公开(公告)号：US20170133563A1

公开(公告)日：2017-05-11

申请号：US15341293

申请日：2016-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： JIN-WOOK CHUNG ,  Jung-jin KIM ,  Pun-jae CHOI ,  Si-han KIM ,  Sung-don GANG ,  Ah-young WOO

IPC: H01L33/56 ,  H01L33/54 ,  H01L33/50 ,  H01L33/44 ,  H01L33/38 ,  H01L33/60 ,  H01L33/22

CPC classification number: H01L33/56 ,  H01L33/22 ,  H01L33/382 ,  H01L33/44 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.

公开(公告)号：US20200025351A1

公开(公告)日：2020-01-23

申请号：US16454852

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min KWON ,  Pun-jae CHOI ,  Geun-woo KO ,  Jong-hyun LEE

IPC: F21S41/657 ,  F21S41/141 ,  B60Q1/04

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US20210341125A1

公开(公告)日：2021-11-04

申请号：US17373038

申请日：2021-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min KWON ,  Pun-jae CHOI ,  Geun-woo KO ,  Jong-hyun LEE

IPC: F21S41/657 ,  H01L33/50 ,  H01L25/075 ,  B60Q1/04 ,  F21S41/141 ,  H01L33/02

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US20190067538A1

公开(公告)日：2019-02-28

申请号：US15925037

申请日：2018-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-wook LEE ,  Geun-woo KO ,  Pun-jae CHOI ,  Jae-ho Han

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/36 ,  H01L33/50

Abstract: A light-emitting package includes a light-emitting structure having a first surface and a second surface opposite to the first surface. The light-emitting package further includes an electrode layer disposed on the first surface and an insulating layer disposed on the light-emitting structure and the electrode layer. The light-emitting package additionally includes an interconnection conductive layer penetrating the insulating layer and connected to the electrode layer and a reflective layer disposed between the insulating layer and the interconnection conductive layer. The reflective layer reflects light generated from the light-emitting structure in a direction toward the second surface.