Methods of fabricating semiconductor devices

    公开(公告)号:US10186457B2

    公开(公告)日:2019-01-22

    申请号:US15794107

    申请日:2017-10-26

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    Methods of fabricating semiconductor devices

    公开(公告)号:US10522401B2

    公开(公告)日:2019-12-31

    申请号:US16237948

    申请日:2019-01-02

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    INTEGRATED CIRCUIT DEVICE
    4.
    发明申请

    公开(公告)号:US20200312844A1

    公开(公告)日:2020-10-01

    申请号:US16703908

    申请日:2019-12-05

    Abstract: An integrated circuit device includes a first fin-type active area and a second fin-type active area protruding from a substrate and extending in a first direction, an element isolation layer between the first and second fin-type active areas on the substrate, first semiconductor patterns being on a top surface of the first fin-type active area and having channel areas, second semiconductor patterns being on a top surface of the second fin-type active area and having channel areas, a first gate structure extending on the first fin-type active area in a second direction and including a first work function control layer surrounding the first semiconductor patterns and comprising a step portion on the element isolation layer, and a second gate structure extending on the second fin-type active area in the second direction and including a second work function control layer surrounding the second semiconductor patterns.

Patent Agency Ranking