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公开(公告)号：US09508679B2
公开(公告)日：2016-11-29
申请号：US14420181
申请日：2013-03-11
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa , Shintaro Hayashi
IPC: H01L23/00 , B23K20/00 , H01L21/52 , H01L21/683
CPC classification number: H01L24/97 , B23K20/00 , H01L21/52 , H01L21/6836 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2221/68381 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05664 , H01L2224/05669 , H01L2224/2745 , H01L2224/2746 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/2908 , H01L2224/29082 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/32501 , H01L2224/32505 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/75252 , H01L2224/75301 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/7598 , H01L2224/8301 , H01L2224/83013 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83123 , H01L2224/83127 , H01L2224/83193 , H01L2224/83203 , H01L2224/83207 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/83906 , H01L2224/83907 , H01L2224/92247 , H01L2224/97 , H01L2924/01322 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/01032 , H01L2924/01083 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。
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公开(公告)号：US20150287696A1
公开(公告)日：2015-10-08
申请号：US14420181
申请日：2013-03-11
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa , Shintaro Hayashi
IPC: H01L23/00
CPC classification number: H01L24/97 , B23K20/00 , H01L21/52 , H01L21/6836 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2221/68327 , H01L2221/68381 , H01L2224/04026 , H01L2224/05155 , H01L2224/05166 , H01L2224/05664 , H01L2224/05669 , H01L2224/2745 , H01L2224/2746 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/2908 , H01L2224/29082 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/32501 , H01L2224/32505 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/75252 , H01L2224/75301 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2224/7598 , H01L2224/8301 , H01L2224/83013 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83123 , H01L2224/83127 , H01L2224/83193 , H01L2224/83203 , H01L2224/83207 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/83906 , H01L2224/83907 , H01L2224/92247 , H01L2224/97 , H01L2924/01322 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/1461 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/01032 , H01L2924/01083 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
Abstract translation: 将芯片安装在基板上的安装方法包括临时粘合工艺和主要粘结工艺。 暂时粘接过程是根据芯片的数量重复执行第一个基本过程。 第一基本过程包括第一步骤和第二步骤。 第一步是在衬底的第一金属层上对准每个芯片的第二金属层。 第二步是通过使第一和第二金属层进行固相扩散接合来临时粘合每个芯片。 主键合过程是根据芯片的数量重复执行第二个基本过程。 第二基本过程包括第三步骤和第四步骤。 第三步是识别临时安装在基板上的每个芯片的位置。 第四步是通过使第一和第二金属层进行液相扩散接合来牢固地结合每个芯片。
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Patent Agency Ranking
公开(公告)号：US10535807B2
公开(公告)日：2020-01-14
申请号：US15974316
申请日：2018-05-08
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
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公开(公告)号：US09425373B2
公开(公告)日：2016-08-23
申请号：US14774207
申请日：2014-03-11
Inventor： Takanori Aketa , Yoshiharu Sanagawa , Mitsuhiko Ueda , Takaaki Yoshihara , Shintaro Hayashi , Toshihiko Sato
IPC: H01L33/64 , H01L33/62 , H01L23/00 , H01L27/15 , H01L33/38 , H01L33/40 , H01L33/54 , H01L33/56 , H01L33/60
CPC classification number: H01L33/647 , H01L24/32 , H01L27/156 , H01L33/387 , H01L33/40 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
Abstract translation: 发光模块包括：包括具有绝缘性的树脂的第一基板和嵌入树脂中的铜成分; 位于第一基板的铜部件上方的第二基板，并焊接到铜部件上; 形成在所述第二基板上方的安装电极; 以及放置在第二基板上方的LED，并将金锡焊接到安装电极。
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公开(公告)号：US11964294B2
公开(公告)日：2024-04-23
申请号：US17258005
申请日：2019-06-25
Inventor： Mitsuhiko Ueda , Tatsuya Kiriyama , Hiroaki Tachibana , Shogo Shibuya
IPC: A61L9/00 , A61L9/14 , B01J13/04 , B05B5/025 , B05B5/057 , B05B7/06 , B05B7/08 , B05B12/14 , B05B17/06
CPC classification number: B05B5/057 , A61L9/14 , B01J13/046 , B05B5/0255 , B05B7/061 , B05B7/0846 , B05B12/1472 , B05B17/0615 , A61L2209/134 , Y10T428/2984
Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.
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公开(公告)号：US09997685B2
公开(公告)日：2018-06-12
申请号：US14916308
申请日：2014-09-03
Inventor： Takanori Aketa , Mitsuhiko Ueda , Toru Hirano
CPC classification number: H01L33/62 , H01L24/14 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/641 , H01L2924/01322 , H01L2933/0066 , H01L2924/00
Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
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公开(公告)号：US09818923B2
公开(公告)日：2017-11-14
申请号：US15503872
申请日：2015-10-27
Inventor： Mitsuhiko Ueda , Yoshiharu Sanagawa , Takanori Aketa
CPC classification number: H01L33/62 , H01L33/32 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L2224/16145 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
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