类号： B32B41/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/00

    CPC分类号： H05K3/32 ,  B32B41/00 ,  H05K3/0008 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09918 ,  H05K2201/10136 ,  H05K2203/082

    摘要： A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.

    摘要翻译： 具有多个独立安装点的柔性电路可以通过独立（并且同时）通过真空吸盘将安装点定位在x，y和θ（角度旋转）中来安装（焊接）到基板。 在一个实施例中，真空卡盘可以由计算机辅助视觉引导，以便在基板上的基准点上定位和匹配柔性电路上的基准。 在一个实施例中，热棒可以用于随后的接合操作中，以确保柔性电路和衬底之间的粘合剂耦合。

    CURVED TOUCH PANEL
    2.
    发明申请
    CURVED TOUCH PANEL 有权
    弯曲触控面板

    公开(公告)号：US20120111479A1

    公开(公告)日：2012-05-10

    申请号：US12940500

    申请日：2010-11-05

    申请人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    发明人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    IPC分类号： B32B17/04 ,  B29C63/20

    CPC分类号： B32B38/1866 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/10174 ,  B32B17/10211 ,  B32B2457/208

    摘要： A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 μm in thickness, and can be reduced to a desired thickness below 200 μm after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.

    摘要翻译： 公开了一种形成弯曲的触摸表面的方法。 根据实施例，该方法包括将触摸传感器图案沉积在柔性基板上; 并且使用支撑柔性基板的卡盘表面弯曲柔性基板，以符合弯曲盖表面的形状。 然后，弯曲的柔性基板可以层压或以其他方式粘附到盖表面。 柔性基板可以是厚度大于200μm的玻璃基板，并且可以在其上沉积触摸传感器图案之后将其减小到低于200μm的期望厚度。 柔性基板可以通过将柔性基板支撑在卡盘表面上而弯曲，使得柔性基板符合卡盘表面的形状，或者将柔性基板强制抵靠盖表面，使得柔性基板符合 弯曲的盖面。

    Method of making a curved touch panel
    5.
    发明授权
    Method of making a curved touch panel 有权
    制作弯曲触摸屏的方法

    公开(公告)号：US08808483B2

    公开(公告)日：2014-08-19

    申请号：US12940500

    申请日：2010-11-05

    申请人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    发明人： Kuo-Hua Sung ,  Casey J. Feinstein ,  Silvio Grespan

    IPC分类号： B32B37/18

    CPC分类号： B32B38/1866 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/10174 ,  B32B17/10211 ,  B32B2457/208

    摘要： A method of forming a curved touch surface is disclosed. According to an embodiment, the method includes depositing a touch sensor pattern on a flexible substrate; and curving the flexible substrate, using a chuck surface supporting the flexible substrate, to conform to a shape of a curved cover surface. Then, the curved flexible substrate can be laminated or otherwise adhered to the cover surface. The flexible substrate can be a glass substrate greater than 200 μm in thickness, and can be reduced to a desired thickness below 200 μm after the touch sensor pattern is deposited thereon. The flexible substrate can be curved by supporting the flexible substrate on the chuck surface such that the flexible substrate conforms to a shape of the chuck surface, or forcing the flexible substrate against the cover surface, such that the flexible substrate conforms to the shape of the curved cover surface.

    摘要翻译： 公开了一种形成弯曲的触摸表面的方法。 根据实施例，该方法包括将触摸传感器图案沉积在柔性基板上; 并且使用支撑柔性基板的卡盘表面弯曲柔性基板，以符合弯曲盖表面的形状。 然后，弯曲的柔性基板可以层压或以其他方式粘附到盖表面。 柔性基板可以是厚度大于200μm的玻璃基板，并且可以在其上沉积触摸传感器图案之后将其减小到低于200μm的期望厚度。 柔性基板可以通过将柔性基板支撑在卡盘表面上而弯曲，使得柔性基板符合卡盘表面的形状，或者将柔性基板强制抵靠盖表面，使得柔性基板符合 弯曲的盖面。

    Liquid adhesive lamination for precision adhesive control
    8.
    发明授权
    Liquid adhesive lamination for precision adhesive control 有权
    液体粘合剂层压用于精密粘合剂控制

    公开(公告)号：US08608896B2

    公开(公告)日：2013-12-17

    申请号：US13231818

    申请日：2011-09-13

    申请人： Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

    发明人： Ralf Horstkemper ,  Casey J. Feinstein ,  Kuo-Hua Sung

    IPC分类号： B05D1/14

    CPC分类号： C09J5/00 ,  B29C65/4855 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/5064 ,  B29C65/524 ,  B29C66/342 ,  B29C66/3452 ,  B29C66/45 ,  C09J2201/36

    摘要： Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.

    摘要翻译： 提供了用于精密粘合剂控制的液体粘合剂层压方法。 通过首先在基材上的薄预涂层中图案化液体粘合剂可以获得精密的液体粘合剂控制。 然后可以在预涂层的顶部上构图第二粘合剂层。 当第二基板被按压到第一基板上时，第二基板首先与第二粘合剂层接触。 然后可以将粘合剂均匀地铺展在两个基材上而不形成空隙。 或者，可以以三维梯度图案形成单个液体粘合剂层。

    Controllable Placement of Liquid Adhesive on Substrate
    9.
    发明申请
    Controllable Placement of Liquid Adhesive on Substrate 审中-公开
    液体粘合剂在基材上的可控放置

    公开(公告)号：US20110151202A1

    公开(公告)日：2011-06-23

    申请号：US12641851

    申请日：2009-12-18

    申请人： Casey J. FEINSTEIN ,  Kuo-Hua Sung ,  John Z. Zhong

    发明人： Casey J. FEINSTEIN ,  Kuo-Hua Sung ,  John Z. Zhong

    IPC分类号： B32B3/10 ,  B05D5/10 ,  B05D3/14 ,  B05D3/06 ,  B05C11/00

    CPC分类号： B32B7/14 ,  B32B37/003 ,  B32B37/1292 ,  B32B2037/1253 ,  B32B2307/728 ,  B32B2307/73 ,  B32B2310/025 ,  B32B2310/0806 ,  B32B2310/12 ,  B32B2457/00 ,  Y10T428/24802

    摘要： Controllable placement of a liquid adhesive on a substrate to confine the adhesive to a desired area of the substrate is disclosed. A controllable placement method can include dispensing a liquid adhesive into a designated area on a surface of a substrate, controllably confining the dispensed liquid adhesive to the designated area, and curing the confined liquid adhesive. The dispensed liquid adhesive can be controllably confined using various techniques, such as electrical repulsion, electrical attraction, capacitance, electrowetting, light curing, adhesive attracting-repulsing coatings, and substrate topography. A substrate having a controllably placed liquid adhesive thereon can be incorporated into electronic devices, such as a mobile telephone, a digital media player, or a personal computer.

    摘要翻译： 公开了将液体粘合剂可控地放置在基底上以将粘合剂限制在基底的期望区域上。 可控放置方法可以包括将液体粘合剂分配到基底表面上的指定区域中，可控制地将分配的液体粘合剂限制在指定区域上，并固化限制的液体粘合剂。 分配的液体粘合剂可以使用各种技术，例如电排斥，电吸引，电容，电润湿，光固化，粘合剂吸引 - 斥斥涂层和基底形貌来控制地限制。 在其上具有可控地放置液体粘合剂的基板可以结合到诸如移动电话，数字媒体播放器或个人计算机的电子设备中。

    Injection Molding of Touch Surface
    10.
    发明申请
    Injection Molding of Touch Surface 审中-公开
    触摸表面注塑成型

    公开(公告)号：US20110147973A1

    公开(公告)日：2011-06-23

    申请号：US12641169

    申请日：2009-12-17

    申请人： Kuo-Hua Sung ,  Shin John Choi

    发明人： Kuo-Hua Sung ,  Shin John Choi

    IPC分类号： B29C45/76 ,  G06F3/041

    CPC分类号： G06F3/041 ,  G06F3/03543 ,  G06F3/03547

    摘要： Injection molding for a touch surface of a touch sensitive device is disclosed. A single-shot injection molding method can include molding an injected material to encapsulate a touch sensor at a substantially uniform distance from a touch surface of the molded material. A double-shot injection molding method can include molding a first shot of an injected material to contact a portion of a touch sensor and molding a second shot of an injected material to encapsulate at least the remaining portions of the touch sensor to form a touch surface at a substantially uniform distance from the touch sensor. Another molding method can include molding a coating on a touch sensor to having a substantially uniform thickness. The injection molded material can provide a substantially uniform capacitive dielectric for the device. The injection molded touch surface can be incorporated into an electronic mouse, a mobile telephone, a digital media player, or a computer.

    摘要翻译： 公开了用于触敏装置的触摸表面的注模。 单次注射成型方法可以包括模制注射材料以将模制材料的触摸表面距离大致均匀的距离封装在触摸传感器中。 双注射成型方法可以包括模制注射材料的第一次注射以接触触摸传感器的一部分并且模制注射材料的第二次注射以至少封装触摸传感器的剩余部分以形成触摸表面 距离触摸传感器大致均匀的距离。 另一种模制方法可以包括将触摸传感器上的涂层模制成具有基本均匀的厚度。 注射成型材料可以为器件提供基本均匀的电容电介质。 注射成型的触摸表面可以结合到电子鼠标，移动电话，数字媒体播放器或计算机中。