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公开(公告)号：US11315978B2
公开(公告)日：2022-04-26
申请号：US16857839
申请日：2020-04-24
发明人： Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC分类号： H01L27/146 , H04N5/374
摘要： An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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公开(公告)号：US20210057478A1
公开(公告)日：2021-02-25
申请号：US16826455
申请日：2020-03-23
发明人： Kwang-Min Lee , Doo Won Kwon , Seok Jin Kwon , Kyoung Won Na , In Gyu Baek
IPC分类号： H01L27/146
摘要： An image sensor includes a substrate, first and second insulating structures, a first wiring structure, a through via, and first and second connection patterns. The substrate includes a sensor array region and a pad region. The first insulating structure is disposed on a second surface of the substrate. The first wiring structure is formed in the first insulating structure and includes first conductive layers and first vias. The through via passes through the substrate in the pad region and connects to the first wiring structure. The first connection pattern is connected to the first wiring structure. The second insulating structure is disposed on a fourth surface of the first insulating structure. The second connection pattern is connected to the first connection pattern. The first conductive layers include a first wiring, and a second wiring spaced farther from the substrate than the first wiring. The through via contacts the second wiring.
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公开(公告)号：US10651226B2
公开(公告)日：2020-05-12
申请号：US15813843
申请日：2017-11-15
发明人： Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC分类号： H01L27/146 , H04N5/374
摘要： An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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公开(公告)号：US11417699B2
公开(公告)日：2022-08-16
申请号：US16826455
申请日：2020-03-23
发明人： Kwang-Min Lee , Doo Won Kwon , Seok Jin Kwon , Kyoung Won Na , In Gyu Baek
IPC分类号： H01L27/146
摘要： An image sensor includes a substrate, first and second insulating structures, a first wiring structure, a through via, and first and second connection patterns. The substrate includes a sensor array region and a pad region. The first insulating structure is disposed on a second surface of the substrate. The first wiring structure is formed in the first insulating structure and includes first conductive layers and first vias. The through via passes through the substrate in the pad region and connects to the first wiring structure. The first connection pattern is connected to the first wiring structure. The second insulating structure is disposed on a fourth surface of the first insulating structure. The second connection pattern is connected to the first connection pattern. The first conductive layers include a first wiring, and a second wiring spaced farther from the substrate than the first wiring. The through via contacts the second wiring.
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公开(公告)号：US10361239B2
公开(公告)日：2019-07-23
申请号：US15696132
申请日：2017-09-05
发明人： Kwang-Min Lee , GwideokRyan Lee , Seokjin Kwon , Beomsuk Lee , Taeyon Lee , Dongmo Im
IPC分类号： H01L27/146 , H04N9/04 , H04N9/07
摘要： An image sensor having active, peripheral and dummy regions is provided as follows. A dummy through electrode is disposed in the substrate. An active through electrode is disposed in the substrate. An insulation structure in which a color filter is embedded is disposed on the substrate. A dummy bottom electrode is disposed on the insulation structure and connected electrically to the dummy through electrode. An active bottom electrode is disposed on the insulation structure and connected electrically to the active through electrode. A photoelectric conversion layer is disposed on the insulation structure. A top electrode is disposed on the photoelectric conversion layer and the dummy bottom electrode. The top electrode is connected electrically to the dummy bottom electrode. The photoelectric conversion layer is interposed between the top electrode and the active bottom electrode which are separated from each other.
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公开(公告)号：US20180190707A1
公开(公告)日：2018-07-05
申请号：US15813843
申请日：2017-11-15
发明人： Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC分类号： H01L27/146 , H04N5/374
CPC分类号： H01L27/14645 , H01L27/14612 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14689 , H04N5/374
摘要： An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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公开(公告)号：US10797092B2
公开(公告)日：2020-10-06
申请号：US16428940
申请日：2019-05-31
发明人： Gwi-Deok Ryan Lee , Kwang-Min Lee , Beom-Suk Lee , Tae-Yon Lee
IPC分类号： H01L27/146 , H01L27/28 , H01L27/30
摘要： An image sensor of reduced chip size includes a semiconductor substrate having an active pixel region in which a plurality of active pixels are disposed and a power delivery region in which a pad is disposed. A plurality of first transparent electrode layers is disposed over the semiconductor substrate, respectively corresponding to the plurality of active pixels. A second transparent electrode layer is integrally formed across the active pixels. An organic photoelectric layer is disposed between the plurality of first transparent electrode layers and the second transparent electrode layer. An interconnection layer is located at a level that is the same as or higher than an upper surface of the pad with respect to an upper main surface of the semiconductor substrate. The interconnection layer extends from the pad to the second transparent electrode layer, and includes a connector electrically connecting the pad and the second transparent electrode layer.
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公开(公告)号：US10347672B2
公开(公告)日：2019-07-09
申请号：US15653537
申请日：2017-07-19
发明人： Gwi-Deok Ryan Lee , Kwang-Min Lee , Beom-Suk Lee , Tae-Yon Lee
IPC分类号： H01L27/28 , H01L27/146 , H01L27/30
摘要： An image sensor of reduced chip size includes a semiconductor substrate having an active pixel region in which a plurality of active pixels are disposed and a power delivery region in which a pad is disposed. A plurality of first transparent electrode layers is disposed over the semiconductor substrate, respectively corresponding to the plurality of active pixels. A second transparent electrode layer is integrally formed across the active pixels. An organic photoelectric layer is disposed between the plurality of first transparent electrode layers and the second transparent electrode layer. An interconnection layer is located at a level that is the same as or higher than an upper surface of the pad with respect to an upper main surface of the semiconductor substrate. The interconnection layer extends from the pad to the second transparent electrode layer, and includes a connector electrically connecting the pad and the second transparent electrode layer.
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