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    ENERGY HARVESTING DEVICE
    2.
    发明申请
    ENERGY HARVESTING DEVICE 有权
    能量采集设备

    公开(公告)号：US20110101827A1

    公开(公告)日：2011-05-05

    申请号：US12610771

    申请日：2009-11-02

    Applicant: Sang Won Yoon ,  Alexandros Margomenos

    Inventor： Sang Won Yoon ,  Alexandros Margomenos

    IPC: H02N2/18

    CPC classification number: H02N2/186 ,  H01L41/1134 ,  H01L41/1136

    Abstract: The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.

    Abstract translation: 本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。 该器件可以包括基极，低频元件和压电元件。 低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。 由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

    Energy harvesting device
    3.
    发明授权
    Energy harvesting device 有权
    能量收集装置

    公开(公告)号：US07986076B2

    公开(公告)日：2011-07-26

    申请号：US12610771

    申请日：2009-11-02

    Applicant: Sang Won Yoon ,  Alexandros Margomenos

    Inventor： Sang Won Yoon ,  Alexandros Margomenos

    IPC: H01L41/08

    CPC classification number: H02N2/186 ,  H01L41/1134 ,  H01L41/1136

    Abstract: The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.

    Abstract translation: 本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。 该器件可以包括基极，低频元件和压电元件。 低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。 由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

    First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
    5.
    发明授权
    First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between 失效
    第一和第二共面微带线由行通道隔开，以减少它们之间的串扰

    公开(公告)号：US08378759B2

    公开(公告)日：2013-02-19

    申请号：US12697119

    申请日：2010-01-29

    Applicant: Alexandros Margomenos ,  Amin Rida

    Inventor： Alexandros Margomenos ,  Amin Rida

    IPC: H01P3/08

    CPC classification number: H01P3/081

    Abstract: An apparatus for reducing crosstalk including a substrate having a bottom surface and a top surface defining a horizontal plane, a ground plane coupled to the bottom surface of the substrate, first and second microstrip lines formed on the top surface of the substrate, the first and second microstrip lines formed on the top surface of the substrate and spaced apart from one another, and a first plurality of vias traveling through the substrate from the top surface of the substrate to the ground plane and positioned between the first and second microstrip lines for reducing crosstalk between the first and second microstrip lines.

    Abstract translation: 一种用于减少串扰的装置，包括具有限定水平面的底表面和顶表面的衬底，耦合到衬底的底表面的接地平面，形成在衬底的顶表面上的第一和第二微带线，第一和 第二微带线形成在基板的顶表面上并且彼此间隔开;以及第一多个通孔，其穿过基板从基板的顶表面移动到接​​地平面并且位于第一和第二微带线之间，用于还原 第一和第二微带线之间的串扰。

    MICROWAVE ANTENNA AND METHOD FOR MAKING SAME
    6.
    发明申请
    MICROWAVE ANTENNA AND METHOD FOR MAKING SAME 有权
    微波天线及其制造方法

    公开(公告)号：US20110010926A1

    公开(公告)日：2011-01-20

    申请号：US12888473

    申请日：2010-09-23

    Applicant: Alexandros Margomenos

    Inventor： Alexandros Margomenos

    IPC: H01P11/00

    CPC classification number: B29C59/02 ,  B29C59/026 ,  H01Q1/32 ,  H01Q13/02 ,  H01Q13/0283 ,  Y10T29/49016

    Abstract: A method for fabricating a microwave horn antenna in which a thermoplastic sacrificial layer is mounted to a thermoplastic horn layer. A heated horn embossing plate having at least one horn shaped embossing element is then moved into the horn layer so that the horn element penetrates through the horn layer and extends partially into the sacrificial layer thus forming a horn opening in the horn layer complementary in shape to the horn element. The horn layer and sacrificial layer are then separated from each other and the horn opening and at least a portion of the back surface of the horn layer is covered with a metal coating. A thermoplastic wave guide layer formed by embossing wave guide channels into the layer is covered with metal and attached to the back side of the horn layer to form the antenna. Alternatively, a portion of the horn and the remaining portion of a microwave channel are formed in both a first and second thermoplastic section. These portions of the microwave guide channel and horn are then coated with a metal material and the sections are secured together in a facing relationship so that the horn portions and wave guide channel portions on both the first and second sections register with each other.

    Abstract translation: 一种制造微波喇叭天线的方法，其中热塑性牺牲层安装在热塑性喇叭层上。 具有至少一个喇叭形压花元件的加热喇叭压花板然后被移动到喇叭层中，使得喇叭元件穿透喇叭层并部分地延伸到牺牲层中，从而在喇叭形层中形成一个喇叭形开口，形状互补，形状与 喇叭元素。 然后将喇叭层和牺牲层彼此分离，喇叭开口和喇叭层的后表面的至少一部分被金属涂层覆盖。 通过将波导通道压印到该层中而形成的热塑性波导层被金属覆盖并附接到喇叭层的背面以形成天线。 或者，喇叭的一部分和微波通道的剩余部分形成在第一和第二热塑性部分中。 然后微波引导通道和喇叭的这些部分涂覆有金属材料，并且这些部分以面对的关系固定在一起，使得第一和第二部分上的喇叭部分和波导通道部分彼此配准。

    WAVEGUIDE TO MICROSTRIP TRANSITION
    7.
    发明申请
    WAVEGUIDE TO MICROSTRIP TRANSITION 有权
    波导到微波转换

    公开(公告)号：US20100225410A1

    公开(公告)日：2010-09-09

    申请号：US12400027

    申请日：2009-03-09

    Applicant: Alexandros Margomenos ,  Paul D. Schmalenberg

    Inventor： Alexandros Margomenos ,  Paul D. Schmalenberg

    IPC: H03H5/00

    CPC classification number: H01P5/107

    Abstract: A waveguide to microstrip transition having a waveguide open at one end. A dielectric substrate includes a first and a second side and a ground plane covers the first side of the substrate. The dielectric substrate overlies the waveguide opening so that the ground plane faces the waveguide and an opening in the ground plane registers with the waveguide opening. A back short having a housing is positioned on the second side of the dielectric substrate. The back short housing forms a cavity which registers with at least a portion of the ground plane opening so that microwave energy from the waveguide passes through the dielectric substrate and into the cavity defined by the back short housing. The back short housing has at least one opening to the cavity along the second side of the dielectric substrate. A pair of spaced apart microstrips on the second side of the substrate each have a free end positioned in the cavity so that the free ends of the microstrips are spaced apart from each other.

    Abstract translation: 波导到微带转换，其波导在一端开口。 电介质基板包括第一侧面和第二侧面，并且接地面覆盖基板的第一面。 电介质衬底覆盖波导开口，使得接地平面面向波导，并且接地平面中的开口与波导开口对准。 具有壳体的背部短距离定位在电介质基板的第二侧上。 后短壳体形成空腔，其与接地平面开口的至少一部分对准，使得来自波导的微波能量通过电介质基板并进入由后短壳体限定的空腔中。 后短壳体具有沿着电介质基板的第二侧的至少一个到空腔的开口。 在基板的第二侧上的一对间隔开的微带，每个具有位于空腔中的自由端，使得微带的自由端彼此间隔开。

    Vertically integrated transceiver array
    8.
    发明授权
    Vertically integrated transceiver array 失效
    垂直集成收发器阵列

    公开(公告)号：US07760142B2

    公开(公告)日：2010-07-20

    申请号：US11733564

    申请日：2007-04-10

    Applicant: Kazem F. Sabet ,  Linda P. B. Katehi ,  Alexandros Margomenos

    Inventor： Kazem F. Sabet ,  Linda P. B. Katehi ,  Alexandros Margomenos

    IPC: H01Q1/38

    CPC classification number: H01Q21/0025

    Abstract: A transceiver array that employs vertically integrated circuits in one or more wafers. The array includes a digital wafer having digital circuits. A plurality of RF cubes are formed to the digital wafer, where each RF cube includes an antenna wafer and at least one lower wafer, and where each RF cube represents a separate channel of the array. The antenna wafer includes a patch antenna and a resonating cavity. The at least one lower wafer includes high frequency RF integrated circuits and intermediate frequency RF integrated circuits. The array has application as a front-end for a digital beam-forming system.

    Abstract translation: 在一个或多个晶片中采用垂直集成电路的收发器阵列。 该阵列包括具有数字电路的数字晶片。 多个RF立方体形成到数字晶片，其中每个RF立方体包括天线晶片和至少一个下晶片，并且其中每个RF立方体代表阵列的单独通道。 天线晶片包括贴片天线和谐振腔。 所述至少一个下晶片包括高频RF集成电路和中频RF集成电路。 该阵列作为数字波束形成系统的前端应用。

    DUAL-BAND ANTENNA ARRAY AND RF FRONT-END FOR AUTOMOTIVE RADARS
    9.
    发明申请
    DUAL-BAND ANTENNA ARRAY AND RF FRONT-END FOR AUTOMOTIVE RADARS 有权
    双带天线阵列和RF前端用于汽车雷达

    公开(公告)号：US20090251356A1

    公开(公告)日：2009-10-08

    申请号：US12340448

    申请日：2008-12-19

    Applicant: Alexandros Margomenos

    Inventor： Alexandros Margomenos

    IPC: G01S13/88

    CPC classification number: G01S13/931 ,  G01S7/03 ,  G01S13/87 ,  G01S2013/9321 ,  G01S2013/9375 ,  G01S2013/9378 ,  G01S2013/9389 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01Q1/3233 ,  H01Q5/42 ,  H01Q21/064 ,  H01Q21/065 ,  H01L2924/00014

    Abstract: The automotive radar includes a printed circuit board having a top surface and a bottom surface, and a processor mounted on the bottom surface of the printed circuit board. The automotive radar also includes a second liquid crystal polymer layer formed on the top surface of the printed circuit board, a second microstrip array printed on the second liquid crystal polymer layer, the second microstrip array having a patch, a first liquid crystal polymer layer formed on the second liquid crystal polymer layer, a first microstrip array printed on the first liquid crystal polymer layer, the first microstrip array having a perforated patch, and a transmit/receive module connected to a bottom surface of the second liquid crystal polymer layer and configured to transmit a first frequency signal to the first microstrip array and a second frequency signal to the second microstrip array.

    Abstract translation: 汽车雷达包括具有顶表面和底表面的印刷电路板，以及安装在印刷电路板的底表面上的处理器。 汽车雷达还包括形成在印刷电路板的顶表面上的第二液晶聚合物层，印刷在第二液晶聚合物层上的第二微带阵列，具有贴片的第二微带阵列，形成第一液晶聚合物层 在第二液晶聚合物层上，印刷在第一液晶聚合物层上的第一微带阵列，具有穿孔贴片的第一微带阵列和连接到第二液晶聚合物层的底表面的发射/接收模块， 将第一频率信号发送到第一微带阵列，并将第二频率信号发送到第二微带阵列。

    Evanescent Mode Resonator Including Tunable Capacitive Post
    10.
    发明申请
    Evanescent Mode Resonator Including Tunable Capacitive Post 审中-公开
    包含可调谐电容信号的衰减模式谐振器

    公开(公告)号：US20080252401A1

    公开(公告)日：2008-10-16

    申请号：US11735269

    申请日：2007-04-13

    Applicant: Alexandros Margomenos ,  Linda P.B. Katehi

    Inventor： Alexandros Margomenos ,  Linda P.B. Katehi

    IPC: H01P1/219

    CPC classification number: H01P1/219

    Abstract: An evanescent mode resonator including a cavity formed in a substrate of semiconductor material. The resonator includes a capacitive post positioned within the cavity, and a tuning element positioned within the wall of the cavity proximate to the capacitive post, where a gap between the flexible element and the post sets the tuning of the resonator.

    Abstract translation: 包括形成在半导体材料的衬底中的空腔的消逝模式谐振器。 所述谐振器包括位于所述空腔内的电容柱，以及调谐元件，所述调谐元件位于靠近所述电容柱的所述腔的壁内，其中所述柔性元件和所述柱之间的间隙设定所述谐振器的调谐。

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