公开(公告)号：US08507803B2

公开(公告)日：2013-08-13

申请号：US12722810

申请日：2010-03-12

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

IPC分类号： H05K1/03

CPC分类号： H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

摘要翻译： 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接 第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。 通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

公开(公告)号：US20100327232A1

公开(公告)日：2010-12-30

申请号：US12918731

申请日：2009-09-18

申请人： Masamichi Yamamoto ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Yasuhiro Okuda

IPC分类号： H01B1/20

CPC分类号： H05K3/323 ,  C08G2650/56 ,  C08L29/14 ,  C08L71/00 ,  C09J163/00 ,  H01B1/22 ,  H05K3/361 ,  Y10T428/2857 ,  C08L2666/04

摘要： An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 μm or less, when electrodes are connected with the anisotropic conductive film.

摘要翻译： 各向异性导电膜2包含分散在用于电极连接的粘合剂30中的导电颗粒6，包含作为主要成分的绝缘热固性树脂的环氧树脂的粘合剂，分子量为30,000的苯氧基树脂或 更具体地说，可以使用玻璃化转变温度为100℃以上的潜在硬化剂，聚乙烯醇缩丁醛树脂和玻璃化转变温度为90℃以下的聚乙烯醇缩丁醛树脂。 提供了抑制可修复性降低的高耐热各向异性导电膜，并且当电极与各向异性导电体连接时，可以用于具有更细间距的电极，即具有150μm或更小的最小间距的电极 电影。

公开(公告)号：US20100323147A1

公开(公告)日：2010-12-23

申请号：US12918260

申请日：2009-08-27

申请人： Masamichi Yamamoto ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Yasuhiro Okuda

IPC分类号： B32B5/16 ,  H01B1/20

CPC分类号： H05K3/323 ,  C08G2650/56 ,  C08L2205/05 ,  C08L2666/04 ,  C09J171/00 ,  H05K3/361 ,  Y10T428/24

摘要： There is provided an anisotropic conductive film that contains a radically polymerizable substance, a polymerization initiator that generates a radical by heating, a phenoxy resin having a molecular weight of 30,000 or more, and electrically conductive particles, wherein the anisotropic conductive film has a DSC exothermic onset temperature of 100° C. or lower and a DSC peak temperature of 120° C. or lower when measurement is performed at a rate of temperature increase of 10° C./min. The film is capable of establishing a sufficient electrical connection between circuit boards by heating at a low mounting temperature for a short time and is free from problems such as a reduction in connection performance with time in a high temperature and humidity atmosphere.

摘要翻译： 提供了含有可自由基聚合物质，通过加热产生自由基的聚合引发剂，分子量为30,000以上的苯氧基树脂和导电性粒子的各向异性导电膜，其中各向异性导电膜具有DSC放热 起始温度为100℃以下，当以10℃/分钟的升温速度进行测定时，DSC峰值温度为120℃以下。 该膜能够通过在低安装温度下加热短时间来建立电路板之间的足够的电连接，并且没有诸如在高温和高湿气氛中的连接性能随时间的降低的问题。

公开(公告)号：US20100230141A1

公开(公告)日：2010-09-16

申请号：US12722810

申请日：2010-03-12

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

IPC分类号： H05K1/03 ,  H05K3/36 ,  H05K1/02

CPC分类号： H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

摘要翻译： 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接 第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。 通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

公开(公告)号：US08133412B2

公开(公告)日：2012-03-13

申请号：US12918731

申请日：2009-09-18

申请人： Masamichi Yamamoto ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Yasuhiro Okuda

IPC分类号： H01B1/00 ,  B32B7/12 ,  C08L29/04

CPC分类号： H05K3/323 ,  C08G2650/56 ,  C08L29/14 ,  C08L71/00 ,  C09J163/00 ,  H01B1/22 ,  H05K3/361 ,  Y10T428/2857 ,  C08L2666/04

摘要： An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 μm or less, when electrodes are connected with the anisotropic conductive film.

摘要翻译： 各向异性导电膜2包含分散在用于电极连接的粘合剂30中的导电颗粒6，包含作为主要成分的绝缘热固性树脂的环氧树脂的粘合剂，分子量为30,000的苯氧基树脂或 更具体地说，可以使用玻璃化转变温度为100℃以上的潜在硬化剂，聚乙烯醇缩丁醛树脂和玻璃化转变温度为90℃以下的聚乙烯醇缩丁醛树脂。 提供了抑制可修复性降低的高耐热各向异性导电膜，并且当电极与各向异性导电体连接时，可以用于具有更细间距的电极，即具有150μm或更小的最小间距的电极 电影。

公开(公告)号：US20110250395A1

公开(公告)日：2011-10-13

申请号：US13139926

申请日：2010-06-04

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC分类号： C09J7/00 ,  B32B15/02 ,  H01B1/22 ,  B32B5/16

CPC分类号： H05K3/323 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/023 ,  H05K2203/104 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/268 ,  H01L2924/00 ,  H01L2224/0401

摘要： There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

摘要翻译： 通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。 其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物 并与第一连接电极和第二连接电极接触。

公开(公告)号：US09226406B2

公开(公告)日：2015-12-29

申请号：US13377998

申请日：2010-06-04

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC分类号： B32B9/04 ,  H05K3/32 ,  C09J9/02 ,  H05K3/36 ,  H05K3/28

CPC分类号： H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

摘要： By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

摘要翻译： 通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。 一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤 第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。 在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

公开(公告)号：US08470438B2

公开(公告)日：2013-06-25

申请号：US13139926

申请日：2010-06-04

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC分类号： B32B5/16

CPC分类号： H05K3/323 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/023 ,  H05K2203/104 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/268 ,  H01L2924/00 ,  H01L2224/0401

摘要： There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.

摘要翻译： 通过使用导电性粘合剂将各自包括作为防氧化膜的有机膜彼此连接的连接电极简化为生产工艺，提供了以低成本生产的高可靠性产生的高可靠性的连接结构。 其中第一连接电极2和第二连接电极10之间的导电粘合剂层9彼此连接的电极连接结构包括形成在至少第一连接电极上的有机膜6和11以及包含的导电颗粒8 颗粒的长轴在导电粘合剂层的厚度方向上定向，并且长轴的平均长度大于至少有机膜和导电粘合剂层的总厚度，其中导电颗粒刺穿有机物 并与第一连接电极和第二连接电极接触。

公开(公告)号：US20120085580A1

公开(公告)日：2012-04-12

申请号：US13377998

申请日：2010-06-04

申请人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

发明人： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC分类号： H01R4/00 ,  B23K1/00 ,  C09J9/02 ,  B32B37/12

CPC分类号： H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

摘要： By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

摘要翻译： 通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。 一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤 第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。 在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

公开(公告)号：US08506750B2

公开(公告)日：2013-08-13

申请号：US12401219

申请日：2009-03-10

申请人： Fumihiro Hayashi ,  Yasuhiro Okuda ,  Motomi Nakata

发明人： Fumihiro Hayashi ,  Yasuhiro Okuda ,  Motomi Nakata

IPC分类号： B32B37/00

CPC分类号： A61F2/07 ,  A61F2/89 ,  A61F2002/072 ,  A61F2002/075

摘要： A composite structure comprising two polytetrafluoroethylene porous layers and a framework structural member having a plurality of gaps or openings, the framework structural member being disposed between the two polytetrafluoroethylene porous layers, wherein the composite structure is structured such that the polytetrafluoroethylene porous layers are united together by being adhered with each other through the gaps or openings of the framework structural member and such that the respective polytetrafluoroethylene porous layers (A1) and (A2) are united with the framework structural member closely along the surfaces of the respective constituent elements of the framework structural member in such a manner as to wrap the respective elements. The method of manufacturing the composite structure is characterized in that it includes a step of applying pressure through a mass of fine particles.

摘要翻译： 包括两个聚四氟乙烯多孔层的复合结构和具有多个间隙或开口的框架结构构件，所述框架结构构件设置在所述两个聚四氟乙烯多孔层之间，其中所述复合结构被构造成使得所述聚四氟乙烯多孔层通过 通过框架结构构件的间隙或开口彼此粘合，并且使得相应的聚四氟乙烯多孔层（A1）和（A2）与框架结构构件紧密地沿着框架结构的各个构成元件的表面结合 构件以包裹各个元件的方式。 制造复合结构体的方法的特征在于，其包括通过大量微粒施加压力的步骤。