公开(公告)号：US20210356084A1

公开(公告)日：2021-11-18

申请号：US17391346

申请日：2021-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongyun BAEK ,  Jaehong PARK ,  Yusuf CINAR ,  Hanhong LEE

IPC: F21K9/69 ,  G06F1/16 ,  F21V5/02

Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.

公开(公告)号：US20200373221A1

公开(公告)日：2020-11-26

申请号：US16870068

申请日：2020-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf CINAR ,  Jaehong PARK ,  Seongyun BAEK ,  Hanhong LEE

IPC: H01L23/427 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L21/52

Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

公开(公告)号：US20210156527A1

公开(公告)日：2021-05-27

申请号：US16878925

申请日：2020-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongyun BAEK ,  Jaehong PARK ,  Yusuf CINAR ,  Hanhong LEE

IPC: F21K9/69 ,  G06F1/16 ,  F21V5/02

Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.

公开(公告)号：US20190096786A1

公开(公告)日：2019-03-28

申请号：US16204543

申请日：2018-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeHong PARK ,  Hanhong LEE ,  Sungwoo JOO ,  Woon-young BAEK

IPC: H01L23/433 ,  H01L23/04 ,  H01L23/427 ,  H01L23/053 ,  H01L25/065 ,  H01L23/544 ,  H01L23/00 ,  H01L23/40

CPC classification number: H01L23/433 ,  H01L23/04 ,  H01L23/053 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2023/4068 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/1434 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/166 ,  H01L2924/18161 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.