公开(公告)号：US20240087999A1

公开(公告)日：2024-03-14

申请号：US18464182

申请日：2023-09-08

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Chien Jen WANG ,  Ki Wook LEE ,  Yi LIU ,  Shaul BRANCHEVSKY ,  Cai LIANG

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H05K1/111 ,  H01L25/0655

Abstract: A packaging substrate assembly for fabricating a packaged module can include a packaging substrate having a surface, and an array of conductive pads implemented on the surface. The assembly can further include a conductive post formed over each conductive pad, with the conductive post including a first portion having a lateral dimension formed over the conductive pad and a second portion having a lateral dimension formed over the first portion. In some embodiments, the lateral dimension of the first portion is less than the lateral dimension of the second portion. In some embodiments, a dielectric layer can be implemented over the surface to cover the conductive pads and surround the first portion of each conductive post.

公开(公告)号：US20220130686A1

公开(公告)日：2022-04-28

申请号：US17549933

申请日：2021-12-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis DARVEAUX ,  Bruce Joseph FREYMAN ,  Yi LIU

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/552 ,  H01L23/00 ,  H01L23/544 ,  H01L21/268 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/29

Abstract: Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use an encapsulant on solder balls in combination with a dam or a trench to control the distribution of an under-fill material between one or more components and a packaging substrate. The encapsulant can be used in the ball attach process. The fluxing agent leaves behind a material that encapsulates the base of each solder ball. The encapsulant reduces the tendency of the under-fill material to wick around the solder balls by capillary action which can prevent or limit the capillary under-fill material from flowing onto or contacting other components. The dam or trench aids in retaining the under-fill material within a keep out zone to prevent or limit the under-fill material from contacting other components.

公开(公告)号：US20240242974A1

公开(公告)日：2024-07-18

申请号：US18412390

申请日：2024-01-12

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Howard E. CHEN ,  Karen Guadalupe CAMARGO SOTO ,  Heliodoro OSUNA ARAUJO ,  Yi LIU

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/67 ,  H01L23/552

CPC classification number: H01L21/561 ,  H01L21/4853 ,  H01L21/67121 ,  H01L21/67126 ,  H01L23/552

Abstract: Packaged modules can be manufactured by providing or forming a substrate panel having first and second sides, and an array of units, and mounting one or more devices on the first side of the substrate panel for each unit. A first mold layer can be formed over the first side of the substrate panel to provide an assembly, with the first mold layer having an initial thickness that is greater than a final thickness, such that the initial thickness is sufficiently large to prevent warpage of the assembly where a similar assembly having a first mold layer with the final thickness would warp. One or more process operations can be performed on the second side of the substrate panel of the assembly, and a thinning operation can reduce the thickness of the first mold layer from the initial thickness to the final thickness.

公开(公告)号：US20170117184A1

公开(公告)日：2017-04-27

申请号：US15281393

申请日：2016-09-30

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yi LIU ,  Anthony James LOBIANCO ,  Matthew Sean READ ,  Hoang Mong NGUYEN ,  Howard E. CHEN

IPC: H01L21/78 ,  H01L21/3205 ,  H01L23/00 ,  H01L21/683 ,  H01L23/552

CPC classification number: H01L21/78 ,  B23K26/38 ,  H01L21/32051 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2224/81

Abstract: Devices and methods related to fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

公开(公告)号：US20230420301A1

公开(公告)日：2023-12-28

申请号：US18338293

申请日：2023-06-20

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yi LIU ,  Anthony James LOBIANCO ,  Matthew Sean READ ,  Hoang Mong NGUYEN ,  Howard E. CHEN

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/3205 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L21/32051 ,  H01L21/6836 ,  H01L23/552 ,  H01L24/14 ,  H01L23/3128

Abstract: Shielded module fabrication methods and devices. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

公开(公告)号：US20190214300A1

公开(公告)日：2019-07-11

申请号：US16231456

申请日：2018-12-22

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yi LIU ,  Anthony James LOBIANCO ,  Matthew Sean READ ,  Hoang Mong NGUYEN ,  Howard E. CHEN

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/3205 ,  H01L21/683 ,  H01L23/552

CPC classification number: H01L21/78 ,  B23K26/38 ,  H01L21/32051 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2224/81

Abstract: Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

公开(公告)号：US20190181906A1

公开(公告)日：2019-06-13

申请号：US16268418

申请日：2019-02-05

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yi LIU ,  Anthony James LOBIANCO ,  Matthew Sean READ ,  Hoang Mong NGUYEN ,  Howard E. Chen ,  Stephane Richard Marie WLOCZYSIAK ,  William J. DOMINO ,  Bipul AGARWAL

IPC: H04B1/48 ,  H04B1/04 ,  H04B1/00

Abstract: Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.

公开(公告)号：US20180226273A1

公开(公告)日：2018-08-09

申请号：US15885780

申请日：2018-01-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis DARVEAUX ,  Bruce Joseph FREYMAN ,  Yi LIU

IPC: H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L21/78 ,  H01L23/29

CPC classification number: H01L21/563 ,  H01L21/0274 ,  H01L21/268 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/4864 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/544 ,  H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83002 ,  H01L2224/83007 ,  H01L2224/831 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/0665 ,  H01L2924/1421 ,  H01L2924/19011 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include using a dam on a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a dam on a packaging substrate.

公开(公告)号：US20170317710A1

公开(公告)日：2017-11-02

申请号：US15582291

申请日：2017-04-28

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yi LIU ,  Anthony James LOBIANCO ,  Matthew Sean READ ,  Hoang Mong NGUYEN ,  Howard E. Chen ,  Stephane Richard Marie WLOCZYSIAK ,  William J. DOMINO ,  Bipul AGARWAL

IPC: H04B1/48 ,  H01Q1/52

CPC classification number: H04B1/48 ,  H01L2224/11 ,  H01L2224/97 ,  H01Q1/523 ,  H01Q1/526 ,  H04B1/0057 ,  H04B1/0458

Abstract: Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.