LASER PROCESSING DEVICE
    1.
    发明申请

    公开(公告)号:US20220203480A1

    公开(公告)日:2022-06-30

    申请号:US17607131

    申请日:2019-07-31

    摘要: This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.

    LASER PROCESSING DEVICE
    2.
    发明申请

    公开(公告)号:US20210060706A1

    公开(公告)日:2021-03-04

    申请号:US16788957

    申请日:2020-02-12

    IPC分类号: B23K26/38 B23K26/14

    摘要: A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.

    THERMAL SPRAY NOZZLE AND PLASMA THERMAL SPRAY DEVICE

    公开(公告)号:US20210087668A1

    公开(公告)日:2021-03-25

    申请号:US16634645

    申请日:2018-09-25

    IPC分类号: C23C4/134

    摘要: A plasma thermal spray device includes a nozzle body (41) having a main flow passage (48) that has a plasma flame (37) formed therein in a direction toward a downstream side from an upstream end (41A) disposed on one side in an axis direction, and extending along an axis (Ax); a powder introduction port (43) that is provided in a portion of the nozzle body (41) located the downstream side from the upstream end (41A) and introduces thermal spray powder (36) from a radially outer side to the plasma flame (37); and a fluid introduction port (45) that is provided at a position closer to the downstream side than a formation position of the powder introduction port (43) in the nozzle body (41) and introduces a working fluid into the main flow passage (48) from the radially outer side of the nozzle body (41).

    LASER PROCESSING DEVICE
    6.
    发明申请

    公开(公告)号:US20210276132A1

    公开(公告)日:2021-09-09

    申请号:US17158264

    申请日:2021-01-26

    摘要: A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.