公开(公告)号：US09024564B2

公开(公告)日：2015-05-05

申请号：US13851511

申请日：2013-03-27

Applicant: Shinichi Kinouchi ,  Kosuke Nakano

Inventor： Shinichi Kinouchi ,  Kosuke Nakano

IPC: H02P27/00 ,  H02P27/06 ,  H02P27/08 ,  H02H7/09 ,  H02M1/32

CPC classification number: H02P27/06 ,  H02H7/09 ,  H02M1/32 ,  H02P27/08

Abstract: The invention provides a drive control device that comprises: inverters that are connected to a motor; a variable resistive element that is connected between the motor and each of the inverters; a current/voltage detection device connected between the motor and each of the inverters; and a controller that, when detecting a fault of an inverter that drives the motor based on a detection signal from the current/voltage detection device, gradually increases a resistance value of a variable resistive element provided between the faulty inverter and the motor at a velocity of a resistance variation such that a surge voltage has a voltage value for which the variable resistive element and the motor are not damaged, and executes drive control of the motor by a normal inverter other than the faulty inverter.

Abstract translation: 本发明提供了一种驱动控制装置，其包括：连接到电动机的反相器; 连接在电动机和每个逆变器之间的可变电阻元件; 连接在电动机和每个逆变器之间的电流/电压检测装置; 以及控制器，当基于来自所述电流/电压检测装置的检测信号检测到驱动所述电动机的逆变器的故障时，以设定在所述故障逆变器和所述电动机之间的可变电阻元件的电阻值以速度逐渐增加 电阻变化使得浪涌电压具有可变电阻元件和电动机不被损坏的电压值，并且通过除故障逆变器之外的正常逆变器来执行电动机的驱动控制。

公开(公告)号：US09044816B2

公开(公告)日：2015-06-02

申请号：US13404395

申请日：2012-02-24

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B32B15/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H05K3/34 ,  H01L23/00

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差 金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

公开(公告)号：US08105687B2

公开(公告)日：2012-01-31

申请号：US12959752

申请日：2010-12-03

Applicant: Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

IPC: B32B7/12 ,  H01L23/29

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0425 ,  Y02P70/611 ,  Y10T428/2857 ,  Y10T428/31678

Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.

公开(公告)号：US20120156512A1

公开(公告)日：2012-06-21

申请号：US13404395

申请日：2012-02-24

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B32B15/04 ,  B23K1/20 ,  B23K35/24

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差 金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

公开(公告)号：US20090301607A1

公开(公告)日：2009-12-10

申请号：US12084793

申请日：2006-11-10

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka ,  Minoru Ueshima

IPC: B23K35/14

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract translation: 本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性， 温度焊接。 焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

公开(公告)号：US09397592B2

公开(公告)日：2016-07-19

申请号：US14351382

申请日：2012-01-27

Applicant: Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao ,  Akira Furukawa

Inventor： Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao ,  Akira Furukawa

IPC: H02K29/06 ,  H02P6/10 ,  H02P29/02 ,  B62D5/04 ,  H02P25/22

CPC classification number: H02P6/10 ,  B60L3/0061 ,  B60L3/0092 ,  B60L3/12 ,  B60L11/123 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/526 ,  B60L2240/527 ,  B60L2240/529 ,  B62D5/0484 ,  B62D5/0487 ,  H02P25/22 ,  H02P29/024 ,  H02P29/0243 ,  H02P29/032 ,  Y02T10/6217 ,  Y02T10/642 ,  Y02T10/7077

Abstract: There is provided a motor control device for controlling a motor including plural sets of windings, which is configured so that, when a fault detection means detects a fault, inverters in the normal side other than in the fault side are continued to be controlled by normal-time current control means and further, inverters in the fault side are continued to be controlled by fault-time voltage commands generated by a fault-time current control means configured with a fault-time normal-side command generator and a fault-time fault-side command generator, so as to emphasis a torque ripple of the motor when a winding fault of the motor or an inverter fault occurs, to thereby cause a user to surely recognize the fault.

Abstract translation: 提供了一种用于控制包括多组绕组的电动机的电动机控制装置，其被构造成使得当故障检测装置检测到故障时，正常侧以外的故障侧的逆变器继续被正常地控制 时间电流控制装置，并且故障侧的逆变器继续由配置有故障时正常侧命令发生器和故障时间故障的故障时电流控制装置产生的故障时间电压指令来控制 在电机的绕组故障或变频器故障发生时强调电机的转矩脉动，从而使用户可靠地识别故障。

公开(公告)号：US08878474B2

公开(公告)日：2014-11-04

申请号：US13612150

申请日：2012-09-12

Applicant: Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao

Inventor： Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao

IPC: H02H7/08

CPC classification number: H02P29/0241 ,  H02P25/22 ,  H02P27/06

Abstract: Provided is a motor control device (10) for controlling a motor (5) provided with a plurality of sets of windings, in which, when a current control unit (23) detects a short-circuit failure as a primary failure, the current control unit (23) continues the control, and, further, when the current control unit (23) detects a secondary failure, the current control unit (23) provides control of opening a power supply relay (3). Accordingly, in a case where a failure of a winding of a motor or an inverter occurs, a torque pulsation is restrained and a sufficient output torque is provided, and further, in a case where a secondary failure occurs, excessive heat generation and current consumption are prevented and the cost of the device is reduced.

Abstract translation: 提供一种用于控制设置有多组绕组的电动机（5）的电动机控制装置（10），其中当电流控制单元（23）检测到作为主要故障的短路故障时，电流控制 单元（23）继续控制，此外，当电流控制单元（23）检测到二次故障时，电流控制单元（23）提供打开电源继电器（3）的控制。 因此，在电动机或逆变器的绕组发生故障的情况下，抑制转矩脉动并提供足够的输出转矩，此外，在发生二次故障的情况下，产生过多的发热和电流消耗 并且降低了设备的成本。

公开(公告)号：US20140246999A1

公开(公告)日：2014-09-04

申请号：US14351382

申请日：2012-01-27

Applicant: Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao ,  Akira Furukawa

Inventor： Isao Kezobo ,  Kosuke Nakano ,  Yoshihito Asao ,  Akira Furukawa

IPC: H02P6/10

CPC classification number: H02P6/10 ,  B60L3/0061 ,  B60L3/0092 ,  B60L3/12 ,  B60L11/123 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/526 ,  B60L2240/527 ,  B60L2240/529 ,  B62D5/0484 ,  B62D5/0487 ,  H02P25/22 ,  H02P29/024 ,  H02P29/0243 ,  H02P29/032 ,  Y02T10/6217 ,  Y02T10/642 ,  Y02T10/7077

Abstract: There is provided a motor control device for controlling a motor including plural sets of windings, which is configured so that, when a fault detection means detects a fault, inverters in the normal side other than in the fault side are continued to be controlled by normal-time current control means and further, inverters in the fault side are continued to be controlled by fault-time voltage commands generated by a fault-time current control means configured with a fault-time normal-side command generator and a fault-time fault-side command generator, so as to emphasis a torque ripple of the motor when a winding fault of the motor or an inverter fault occurs, to thereby cause a user to surely recognize the fault.

Abstract translation: 提供了一种用于控制包括多组绕组的电动机的电动机控制装置，其被构造成使得当故障检测装置检测到故障时，正常侧以外的故障侧的逆变器继续被正常地控制 时间电流控制装置，并且故障侧的逆变器继续由配置有故障时正常侧命令发生器和故障时间故障的故障时电流控制装置产生的故障时间电压指令来控制 在电机的绕组故障或变频器故障发生时强调电机的转矩脉动，从而使用户可靠地识别故障。

公开(公告)号：US20100035072A1

公开(公告)日：2010-02-11

申请号：US11990278

申请日：2006-08-11

Applicant: Shizuharu Watanabe ,  Hidekiyo Takaoka ,  Kosuke Nakano ,  Masafumi Seino ,  Ko Inaba

Inventor： Shizuharu Watanabe ,  Hidekiyo Takaoka ,  Kosuke Nakano ,  Masafumi Seino ,  Ko Inaba

IPC: B32B15/04 ,  B23K35/22 ,  B23K31/02

CPC classification number: H05K3/3484 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  H05K3/3463 ,  Y10T428/31678

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract translation: 包含焊料合金粉末和焊剂的焊膏。 焊料合金熔化时的体积膨胀为0.5％以下。 助熔剂含有双酚A型环氧树脂和选自羧酸酐和二羧酸的固化剂。 焊膏可用于适用于高温焊料的应用中。 所述焊料合金具有以质量％计含有Bi的70-98％，Al，Cu，Sb，In，Zn，Ni，Cr，Fe中的至少一种物质的总计为0〜0.5％ Mo，P，Ge和Ga，余量为Sn。

公开(公告)号：US20070245852A1

公开(公告)日：2007-10-25

申请号：US11812005

申请日：2007-06-14

Applicant: Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano

IPC: C22C1/04

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。 具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。