公开(公告)号：US08643156B2

公开(公告)日：2014-02-04

申请号：US13605990

申请日：2012-09-06

申请人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

发明人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49558 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.

摘要翻译： 引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。 至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘 。 内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。 内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

公开(公告)号：US20130234306A1

公开(公告)日：2013-09-12

申请号：US13605990

申请日：2012-09-06

申请人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

发明人： Shunan Qiu ,  Zhigang Bai ,  Haiyan Liu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49558 ,  H01L23/3107 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.

摘要翻译： 引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。 至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘 。 内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。 内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

公开(公告)号：US20120286406A1

公开(公告)日：2012-11-15

申请号：US13461801

申请日：2012-05-02

申请人： Shunan QIU ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

发明人： Shunan QIU ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49555 ,  H01L21/4842 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch.

摘要翻译： 一种用于组装半导体器件的方法包括提供具有天然平面的引线框架和具有天然引线间距的多个引线。 该过程包括修剪和形成多个引线的第一子集以提供第一行引线。 该过程包括修剪和形成多个引线的第二子集以提供第二排引线。 引线的至少一个子集以相对于天平平面的钝角形成，使得与引线的第一或第二子集相关联的引线间距大于原始引线间距。

公开(公告)号：US08643153B2

公开(公告)日：2014-02-04

申请号：US13461801

申请日：2012-05-02

申请人： Shunan Qiu ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

发明人： Shunan Qiu ,  Zhigang Bai ,  Xuesong Xu ,  Beiyue Yan ,  You Ge

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49555 ,  H01L21/4842 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch.

摘要翻译： 一种用于组装半导体器件的方法包括提供具有天然平面的引线框架和具有天然引线间距的多个引线。 该过程包括修剪和形成多个引线的第一子集以提供第一行引线。 该过程包括修剪和形成多个引线的第二子集以提供第二排引线。 引线的至少一个子集以相对于天平平面的钝角形成，使得与引线的第一或第二子集相关联的引线间距大于原始引线间距。

公开(公告)号：US20160056097A1

公开(公告)日：2016-02-25

申请号：US14556225

申请日：2014-11-30

申请人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/52 ,  H01L21/78 ,  H01L21/56 ,  H01L21/311 ,  H01L21/3205 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L21/78 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

摘要翻译： 四边形扁平无引线（QFN）半导体管芯封装具有安装在引线框架的管芯标记上的半导体管芯。 A覆盖半导体管芯。 房屋有一个基地和两侧。 存在导电安装脚，每个脚在壳体的基部中具有暴露的基部，并且在壳体的一侧中的暴露的侧部。 接合线将半导体管芯的电极与相应的安装脚电连接。

公开(公告)号：US20150294929A1

公开(公告)日：2015-10-15

申请号：US14552491

申请日：2014-11-25

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L21/4839 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads.

摘要翻译： 半导体管芯封装由具有引线指的引线框架组装，引线框具有邻近管芯标记的结合端，以及远离管芯标记延伸的细长区域。 半导体管芯安装在管芯标记上，半导体管芯的电极通过接合线与接合端电连接。 每个细长区域被弯曲成具有安装脚的外部连接器引线。 每个引线指的细长区域从由模具化合物形成的壳体突出。 模具化合物从壳体延伸，以提供模制到外部连接器引线的绝缘支撑指。

公开(公告)号：US08953285B2

公开(公告)日：2015-02-10

申请号：US12799924

申请日：2010-05-05

申请人： Yuchen Zhou ,  Kunliang Zhang ,  Zhigang Bai

发明人： Yuchen Zhou ,  Kunliang Zhang ,  Zhigang Bai

IPC分类号： G11B5/39 ,  B82Y10/00 ,  B82Y25/00 ,  G01R33/09 ,  H01F10/30 ,  H01F10/32 ,  H01F41/30 ,  B82Y40/00

CPC分类号： G11B5/398 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  G01R33/093 ,  G01R33/098 ,  G11B5/3906 ,  G11B5/3909 ,  G11B5/3912 ,  G11B2005/3996 ,  H01F10/30 ,  H01F10/3259 ,  H01F10/3286 ,  H01F10/3295 ,  H01F41/307 ,  H01L43/02 ,  H01L43/08

摘要： A MR sensor is disclosed that has a free layer (FL) with perpendicular magnetic anisotropy (PMA) which eliminates the need for an adjacent hard bias structure to stabilize free layer magnetization and minimizes shield-FL interactions. In a TMR embodiment, a seed layer, free layer, junction layer, reference layer, and pinning layer are sequentially formed on a bottom shield. After patterning, a conformal insulation layer is formed along the sensor sidewall. Thereafter, a top shield is formed on the insulation layer and includes side shields that are separated from the FL by a narrow read gap. The sensor is scalable to widths

摘要翻译： 公开了具有垂直磁各向异性（PMA）的自由层（FL）的MR传感器，其不需要相邻的硬偏置结构来稳定自由层磁化并使屏蔽-FL相互作用最小化。 在TMR实施例中，种子层，自由层，结层，参考层和钉扎层依次形成在底部屏蔽上。 在图案化之后，沿传感器侧壁形成保形绝缘层。 此后，在绝缘层上形成顶部屏蔽，并且包括通过狭窄的读取间隙与FL分离的侧面屏蔽。 当PMA大于FL自扫描场时，传感器可缩放到宽度<50 nm。 有效偏置场对传感器纵横比相当不敏感，这使得高条纹和窄宽度传感器成为高RA TMR配置的可行方法。 侧面屏蔽可以延伸到种子层平面以下。

公开(公告)号：US08670213B1

公开(公告)日：2014-03-11

申请号：US13422997

申请日：2012-03-16

申请人： Wanxue Zeng ,  Weimin Si ,  Ying Hong ,  Zhigang Bai

发明人： Wanxue Zeng ,  Weimin Si ,  Ying Hong ,  Zhigang Bai

IPC分类号： G11B5/23 ,  B44C1/22

CPC分类号： G11B5/232 ,  G11B5/235 ,  G11B5/3116 ,  G11B5/3163

摘要： A writer main pole for a perpendicular magnetic recording system is provided. The writer pole has a tunable bottom gap to side gap ratio, and may be formed using deposition of a first seed layer through an ion beam deposition process, deposition of a second seed layer through a physical vapor deposition process, and deposition of a non-magnetic gap layer through a chemical vapor deposition process.

摘要翻译： 提供了一种用于垂直磁记录系统的写入器主极。 写入器极具有可调节的底部间隙与侧面间隙比，并且可以通过通过离子束沉积工艺沉积第一种子层，通过物理气相沉积工艺沉积第二籽晶层， 磁隙层通过化学气相沉积工艺。

公开(公告)号：US08611046B2

公开(公告)日：2013-12-17

申请号：US12799131

申请日：2010-04-19

申请人： Yan Wu ,  Zhigang Bai ,  Moris Dovek ,  Cherng-Chyi Han ,  Min Li ,  Jianing Zhou ,  Jiun-Ting Lee ,  Min Zheng

发明人： Yan Wu ,  Zhigang Bai ,  Moris Dovek ,  Cherng-Chyi Han ,  Min Li ,  Jianing Zhou ,  Jiun-Ting Lee ,  Min Zheng

IPC分类号： G11B5/11 ,  G11B5/23 ,  G11B5/31

CPC分类号： G11B5/105 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315 ,  G11B5/3163

摘要： A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield.

摘要翻译： 垂直磁记录（PMR）头被制造成具有通过分级侧屏蔽横向屏蔽的极尖，该平面侧屏蔽保护层在屏蔽的上部处与极尖的形状保持一致，但在下部不与极尖共形。 屏蔽件包括后挡板，其与电极尖端的后缘保持一致，并且可以包括磁性连接分级侧屏蔽件的两个底端的前缘屏蔽件。

公开(公告)号：US08547661B2

公开(公告)日：2013-10-01

申请号：US12589274

申请日：2009-10-21

申请人： Zhigang Bai

发明人： Zhigang Bai

IPC分类号： G11B5/127 ,  G11B5/23 ,  G11B5/187

CPC分类号： G11B5/3163 ,  G11B5/3153 ,  G11B2005/001 ,  G11B2005/0024

摘要： The invention discloses a MAMR head that has the STO stack placed at the trailing side of the write element, with both STO and write element completely self-aligned in the cross track direction. A method for defining both the MP and the STO stack geometries in a single step is also described.

摘要翻译： 本发明公开了一种MAMR头，其具有放置在写入元件的后侧的STO堆叠，STO和写入元件在交叉轨道方向上完全自对准。 还描述了在单个步骤中同时定义MP和STO堆叠几何的方法。