LASER PROCESSING APPARATUS
    1.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号:US20160207144A1

    公开(公告)日:2016-07-21

    申请号:US14914211

    申请日:2014-02-26

    IPC分类号: B23K26/06 B23K26/38 B23K26/00

    摘要: In order to simplify a configuration even if laser beams of different wavelength bands are used, a laser output device, which oscillates laser beams of plural wavelength bands, and an irradiation head, which performs irradiation by condensing the laser beams of the respective wavelength bands with focal distances thereof being shifted from each other on the same optical axis S, are included.

    摘要翻译: 为了简化配置,即使使用不同波长带的激光束,也可以使振荡多个波长带的激光的激光输出装置和照射头,该照射头通过将各波长带的激光束聚光而进行照射, 其焦距在相同的光轴S上彼此偏移。

    LASER PROCESSING DEVICE
    3.
    发明申请

    公开(公告)号:US20220203480A1

    公开(公告)日:2022-06-30

    申请号:US17607131

    申请日:2019-07-31

    摘要: This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.

    LASER PROCESSING DEVICE
    4.
    发明申请

    公开(公告)号:US20210060706A1

    公开(公告)日:2021-03-04

    申请号:US16788957

    申请日:2020-02-12

    IPC分类号: B23K26/38 B23K26/14

    摘要: A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.

    LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

    公开(公告)号:US20220410319A1

    公开(公告)日:2022-12-29

    申请号:US17777779

    申请日:2019-11-22

    IPC分类号: B23K26/38 B23K26/40

    摘要: A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.

    LASER CUTTING METHOD AND LASER CUTTING DEVICE

    公开(公告)号:US20220395930A1

    公开(公告)日:2022-12-15

    申请号:US17776014

    申请日:2019-11-15

    IPC分类号: B23K26/38 B23K26/082

    摘要: In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.

    COMPOSITE MATERIAL PROCESSING APPARATUS AND COMPOSITE MATERIAL PROCESSING METHOD

    公开(公告)号:US20230093386A1

    公开(公告)日:2023-03-23

    申请号:US17866949

    申请日:2022-07-18

    IPC分类号: B23K26/38

    摘要: An object is to improve the quality of a processed composite material without reducing the processing rate. A processing apparatus includes a laser head configured to irradiate a front face of a composite material with a laser beam and a gas supply unit configured to supply an assist gas to an irradiation point irradiated with the laser beam by the laser head. The gas supply unit has a first-level nozzle configured to eject the assist gas to an area at or near the irradiation point and a second nozzle configured to eject the assist gas to an area at or near the irradiation point and arranged above the first-level nozzle. The angle of the direction in which the first-level nozzle ejects the assist gas relative to the front face differs from the angle of the direction in which the second nozzle ejects the assist gas relative to the front face.