公开(公告)号：US07192882B2

公开(公告)日：2007-03-20

申请号：US10500310

申请日：2002-12-27

Applicant: Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

Inventor： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

IPC: H01L21/302

CPC classification number: H01P11/008

Abstract: The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

Abstract translation: 本发明涉及一种用于制造用于电磁波部件的衬底中的空腔的方法，所述方法包括通过将衬底浸入化学蚀刻剂的液体浴中去除材料来从所述衬底移除材料来提供所述腔体， 使得所得到的空腔具有顶侧和底侧以及侧壁，并且所述顶部和/或底侧中的一个处的所述空腔具有至少四边形开口，该开口具有至少两个不同相邻角度的开口。 本发明还涉及用于微波应用的组件。

公开(公告)号：US20050215020A1

公开(公告)日：2005-09-29

申请号：US10500310

申请日：2002-12-27

Applicant: Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

Inventor： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

IPC: B81C1/00 ,  H01P11/00 ,  H01L21/8222

CPC classification number: H01P11/008

Abstract: The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

Abstract translation: 本发明涉及一种用于制造用于电磁波部件的衬底中的空腔的方法，所述方法包括通过将衬底浸入化学蚀刻剂的液体浴中去除材料来从所述衬底去除材料来提供所述空腔， 使得所得到的空腔具有顶侧和底侧以及侧壁，并且所述顶部和/或底侧中的一个处的所述空腔具有至少四边形开口，该开口具有至少两个不同相邻角度的开口。 本发明还涉及用于微波应用的组件。

公开(公告)号：US06724283B2

公开(公告)日：2004-04-20

申请号：US09984438

申请日：2001-10-30

Applicant: Leif Bergstedt ,  Spartak Gevorgian

Inventor： Leif Bergstedt ,  Spartak Gevorgian

IPC: H01P308

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/0237 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09809

Abstract: The invention relates to a microwaveguide that is integrated in the dielectric layer of a conductor carrier, e.g. a printed circuit board. The waveguide enables different types of active and/or passive functions intended to influence the signals sent through the waveguide to be integrated at appropriate positions in the waveguide.

Abstract translation: 本发明涉及一种集成在导体载体的介电层中的微波导体，例如， 印刷电路板。 波导使不同类型的有源和/或无源功能旨在影响通过波导发送的信号，以集成在波导中的适当位置。

公开(公告)号：US06369677B1

公开(公告)日：2002-04-09

申请号：US09383915

申请日：1999-08-26

Applicant: Spartak Gevorgian ,  Leif Bergstedt

Inventor： Spartak Gevorgian ,  Leif Bergstedt

IPC: H01P308

CPC classification number: H01P3/085

Abstract: More even current distribution in a transmission line is provided by an arrangement including a first conductive layer, a dielectric layer and a ground plane. The first conductive layer, the dielectric layer and the ground plane extend mainly in substantially the same direction, with the dielectric layer arranged between the first conductive layer and the ground plane. The arrangement includes an object located between the dielectric layer and the ground plane. The object can be electrically conductive or made of a dielectric material.

Abstract translation: 通过包括第一导电层，电介质层和接地平面的布置来提供传输线中更均匀的电流分布。 第一导电层，电介质层和接地面主要以大致相同的方向延伸，其中电介质层布置在第一导电层和接地平面之间。 该布置包括位于介电层和接地平面之间的物体。 该物体可以是导电的或由电介质材料制成。

公开(公告)号：US06617509B1

公开(公告)日：2003-09-09

申请号：US09495481

申请日：2000-02-01

Applicant: Leif Bergstedt ,  Per Ligander ,  Spartak Gevorgian

Inventor： Leif Bergstedt ,  Per Ligander ,  Spartak Gevorgian

IPC: H01B734

CPC classification number: H05K1/162 ,  H05K1/0231 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/09318

Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index &egr;r than the dielectric material.

Abstract translation: 介绍了减少导体载体上导体之间串扰的方法和装置，以及制造包括这些布置在内的导体载体的方法。 通过在每个导体和接地平面之间的空间中提供介电材料来防止导体之间的串扰，使得电场可以在该空间内被束缚，并且因此防止了场线到同侧导体的泄漏。 通过在导体的正下方的空间中的布置来增加电容，以便减小导体与接地面之间的距离和/或通过介电材料的介质，该介质具有比介电材料更高的介电常数εir。

公开(公告)号：US06951797B1

公开(公告)日：2005-10-04

申请号：US10111138

申请日：2000-10-17

Applicant: Leif Bergstedt ,  Gert Andersson ,  Britta Ottosson

Inventor： Leif Bergstedt ,  Gert Andersson ,  Britta Ottosson

IPC: H01L27/14 ,  H01L31/00

CPC classification number: H01L24/83 ,  B81B2207/092 ,  B81B2207/097 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/031 ,  H01L23/10 ,  H01L23/481 ,  H01L24/32 ,  H01L24/48 ,  H01L24/94 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

Abstract translation: 本发明涉及一种将第一构件（110,210,130,230,410,430,510,530,610）与第二硅构件（120,220,420a，420b，600）通过 阳极结合。 该方法包括以下步骤：在将所述第一和第二部件放置在一起用于阳极接合之前，在所述第一部件可接合部分（170a，170b，270,470a，470b，470c，570,620）上选择性地沉积。

公开(公告)号：US06690583B1

公开(公告)日：2004-02-10

申请号：US09574243

申请日：2000-05-19

Applicant: Leif Bergstedt ,  Per Ligander

Inventor： Leif Bergstedt ,  Per Ligander

IPC: H05K702

CPC classification number: H01L24/82 ,  H01L21/4807 ,  H01L23/3731 ,  H01L23/3737 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043

Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

Abstract translation: 提供了用于一个或几个电子部件并且在至少一个表面上为部件提供空间的载体。 载体具有至少部分导电的低温烧结陶瓷（LTCC）材料，具有良好的导热能力，使得载体为组件提供机械支撑并传导部件产生的热量。

公开(公告)号：US06552265B1

公开(公告)日：2003-04-22

申请号：US09412697

申请日：1999-10-05

Applicant: Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

Inventor： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

IPC: H07L2328

CPC classification number: H05K1/186 ,  H05K1/185 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49169

Abstract: A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

Abstract translation: 紧凑的印刷电路板组件具有安装在其上的电子部件（5,12）的图案化铜涂覆的基板（1）。 根据组件的高度，SBU漆（11）或非流动预浸料（3）和层压板（4）围绕电子部件。 然后将该子组件夹在两个RC（树脂涂覆的）铜箔（8）之间，树脂（7）面向部件（5,12）并将它们进行掩埋，从而提供可通过微孔连接的新的可蚀刻铜表面 （10）连接到嵌入式部件（5,12）。

公开(公告)号：US06459585B1

公开(公告)日：2002-10-01

申请号：US09520840

申请日：2000-03-08

Applicant: Leif Bergstedt ,  Per Ligander

Inventor： Leif Bergstedt ,  Per Ligander

IPC: H05K720

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

Abstract translation: 安装在板（20）上的部件（16）被冷却表面（15）冷却，该冷却表面与金属螺柱（8）形式的散热元件接触，冷却表面又可以连接到外部冷却 表面。 实现这一点的一种方法是在层叠体（1）中形成孔（4），蚀刻图案（5），将金属柱（8）放置在孔（4）中，将电介质（9）施加到上下 （1）的侧面，在电介质（9）中形成开口（14），然后金属电镀整个电路板并蚀刻其它图案。 组件16然后可以安装在印刷电路板（20）上。 散热元件（8）包括切割边缘（18）并且可以有益地使用该方法的一个实施例。

公开(公告)号：US06421225B2

公开(公告)日：2002-07-16

申请号：US09333880

申请日：1999-06-15

Applicant: Leif Bergstedt

Inventor： Leif Bergstedt

IPC: H01G420

CPC classification number: H05K1/162 ,  H05K1/167 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672

Abstract: Invention refers to an electric component, preferably a component buried in a Printed Circuit Board (PCB) including at least two conductive layers (13,21, 36; 15, 35) and an intermediate layer (14, 37). The intermediate layer (14, 37) further consists of at least two layers (16, 17, 22, 23, 38, 39, 40): at least a first layer (17, 23, 39) and a second layer (16, 22, 38, 40), which at least first layer has more elastic characteristic than the second layer (16, 22, 38, 40) at a certain temperature and/or pressure.

Abstract translation: 本发明涉及一种电子部件，优选埋入包括至少两个导电层（13,21,36; 15,35）和中间层（14,37）的印刷电路板（PCB）中的部件。 中间层（14,37）还包括至少两层（16,17,22,23,38,39,40）：至少第一层（17,23,39）和第二层（16， 22,38,40），其至少第一层在一定温度和/或压力下具有比第二层（16,22,38,40）更具弹性的特性。