Invention Grant
- Patent Title: Image sensor having an interconnection covering a black pixel region surrounding an active pixel region
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Application No.: US15653537Application Date: 2017-07-19
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Publication No.: US10347672B2Publication Date: 2019-07-09
- Inventor: Gwi-Deok Ryan Lee , Kwang-Min Lee , Beom-Suk Lee , Tae-Yon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2016-0184355 20161230
- Main IPC: H01L27/28
- IPC: H01L27/28 ; H01L27/146 ; H01L27/30

Abstract:
An image sensor of reduced chip size includes a semiconductor substrate having an active pixel region in which a plurality of active pixels are disposed and a power delivery region in which a pad is disposed. A plurality of first transparent electrode layers is disposed over the semiconductor substrate, respectively corresponding to the plurality of active pixels. A second transparent electrode layer is integrally formed across the active pixels. An organic photoelectric layer is disposed between the plurality of first transparent electrode layers and the second transparent electrode layer. An interconnection layer is located at a level that is the same as or higher than an upper surface of the pad with respect to an upper main surface of the semiconductor substrate. The interconnection layer extends from the pad to the second transparent electrode layer, and includes a connector electrically connecting the pad and the second transparent electrode layer.
Public/Granted literature
- US20180190696A1 IMAGE SENSOR Public/Granted day:2018-07-05
Information query
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