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公开(公告)号：US20160207144A1
公开(公告)日：2016-07-21
申请号：US14914211
申请日：2014-02-26
发明人： Ryuichi NARITA , Saneyuki GOYA , Kenji MUTA , Toshiya WATANABE , Masao WATANABE
CPC分类号： B23K26/0648 , B23K26/0617 , B23K26/356 , B23K26/38
摘要： In order to simplify a configuration even if laser beams of different wavelength bands are used, a laser output device, which oscillates laser beams of plural wavelength bands, and an irradiation head, which performs irradiation by condensing the laser beams of the respective wavelength bands with focal distances thereof being shifted from each other on the same optical axis S, are included.
摘要翻译： 为了简化配置，即使使用不同波长带的激光束，也可以使振荡多个波长带的激光的激光输出装置和照射头，该照射头通过将各波长带的激光束聚光而进行照射， 其焦距在相同的光轴S上彼此偏移。
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公开(公告)号：US20210162508A1
公开(公告)日：2021-06-03
申请号：US16613543
申请日：2017-08-08
发明人： Ryuichi NARITA , Toshiya WATANABE , Akio KONDOU , Masashi KITAMURA , Hidetaka HARAGUCHI , Shuji TANIGAWA , Claus THOMY , Henry KOEHLER
IPC分类号： B22F12/90 , G01N25/18 , G01N25/72 , B22F10/28 , B22F10/36 , B33Y10/00 , B33Y30/00 , B33Y50/02
摘要： A forming defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of a forming defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether a forming defect exists on the basis of the cooling speed.
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公开(公告)号：US20160221120A1
公开(公告)日：2016-08-04
申请号：US14914222
申请日：2014-02-26
发明人： Ryuichi NARITA , Saneyuki GOYA , Kenji MUTA , Toshiya WATANABE , Masao WATANABE
IPC分类号： B23K26/06
CPC分类号： B23K26/0665 , B23K26/0608 , B23K26/0648 , B23K26/0652 , B23K26/0676
摘要： In order to make focal positions of laser beams having different wavelength bands coincide with one another: a laser output device that oscillates laser beams having plural wavelength bands; a spectrometer that respectively disperses the laser beams of the respective wavelength bands; and condensers that respectively condense the laser beams dispersed by the spectrometer independently and match focal points thereof to the same position, are included.
摘要翻译： 为了使具有不同波长带的激光束的焦点位置彼此一致：激光输出装置，其振荡具有多个波长带的激光束; 分别分散各波长带的激光束的光谱仪; 并且包括分别将由光谱仪分散的激光束分别冷凝并将其焦点匹配到相同位置的电容器。
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公开(公告)号：US20160193693A1
公开(公告)日：2016-07-07
申请号：US14911663
申请日：2015-01-26
发明人： Saneyuki GOYA , Masato KINOUCHI , Atsushi TAKITA , Minoru DANNO , Toshiya WATANABE , Takashi ISHIDE
IPC分类号： B23K26/0622 , B23K26/388 , B23K26/00
摘要： Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.
摘要翻译： 提供一种激光加工方法，其中使用激光加工头，用于至少用短脉冲激光照射具有层压在金属层上的保护层的加工品，以处理加工品，由此高品质，高度 通过用短脉冲激光照射保护层并消融保护层的短脉冲激光加工步骤可以进行准确的处理，以及金属层加工步骤，用于在金属层的烧蚀区域中烧蚀金属层 短脉冲激光加工步骤。
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公开(公告)号：US20210379665A1
公开(公告)日：2021-12-09
申请号：US17406707
申请日：2021-08-19
IPC分类号： B22F10/85 , B33Y10/00 , B33Y30/00 , B33Y50/00 , B22F10/28 , B22F12/90 , B23K26/70 , G01J1/42
摘要： The present invention accurately detects the state of a radiated light beam. According to the present invention, a calibration unit for a metal 3D printer that radiates a light beam at a powder to mold a built part has: a base part that is attached to a stage that is irradiated with the light beam from the metal 3D printer; and a plurality of attachment parts that are provided to the base part at different locations and have detection devices that detect the light beam attached thereto. The attachment parts are provided at different angles such that the detection directions of the detection devices attached thereto are different.
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公开(公告)号：US20210162505A1
公开(公告)日：2021-06-03
申请号：US16613565
申请日：2017-08-08
发明人： Ryuichi NARITA , Toshiya WATANABE , Akio KONDOU , Hidetaka HARAGUCHI , Shuji TANIGAWA , Masashi KITAMURA
摘要： A three-dimensional additive manufacturing device emits a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor detects the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected on the basis of the detection result, before completion of forming of the next layer.
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公开(公告)号：US20200180023A1
公开(公告)日：2020-06-11
申请号：US16615530
申请日：2017-08-08
发明人： Ryuichi NARITA , Toshiya WATANABE , Akio KONDOU , Masashi KITAMURA , Hidetaka HARAGUCHI , Shuji TANIGAWA , Claus THOMY , Henry KOEHLER , Michael KALMS
摘要： A process abnormality detection system for a three-dimensional additive manufacturing device which performs additive modeling by emitting a beam to a powder bed determines that a laying abnormality of the powder bed is occurring if at least one of a first condition that an average height of the powder bed from a reference position is out of a first predetermined range or a second condition that a height variation of the powder bed is out of a second predetermined range is satisfied, on the basis of a detection result of a shape measurement sensor.
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公开(公告)号：US20170182590A1
公开(公告)日：2017-06-29
申请号：US15300207
申请日：2015-01-26
发明人： Saneyuki GOYA , Kenji MUTA , Toshiya WATANABE , Takashi ISHIDE
IPC分类号： B23K26/062 , B23K26/082 , B23K26/21 , B23K26/32 , B23K26/342 , H01S5/042 , B23K26/40 , H01S5/024 , H01S5/42 , H01S5/00 , H01S5/40 , B23K26/0622 , B23K26/38
CPC分类号： B23K26/062 , B23K26/0622 , B23K26/0624 , B23K26/082 , B23K26/0884 , B23K26/21 , B23K26/32 , B23K26/34 , B23K26/342 , B23K26/38 , B23K26/40 , B23K2103/05 , H01S5/0071 , H01S5/02423 , H01S5/02476 , H01S5/042 , H01S5/4012 , H01S5/423
摘要： Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.
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公开(公告)号：US20160008920A1
公开(公告)日：2016-01-14
申请号：US14770015
申请日：2013-11-22
发明人： Saneyuki GOYA , Masato KINOUCHI , Minoru DANNO , Toshiya WATANABE , Takashi ISHIDE , Tsugumaru YAMASHITA , Yoshihito FUJITA , Makoto YAMASAKI , Ryu SUZUKI , Kohei KANAOKA
IPC分类号： B23K26/06 , B23K26/34 , B23K26/352 , B23K26/0622
CPC分类号： B23K26/0652 , B23K26/082 , B23K26/36 , B23K26/38
摘要： A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.
摘要翻译： 提供一种以简单的结构更精确地进行处理的处理装置和处理方法。 处理装置包括照射头16和控制装置。 照射头16包括激光转动单元35和聚光光学系统37.激光转向单元35包括第一棱镜51，第二棱镜52，第一旋转机构53和第二旋转机构54.控制装置调节 基于至少工件的热影响层与激光的转动速度之间的关系，第一棱镜51和第二棱镜52的旋转速度和相位角之间的差异。
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公开(公告)号：US20150352666A1
公开(公告)日：2015-12-10
申请号：US14655281
申请日：2013-11-22
发明人： Yoshihito FUJITA , Tsugumaru YAMASHITA , Saneyuki GOYA , Makoto YAMASAKI , Ryu SUZUKI , Kohei KANAOKA , Takashi ISHIDE , Toshiya WATANABE
IPC分类号： B23K26/06 , B23K26/03 , B23K26/40 , B23K26/20 , B23K26/34 , B23K26/38 , B23K26/14 , B23K26/04
CPC分类号： B23K26/032 , B23K26/00 , B23K26/046 , B23K26/06 , B23K26/0652 , B23K26/14 , B23K26/26 , B23K26/34 , B23K26/38 , B23K26/382 , B23K26/40 , B23K26/402 , B23K2103/04 , B23K2103/05 , B23K2103/08 , B23K2103/14 , B23K2103/16 , B23K2103/26 , B23K2103/42 , B23K2103/50 , B23K2103/52
摘要： Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head (16) and a controller; and the irradiation head (16) can be divided into a collimate optical system, a laser revolving unit (35), and a light collection optical system (37). The laser revolving unit (35) has a first prism (51), a second prism (52), a first rotation mechanism (53), and a second rotation mechanism (54). The controller controls the rotational speeds and the difference in phase angles of the first prism (51) and the second prism (52), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.
摘要翻译： 提供一种可以以简单的结构进行更高精度的加工的加工装置和加工方法。 加工装置具有照射头（16）和控制器; 并且照射头（16）可以分为准直光学系统，激光旋转单元（35）和光收集光学系统（37）。 激光旋转单元（35）具有第一棱镜（51），第二棱镜（52），第一旋转机构（53）和第二旋转机构（54）。 至少基于待加工构件的热影响层与旋转速度之间的关系，控制器控制第一棱镜（51）和第二棱镜（52）的旋转速度和相位角的差异 的激光。
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