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公开(公告)号：US20210237155A1
公开(公告)日：2021-08-05
申请号：US17238889
申请日：2021-04-23
发明人： Yoshinao KOMATSU , Masaya HATANAKA
摘要： An atomizer nozzle includes: a molten metal nozzle extending in a vertical direction and which allows a molten metal to flow downward from a lower end thereof; and a gas nozzle including a chamber having an inner peripheral surface surrounding an outer periphery of the molten metal nozzle, a blow portion which introduces a gas to the chamber toward a circumferential direction of the molten metal nozzle, and a cover extending from the chamber to a position below the lower end of the molten metal nozzle while surrounding the molten metal nozzle, wherein the cover is provided with a tapered inner peripheral surface connected to the inner peripheral surface of the chamber and of which diameter is decreased as close to a lower end portion of the tapered inner peripheral surface.
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公开(公告)号：US20230132492A1
公开(公告)日：2023-05-04
申请号：US17965338
申请日：2022-10-13
发明人： Koki ITO , Jiro YONEDA , Yoshinao KOMATSU
摘要： An additive manufacturing device of the present disclosure includes a bottom portion having an additive manufacturing area on which an additive manufacturing article is additively manufactured, a ceiling portion positioned above the bottom portion and having a blowing part for an inert gas, a side portion standing upward from a side end portion of the bottom portion, and a discharge port of the inert gas, in which under a condition where a first direction is oriented from the additive manufacturing area toward the discharge port in a direction parallel to the bottom portion and a second direction is oriented across the first direction in the direction parallel to the bottom portion, a first width of the blowing part in the second direction is larger than a second width of the blowing part in the first direction and is equal to or larger than a third width of the additive manufacturing area in the second direction.
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公开(公告)号：US20220168848A1
公开(公告)日：2022-06-02
申请号：US17437941
申请日：2019-06-28
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA , Masahiko SHIMIZU , Ryota OZAKI , Yuki KANI
IPC分类号： B23K26/364 , B23K26/14 , B23K26/142
摘要： A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.
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公开(公告)号：US20210276132A1
公开(公告)日：2021-09-09
申请号：US17158264
申请日：2021-01-26
发明人： Yoshinao KOMATSU , Kazuhiro YOSHIDA , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA
IPC分类号： B23K26/38 , B23K26/142 , B23K26/16 , B23K26/70
摘要： A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.
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公开(公告)号：US20190091801A1
公开(公告)日：2019-03-28
申请号：US16135146
申请日：2018-09-19
发明人： Yoshinao KOMATSU
IPC分类号： B23K26/16 , B23K26/142 , B23K26/38
摘要： A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet injection part configured to inject jets toward the fusing part or the section to be cut along respective outer circumferential sides of the pressure waves.
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公开(公告)号：US20230095489A1
公开(公告)日：2023-03-30
申请号：US17894420
申请日：2022-08-24
发明人： Saneyuki GOYA , Junichiro MIYAGAKI , Jiro YONEDA , Yoshinao KOMATSU , Koki ITO
IPC分类号： B23K26/142 , B23K26/14
摘要： An object of the disclosure is to improve processing performance. Another object of the disclosure is to improve a working environment and reduce a failure of a processing apparatus. The processing apparatus includes a processing stage on which a composite material is set, a laser head that emits a laser beam in a predetermined direction to the composite material set on the processing stage, a blow off unit that blows off a shield gas to an irradiation point irradiated with the laser beam by the laser head, and an intake unit that takes in the shield gas blown from the blow off unit. The blow off unit and the intake unit are provided so as to interpose the irradiation point and face each other in a first intersecting direction and cause the shield gas to flow in one direction.
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公开(公告)号：US20220203480A1
公开(公告)日：2022-06-30
申请号：US17607131
申请日：2019-07-31
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA , Masahiko SHIMIZU
IPC分类号： B23K26/364 , B23K26/142 , B23K26/14
摘要： This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.
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公开(公告)号：US20210060706A1
公开(公告)日：2021-03-04
申请号：US16788957
申请日：2020-02-12
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA
摘要： A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.
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