公开(公告)号：US20170352399A1

公开(公告)日：2017-12-07

申请号：US15613882

申请日：2017-06-05

Applicant: Renesas Electronics Corporation

Inventor： Yoshisato YOKOYAMA ,  Yoshikazu SAITO ,  Shunya NAGATA ,  Toshiaki SANO ,  Takeshi HASHIZUME

IPC: G11C11/405 ,  G11C8/16 ,  G11C7/06 ,  G11C11/406 ,  H03K19/177 ,  G11C11/408

CPC classification number: G11C11/405 ,  G11C7/062 ,  G11C8/16 ,  G11C11/40603 ,  G11C11/4085 ,  G11C11/4087 ,  G11C29/024 ,  G11C29/32 ,  G11C2029/1202 ,  G11C2207/104 ,  H03K19/1776

Abstract: Provided is a memory macro which allows detection of a fault in a fetch circuit for an address signal which is input. The memory micro includes an address input terminal, a clock input terminal, a memory array and a control unit. The control unit includes a temporary memory circuit which fetches an input address signal which is input into the address input terminal in synchronization with an input clock signal which is input from the clock input terminal and outputs the input address signal as an internal address signal. The memory macro further includes an internal address output terminal which outputs the internal address signal for comparison with the input address signal.

公开(公告)号：US20170117060A1

公开(公告)日：2017-04-27

申请号：US15281947

申请日：2016-09-30

Applicant: Renesas Electronics Corporation

Inventor： Toshiaki SANO ,  Shunya NAGATA ,  Shinji TANAKA

IPC: G11C29/12 ,  G11C11/418 ,  G11C11/419

CPC classification number: G11C29/12 ,  G11C7/1075 ,  G11C8/10 ,  G11C8/16 ,  G11C11/406 ,  G11C11/412 ,  G11C11/418 ,  G11C11/419 ,  G11C29/025 ,  G11C29/12015 ,  G11C29/18 ,  G11C2029/1202

Abstract: A multi-port memory includes a memory cell, first and second word lines, first and second bit lines, first and second address terminals, and an address control circuit. The address control circuit controls the first and second word lines independently of each other on the basis of address signals that are respectively supplied to the first and second address terminals in a normal operation mode, and activates both of the first and second word lines that are coupled to the same memory cell on the basis of the address signal that is supplied to one of the first and second address terminals in a disturb test mode.

公开(公告)号：US20240170054A1

公开(公告)日：2024-05-23

申请号：US18513124

申请日：2023-11-17

Applicant: Renesas Electronics Corporation

Inventor： Daiki KITAGATA ,  Kouji SATOU ,  Toshiaki SANO

IPC: G11C11/419 ,  G11C11/412

CPC classification number: G11C11/419 ,  G11C11/412

Abstract: A plurality of SRAM macros each including a memory cell array, an input/output circuit, a word line driver, and a control circuit are mounted on a semiconductor chip. Each of the SRAM macros includes a determination block disposed in the control circuit and configured to generate a mode signal for determining a read assist amount and a write assist amount based on a power supply voltage of the SRAM macro, and an assist circuit that performs a read assist operation and a write assist operation based on the mode signal generated by the determination block.

公开(公告)号：US20170092352A1

公开(公告)日：2017-03-30

申请号：US15373783

申请日：2016-12-09

Applicant: Renesas Electronics Corporation

Inventor： Toshiaki SANO ,  Ken SHIBATA ,  Shinji TANAKA ,  Makoto YABUUCHI ,  Noriaki MAEDA

IPC: G11C11/419 ,  G11C11/418

CPC classification number: G11C11/419 ,  G11C7/12 ,  G11C8/16 ,  G11C11/412 ,  G11C11/418

Abstract: A semiconductor storage device provided can increase a write margin and suppress increase of a chip area. The semiconductor storage device includes plural memory cells arranged in a matrix; plural bit-line pairs arranged corresponding to each column of the memory cells; a write driver circuit which transmits data to a bit-line pair of a selected column according to write data; and a write assist circuit which drives a bit line on a low potential side of the bit-line pair of a selected column to a negative voltage level. The write assist circuit includes first signal wiring; a first driver circuit which drives the first signal wiring according to a control signal; and second signal wiring which is coupled to the bit line on the low-potential side and generates a negative voltage by the driving of the first driver circuit, based on inter-wire coupling capacitance with the first signal wiring.

公开(公告)号：US20180315470A1

公开(公告)日：2018-11-01

申请号：US15914458

申请日：2018-03-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yoshisato YOKOYAMA ,  Takeshi HASHIZUME ,  Toshiaki SANO

IPC: G11C11/417

Abstract: A semiconductor device includes a memory unit having a memory cell driven by a voltage applied from power supply lines VSS and VDD, and a memory unit potential controller for adjusting the potential of the voltage applied to the memory cell. The memory unit potential controller includes a first potential adjustment part provided between the power supply lines VSS and ARVSS, and a second potential adjustment part provided between the power supply lines VDD and ARVSS. Further, the memory unit potential controller adjusts the potential of the power supply line ARVSS based on a first current supplied between the power supply line VSS and a first end portion of the memory cell through the first potential adjustment part, and adjusts a second current supplied between the power supply lines VDD and ARVSS through the second potential adjustment part, in order to rapidly stabilize the potential applied to the memory cell.

公开(公告)号：US20160240246A1

公开(公告)日：2016-08-18

申请号：US15134981

申请日：2016-04-21

Applicant: Renesas Electronics Corporation

Inventor： Toshiaki SANO ,  Ken SHIBATA ,  Shinji TANAKA ,  Makoto YABUUCHI ,  Noriaki MAEDA

IPC: G11C11/419

CPC classification number: G11C11/419 ,  G11C7/12 ,  G11C8/16 ,  G11C11/412 ,  G11C11/418

Abstract: A semiconductor storage device provided can increase a write margin and suppress increase of a chip area. The semiconductor storage device includes plural memory cells arranged in a matrix; plural bit-line pairs arranged corresponding to each column of the memory cells; a write driver circuit which transmits data to a bit-line pair of a selected column according to write data; and a write assist circuit which drives a bit line on a low potential side of the bit-line pair of a selected column to a negative voltage level. The write assist circuit includes first signal wiring; a first driver circuit which drives the first signal wiring according to a control signal; and second signal wiring which is coupled to the bit line on the low-potential side and generates a negative voltage by the driving of the first driver circuit, based on inter-wire coupling capacitance with the first signal wiring.

公开(公告)号：US20160172022A1

公开(公告)日：2016-06-16

申请号：US15050074

申请日：2016-02-22

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu KOMATSU ,  Masanao YAMAOKA ,  Noriaki MAEDA ,  Masao MORIMOTO ,  Yasuhisa SHIMAZAKI ,  Yasuyuki OKUMA ,  Toshiaki SANO

IPC: G11C11/417

CPC classification number: G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/1104

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract translation: 提供了可以对备用时的保留数据量的变化进行响应的半导体集成电路。 半导体集成电路包括逻辑电路（逻辑）和多个SRAM模块。 多个SRAM模块独立于逻辑电路进行功率控制，并且在多个SRAM模块之间执行独立的功率控制。 具体地，每个SRAM模块的电位控制电路的一个端子和另一个端子分别耦合到单元阵列和本地电力线。 一个SRAM模块的本地电源线和另一个SRAM模块的本地电源线共享一个共享的本地电源线。 一个SRAM模块的电源开关和另一个SRAM模块的电源开关共同耦合到共享的本地电源线。

公开(公告)号：US20190296734A1

公开(公告)日：2019-09-26

申请号：US16286428

申请日：2019-02-26

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yoshisato YOKOYAMA ,  Toshiaki SANO

IPC: H03K17/14 ,  G11C11/418 ,  G11C11/419 ,  G11C11/412 ,  H03K17/284

Abstract: A MOS transistor is allowed to recover from BTI degradation even when an operation mode signal is inactive. A semiconductor device includes a drive circuit coupled to a controlled circuit via a delay element. The drive circuit includes first and second MOS transistors coupled in series to each other. The first MOS transistor is controlled to be in an OFF state when the operation mode signal is active. When the operation mode signal is inactive, the first MOS transistor is controlled to be in the OFF state at least temporarily while the second MOS transistor is controlled to be in the OFF.

公开(公告)号：US20180350430A1

公开(公告)日：2018-12-06

申请号：US16059255

申请日：2018-08-09

Applicant: Renesas Electronics Corporation

Inventor： Shigenobu KOMATSU ,  Masanao YAMAOKA ,  Noriaki MAEDA ,  Masao MORIMOTO ,  Yasuhisa SHIMAZAKI ,  Yasuyuki OKUMA ,  Toshiaki SANO

IPC: G11C11/417 ,  H01L27/11 ,  G11C5/06 ,  G11C11/413 ,  G11C5/14 ,  H01L27/092

CPC classification number: G11C11/417 ,  G11C5/06 ,  G11C5/14 ,  G11C11/413 ,  H01L27/092 ,  H01L27/1104

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

公开(公告)号：US20180240513A1

公开(公告)日：2018-08-23

申请号：US15957263

申请日：2018-04-19

Applicant: Renesas Electronics Corporation

Inventor： Toshiaki SANO ,  Ken SHIBATA ,  Shinji TANAKA ,  Makoto YABUUCHI ,  Noriaki MAEDA

IPC: G11C11/419 ,  G11C7/12

CPC classification number: G11C11/419 ,  G11C7/12 ,  G11C8/16 ,  G11C11/412 ,  G11C11/418

Abstract: A semiconductor storage device provided can increase a write margin and suppress increase of a chip area. The semiconductor storage device includes plural memory cells arranged in a matrix; plural bit-line pairs arranged corresponding to each column of the memory cells; a write driver circuit which transmits data to a bit-line pair of a selected column according to write data; and a write assist circuit which drives a bit line on a low potential side of the bit-line pair of a selected column to a negative voltage level. The write assist circuit includes first signal wiring; a first driver circuit which drives the first signal wiring according to a control signal; and second signal wiring which is coupled to the bit line on the low-potential side and generates a negative voltage by the driving of the first driver circuit, based on inter-wire coupling capacitance with the first signal wiring.