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公开(公告)号:US11315978B2
公开(公告)日:2022-04-26
申请号:US16857839
申请日:2020-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC: H01L27/146 , H04N5/374
Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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公开(公告)号:US10651226B2
公开(公告)日:2020-05-12
申请号:US15813843
申请日:2017-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC: H01L27/146 , H04N5/374
Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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公开(公告)号:US20180190707A1
公开(公告)日:2018-07-05
申请号:US15813843
申请日:2017-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC: H01L27/146 , H04N5/374
CPC classification number: H01L27/14645 , H01L27/14612 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14689 , H04N5/374
Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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