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公开(公告)号：US20220168848A1
公开(公告)日：2022-06-02
申请号：US17437941
申请日：2019-06-28
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA , Masahiko SHIMIZU , Ryota OZAKI , Yuki KANI
IPC分类号： B23K26/364 , B23K26/14 , B23K26/142
摘要： A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.
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公开(公告)号：US20220410319A1
公开(公告)日：2022-12-29
申请号：US17777779
申请日：2019-11-22
发明人： Saneyuki GOYA , Akiko INOUE , Ryuichi NARITA , Akihisa OKUDA , Ryota OZAKI , Masahiko SHIMIZU , Hiroki MORI
摘要： A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.
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公开(公告)号：US20220395930A1
公开(公告)日：2022-12-15
申请号：US17776014
申请日：2019-11-15
发明人： Saneyuki GOYA , Ryuichi NARITA , Akiko INOUE , Hiroki MORI , Ryota OZAKI , Masahiko SHIMIZU
IPC分类号： B23K26/38 , B23K26/082
摘要： In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.
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公开(公告)号：US20220184745A1
公开(公告)日：2022-06-16
申请号：US17437466
申请日：2019-03-27
发明人： Akiko INOUE , Saneyuki GOYA
IPC分类号： B23K26/38 , B23K26/082 , B23K26/06 , B23K26/402
摘要： A laser processing system and a laser processing method that reduce irregularities on a cutting surface caused by a variation in a heat affected zone or a difference in the heat affected zone due to processing by a laser beam. The laser processing system is provided with: a laser processing device that scans a composite material containing reinforced fibers and a resin with a laser beam to process the composite material; and a control device that controls the laser processing device. The control device calculates a scanning angle formed by a fiber direction that is a direction of the reinforced fibers and a scanning direction that is a direction in which the laser beam is caused to scan, calculates a scanning condition of the laser beam on the basis of the calculated scanning angle, and controls scanning of the laser beam on the basis of the calculated scanning condition.
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公开(公告)号：US20220234144A1
公开(公告)日：2022-07-28
申请号：US17615714
申请日：2019-06-05
发明人： Hiroki MORI , Saneyuki GOYA , Akiko INOUE
IPC分类号： B23K26/38 , B23K26/402 , B23K26/06
摘要： A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.
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公开(公告)号：US20210276132A1
公开(公告)日：2021-09-09
申请号：US17158264
申请日：2021-01-26
发明人： Yoshinao KOMATSU , Kazuhiro YOSHIDA , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA
IPC分类号： B23K26/38 , B23K26/142 , B23K26/16 , B23K26/70
摘要： A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.
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公开(公告)号：US20220234143A1
公开(公告)日：2022-07-28
申请号：US17615706
申请日：2019-06-05
发明人： Hiroki MORI , Akiko INOUE , Saneyuki GOYA
IPC分类号： B23K26/38 , B23K26/402 , B23K26/035
摘要： A method for performing cutting machining by applying a laser beam to the surface of a base material formed from a composite material and cutting the base material to be cut out a product from the base material, a machining line, serving as a boundary between the product to be cut out and a remainder which is the base material after the product is cut out, is set to the base material before the cutting machining, and a plurality of machining paths along the machining line are set to be arranged from the machining line side to the remainder side with the machining line side as a reference. In the cutting machining, the base material is cut by repeatedly executing a laser beam application step for applying the laser beam to the surface of the base material on the basis of the plurality of machining paths having been set.
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8.发明申请公开(公告)号：US20170275739A1
公开(公告)日：2017-09-28
申请号：US15511005
申请日：2015-10-13
发明人： Akiko INOUE , Takayuki TAKAHASHI , Hiroaki SATO
摘要： A method for producing an aluminum alloy member includes an extrusion step for subjecting an aluminum (Al) alloy which contains from 1.6% by mass to 2.6% by mass (inclusive) of magnesium (Mg), from 6.0% by mass to 7.0% by mass (inclusive) of zinc (Zn), 0.5% by mass or less of copper (Cu), from 0.01% by mass to 0.05% by mass (inclusive) of titanium (Ti) with the balance made up of aluminum (Al) and unavoidable impurities to hot extrusion. The method further includes a cooling step for cooling the aluminum alloy after the extrusion. The method further includes a strain processing step for introducing strain that miniaturizes precipitates precipitated in the crystal grains of the aluminum alloy after the cooling. The method further includes an aging step for aging the aluminum alloy by heating.
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公开(公告)号：US20220203480A1
公开(公告)日：2022-06-30
申请号：US17607131
申请日：2019-07-31
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA , Masahiko SHIMIZU
IPC分类号： B23K26/364 , B23K26/142 , B23K26/14
摘要： This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.
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公开(公告)号：US20210060706A1
公开(公告)日：2021-03-04
申请号：US16788957
申请日：2020-02-12
发明人： Kazuhiro YOSHIDA , Yoshinao KOMATSU , Saneyuki GOYA , Akiko INOUE , Yasuyuki FUJIYA , Ryuichi NARITA
摘要： A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.
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