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1.发明申请TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME 有权临时粘结粘合剂组合物和使用其制造半导体器件的方法公开(公告)号：US20150024574A1
公开(公告)日：2015-01-22
申请号：US14334265
申请日：2014-07-17
发明人： Tae-Hoon Kim , Hideto Kato , Jae-Hyun Kim , Jun-Won Han , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Jung-Sik Choi
IPC分类号： H01L21/762 , C09J183/06 , C09J183/04
CPC分类号： C09J183/06 , B05D3/02 , B32B27/283 , C08G77/52 , C08G77/70 , C08L83/00 , C09J183/04 , C09J183/14 , H01L21/6835 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/16225 , H01L2225/06513 , H01L2924/15311
摘要： A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.
摘要翻译： 临时粘合剂组合物包括包含热固性聚有机硅氧烷的第一化合物和包含热塑性聚有机硅氧烷的第二化合物。
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2.发明授权Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same 有权临时粘结粘合剂组合物和使用其的半导体器件的制造方法公开(公告)号：US09458365B2
公开(公告)日：2016-10-04
申请号：US14334265
申请日：2014-07-17
发明人： Tae-Hoon Kim , Hideto Kato , Jae-Hyun Kim , Jun-Won Han , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Jung-Sik Choi
IPC分类号： C09J183/04 , C09J183/06 , C08G77/00 , C08G77/52 , B32B27/28 , H01L21/683 , H01L25/065 , H01L25/00 , B05D3/02
CPC分类号： C09J183/06 , B05D3/02 , B32B27/283 , C08G77/52 , C08G77/70 , C08L83/00 , C09J183/04 , C09J183/14 , H01L21/6835 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/16225 , H01L2225/06513 , H01L2924/15311
摘要： A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.
摘要翻译： 临时粘合剂组合物包括包含热固性聚有机硅氧烷的第一化合物和包含热塑性聚有机硅氧烷的第二化合物。
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公开(公告)号：US20130328177A1
公开(公告)日：2013-12-12
申请号：US13771609
申请日：2013-02-20
发明人： Yun-Rae Cho , Tae-Hoon Kim , Ho-Geon Song , Seok-Won Lee
IPC分类号： H01L21/56 , H01L23/552
CPC分类号： H01L25/50 , H01L21/565 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L25/03 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48235 , H01L2224/73265 , H01L2224/73267 , H01L2224/92247 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.
摘要翻译： 为了制造堆叠半导体封装，板模具覆盖第一半导体。 板模具包括第一面和与第一面相对的第二面。 第一半导体的有源表面面向第二面。 第一开口从第二表面形成在板模具中。 第一开口设置在第一半导体上。 第二开口从第一表面穿透板模。 导电金属层使用化学镀方法填充第一和第二开口。 多个半导体器件堆叠在基板模具的第一面上。
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公开(公告)号：US09614783B2
公开(公告)日：2017-04-04
申请号：US13838549
申请日：2013-03-15
发明人： Yongsuk Park , Sun-Mi Kim , Dan-Keun Sung , Chan-Hyun Youn , Jin-Won Kim , Ji-Young Cha , Tae-Hoon Kim , Dong-Ki Kang , Hee-Jae Kim , Yong-Sung Park , Young-Joo Han
IPC分类号： G06F15/173 , H04L12/927 , H04L12/801 , H04L29/08 , H04W4/00
CPC分类号： H04L47/808 , H04L47/19 , H04L67/1008 , H04L67/101 , H04L67/1063 , H04L67/327 , H04W4/80
摘要： A method for determining a source and a transmission path to provide content includes receiving a message comprising at least one of channel information of a link between a request device which requests content download and a central management device, available resource amount information of a candidate device, channel information of a link between the candidate device and the central management device, and channel information of a link between the request device and one candidate device. The method also includes determining a source device and the transmission path for providing the content to the request device using an available resource amount of the candidate device, a data rate of the link between the request device and the central management device, a data rate of the link between the request device and the candidate device, and a data rate of the link between the candidate device and the central management device.
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公开(公告)号：US09288880B2
公开(公告)日：2016-03-15
申请号：US14509143
申请日：2014-10-08
发明人： Young-Hoon Cho , Tae-Hyeun Ha , Tae-Hoon Kim , Chang-Won Son , Tae-Je Park
CPC分类号： H05B37/0227 , H05B37/0272 , Y02B20/48
摘要： A network apparatus is provided. The network apparatus includes a communication unit configured to perform communication with at least one device. The apparatus also includes a storage unit configured to store information for an illumination device located within a preset distance range from the at least one device. The apparatus further includes a controller configured to control a light-emitting state of the illumination device located within the preset distance range from the at least one device based on the information stored in the storage unit when a preset event occurs in the at least one device.
摘要翻译： 提供一种网络装置。 网络设备包括被配置为执行与至少一个设备的通信的通信单元。 该装置还包括存储单元，其被配置为存储位于距离至少一个装置的预设距离范围内的照明装置的信息。 该装置还包括控制器，其被配置为当在至少一个设备中发生预设事件时，基于存储在存储单元中的信息来控制位于距离至少一个设备的预设距离范围内的照明设备的发光状态 。
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公开(公告)号：US09270753B2
公开(公告)日：2016-02-23
申请号：US13797105
申请日：2013-03-12
发明人： Yongsuk Park , Sun-Mi Kim , Chan-Hyun Youn , Dan-Keun Sung , Jin-Won Kim , Dong-Ki Kang , Hee-Jae Kim , Yong-Sung Park , Young-Joo Han , Tae-Hoon Kim , Ji-Young Cha
CPC分类号： H04L67/1097
摘要： A cloud service system includes at least one user device, a plurality of clouds for providing different cloud services, and a gateway connected between the user device and the clouds. The gateway selects at least one of the clouds according to predefined Service Level Agreement (SLA) information, and stores content provided from the user device to the selected cloud.
摘要翻译： 云服务系统包括至少一个用户设备，用于提供不同云服务的多个云以及连接在用户设备和云之间的网关。 网关根据预定义的服务水平协议（SLA）信息来选择至少一个云，并将从用户设备提供的内容存储到所选择的云。
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公开(公告)号：US09099460B2
公开(公告)日：2015-08-04
申请号：US14466207
申请日：2014-08-22
发明人： Yun-Rae Cho , Tae-Hoon Kim , Ho-Geon Song , Seok-Won Lee
IPC分类号： H01L25/00 , H01L21/56 , H01L23/552 , H01L23/28 , H01L23/31 , H01L23/00 , H01L25/03 , H01L25/18 , H01L23/498 , H01L23/538
CPC分类号： H01L25/50 , H01L21/565 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L25/03 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48235 , H01L2224/73265 , H01L2224/73267 , H01L2224/92247 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.
摘要翻译： 为了制造堆叠半导体封装，板模具覆盖第一半导体。 板模具包括第一面和与第一面相对的第二面。 第一半导体的有源表面面向第二面。 第一开口从第二表面形成在板模具中。 第一开口设置在第一半导体上。 第二开口从第一表面穿透板模。 导电金属层使用化学镀方法填充第一和第二开口。 多个半导体器件堆叠在基板模具的第一面上。
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公开(公告)号：US10084005B2
公开(公告)日：2018-09-25
申请号：US15239990
申请日：2016-08-18
发明人： Min-Seok Oh , Sang-Joo Lee , Tae-Hoon Kim , Moo-Sup Lim
IPC分类号： H01L27/146 , H01L31/0288
CPC分类号： H01L27/14641 , H01L27/14603 , H01L27/14609 , H01L27/1461 , H01L27/14614 , H01L27/1463 , H01L27/14643 , H01L27/14654 , H01L27/14656 , H01L31/0288
摘要： A shared pixel includes a plurality of photo diode regions, a shared floating diffusion region, a plurality of transfer gates and a blooming layer. Each of the photo diode regions generates photo-charges in response to incident light. The photo diode regions are formed in a semiconductor substrate. The shared floating diffusion region is shared by the plurality of photo diode regions. The shared floating diffusion region is separated from the plurality of photo diode regions in the semiconductor substrate. Each of the transfer gates transfers the photo-charges of a corresponding photo diode region to the shared floating diffusion region in response to a transfer control signal. The blooming layer transfers overflow photo-charges to a power supply voltage node.
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9.发明授权Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure 有权晶片支撑结构，包括晶片支撑结构的半导体封装的中间结构公开(公告)号：US09076701B2
公开(公告)日：2015-07-07
申请号：US14147051
申请日：2014-01-03
发明人： Jun-Won Han , Jae-Hyun Kim , Tae-Hoon Kim , Ho-Geun Lee , You-Jeong Jeong , Jung-Sik Choi
IPC分类号： H01L21/58 , H01L23/00 , B32B7/06 , H01L21/683
CPC分类号： H01L24/14 , B32B7/06 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/3128 , H01L23/49827 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2221/68327 , H01L2221/6834 , H01L2224/0401 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/17181 , H01L2224/81005 , H01L2224/81191 , H01L2224/81203 , H01L2225/06513 , H01L2225/06541 , H01L2924/18161 , H01L2924/3511 , Y10T428/1476 , Y10T428/2839 , H01L2924/00014
摘要： A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.
摘要翻译： 晶片支撑结构包括用于支撑晶片的支撑衬底，用于将晶片从支撑衬底分离的释放层以及用于将晶片附接到支撑衬底的粘合剂层。
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公开(公告)号：US20140363923A1
公开(公告)日：2014-12-11
申请号：US14466207
申请日：2014-08-22
发明人： Yun-Rae Cho , Tae-Hoon Kim , Ho-Geon Song , Seok-Won Lee
CPC分类号： H01L25/50 , H01L21/565 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L25/03 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48235 , H01L2224/73265 , H01L2224/73267 , H01L2224/92247 , H01L2225/0651 , H01L2225/06548 , H01L2225/06562 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.
摘要翻译： 为了制造堆叠半导体封装，板模具覆盖第一半导体。 板模具包括第一面和与第一面相对的第二面。 第一半导体的有源表面面向第二面。 第一开口从第二表面形成在板模具中。 第一开口设置在第一半导体上。 第二开口从第一表面穿透板模。 导电金属层使用化学镀方法填充第一和第二开口。 多个半导体器件堆叠在基板模具的第一面上。
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