Invention Application
- Patent Title: SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT FROM ONE OR MORE ENDS OF THE PACKAGE
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Application No.: US16204543Application Date: 2018-11-29
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Publication No.: US20190096786A1Publication Date: 2019-03-28
- Inventor: JaeHong PARK , Hanhong LEE , Sungwoo JOO , Woon-young BAEK
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2016-0128451 20161005
- Main IPC: H01L23/433
- IPC: H01L23/433 ; H01L23/04 ; H01L23/427 ; H01L23/053 ; H01L25/065 ; H01L23/544 ; H01L23/00 ; H01L23/40
Abstract:
A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
Public/Granted literature
- US10446471B2 Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package Public/Granted day:2019-10-15
Information query
IPC分类:
