公开(公告)号：US20170150188A1

公开(公告)日：2017-05-25

申请号：US15350521

申请日：2016-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon-yong SEOK ,  Jung-jin KIM ,  In-kwon PAIK ,  Dong-hoon LEE ,  Yong-deok CHANG

IPC: H04N21/234 ,  H04L12/801 ,  H04H40/18 ,  H04N21/61 ,  H04L29/06

CPC classification number: H04N21/234 ,  H04H40/18 ,  H04H60/11 ,  H04H2201/40 ,  H04L47/34 ,  H04L69/22 ,  H04N21/4302 ,  H04N21/435 ,  H04N21/6125 ,  H04N21/615 ,  H04N21/6175

Abstract: A broadcast receiving system including a broadcast receiving apparatus and a controlling method thereof are disclosed. The broadcast receiving apparatus includes a tuner configured to receive a broadcast signal including broadcast data from a broadcast transmitting apparatus, a communicator configured to receive an additional signal including broadcast data and header information regarding the broadcast data from a reference apparatus, and a processor configured to determine the broadcast data included in the additional signal based on the header information and align the broadcast data received from the broadcast transmitting apparatus by using the broadcast data included in the additional signal.

公开(公告)号：US20170133563A1

公开(公告)日：2017-05-11

申请号：US15341293

申请日：2016-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： JIN-WOOK CHUNG ,  Jung-jin KIM ,  Pun-jae CHOI ,  Si-han KIM ,  Sung-don GANG ,  Ah-young WOO

IPC: H01L33/56 ,  H01L33/54 ,  H01L33/50 ,  H01L33/44 ,  H01L33/38 ,  H01L33/60 ,  H01L33/22

CPC classification number: H01L33/56 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.

公开(公告)号：US20150236228A1

公开(公告)日：2015-08-20

申请号：US14574094

申请日：2014-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-jin KIM ,  Min-young SON ,  Yong-min KWON

IPC: H01L33/62 ,  H01L33/50 ,  H04N5/225 ,  H01L33/20 ,  H05B33/08 ,  H01L33/38 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H04N5/2256 ,  H04N5/2257 ,  H05B33/0845

Abstract: A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.

Abstract translation: 发光二极管封装包括发光结构，第一电极焊盘和与发光结构连接的第二电极焊盘，与发光结构的底表面接触的绝缘图案层，并与第一 和第二电极焊盘，包括与绝缘图案层的底面接触的通孔的基板，暴露第一电极焊盘的一部分和第二电极焊盘的一部分，第一穿透电极和第二穿透电极， 设置在通孔中，分别与第一和第二电极焊盘连接，设置在发光结构上的荧光材料层，设置在发光结构上并与发光结构间隔开的玻璃，其间具有荧光材料层。

公开(公告)号：US20140203304A1

公开(公告)日：2014-07-24

申请号：US14095445

申请日：2013-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-hyun KIM ,  Wan-jong KIM ,  Jung-jin KIM ,  Jung-kyu PARK ,  Kyu-ho JANG

IPC: H01L33/52 ,  H05K7/00 ,  H01L27/15

CPC classification number: B29C45/0046 ,  B29C45/14639 ,  B29C2045/0089 ,  B29C2045/2691 ,  B29L2011/00 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

Abstract: Provided is a light-emitting device package strip that includes a lead frame strip, a plurality of resin molding products that are injection-molded in the lead frame strip, and runner and gate members that are formed between adjacent resin molding products and on end sides of a line of adjacent resin molding products, each runner and gate member having a smaller thickness than a thickness of the resin molding products to facilitate cutting thereof.

Abstract translation: 提供一种发光器件封装条，其包括引线框带，在引线框带中注塑成型的多个树脂成型产品，以及形成在相邻树脂成型体之间和端侧的流道和浇口构件 的一条相邻的树脂成型制品，每个浇道和浇口构件的厚度小于树脂模塑制品的厚度，以便切割它们。

公开(公告)号：US20130202993A1

公开(公告)日：2013-08-08

申请号：US13827542

申请日：2013-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  FINE SEMITECH CORP.

Inventor： Jung-jin KIM ,  Bum-hyun AN ,  Chan-uk JEON ,  Jang-dong YOU ,  Sung-wan KIM ,  Ik-jun KIM ,  Jae-hyuck CHOI ,  Han-shin LEE

IPC: G03F1/00

CPC classification number: G03F1/142 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/06 ,  C25D11/18 ,  G03F1/64 ,  Y10T428/13 ,  Y10T428/1317

Abstract: A pellicle frame, including aluminum, aluminum oxide, and a transition metal.

Abstract translation: 防护薄膜组件框架，包括铝，氧化铝和过渡金属。