Photocathode having ultra-thin protective layer
    1.
    发明授权
    Photocathode having ultra-thin protective layer 失效
    光电阴极具有超薄的保护层

    公开(公告)号:US06674235B2

    公开(公告)日:2004-01-06

    申请号:US10112888

    申请日:2002-04-01

    IPC分类号: H01J4006

    CPC分类号: H01J1/34 H01J40/06

    摘要: A photocathode structure having a photoelectric face plate protective layer, in order to prevent a photoelectric effect from being deteriorated sharply due to a high reaction of oxygen with respect to most of existing photoelectric face plate materials when the photoelectric face plate used for generating photoelectrons by a photoelectric effect is exposed to the atmosphere, is provided. For example, a diamond-like carbon thin layer is used as a photocathode protective layer, to thereby perform a function of protection of the photoelectric face plate through isolation of the photoelectric face plate from the atmosphere and enable electrons generated from the photoelectric face plate to pass through a diamond-like carbon thin layer, which is deposited thinly, by the tunneling effect so that the performance of the photocathode is not affected. By using the protective layer, the processes subsequent to the photoelectric face plate deposition process can be freely performed in the atmosphere, to thereby simplify the whole process. As a result, a production cost is lowered, and manufacturing of a device or apparatus using a large-are photocathode is facilitated.

    摘要翻译: 一种具有光电面板保护层的光电阴极结构,为了防止光电效应由于氧气相对于大多数现有光电面板材料而产生的高反应,当用于通过光电面板产生光电子的光电面板 提供光电效应暴露在大气中。 例如,使用类金刚石碳薄膜作为光电阴极保护层,由此通过将光电面板与大气隔离来实现保护光电面板的功能,并且能够使从光电面板产生的电子 通过通过隧道效应薄沉积的类金刚石碳薄层,使得光电阴极的性能不受影响。 通过使用保护层,可以在大气中自由进行光电面板沉积处理之后的处理,从而简化整个处理。 结果,降低了制造成本,并且促进了使用大的光电阴极的装置或装置的制造。

    Apparatus and method for photo-induced process
    2.
    发明授权
    Apparatus and method for photo-induced process 失效
    光诱导过程的装置和方法

    公开(公告)号:US06866721B2

    公开(公告)日:2005-03-15

    申请号:US10113750

    申请日:2002-04-01

    摘要: Apparatus for a photo-induced process are provided, which implement a transparent film (instead of an optical window), to reduce light absorption loss that would result from use of an optical window. A photo-induced process apparatus eliminates problems of conventional systems which use optical windows, such as blurring an optical window and the surface of a light source, photo absorption loss due to the optical window and/or a purge cleaning gas, and dust generation by a moving part such as a flexible curtain. A photo-induced process apparatus efficiently utilizes light emitted from a light source.

    摘要翻译: 提供了一种用于光诱导工艺的装置,其实现透明膜(而不是光学窗口),以减少由于使用光学窗口而导致的光吸收损失。 光感应处理装置消除了使用光学窗口的常规系统的问题,例如模糊光学窗口和光源的表面,由于光学窗口和/或吹扫清洁气体引起的光吸收损失,以及通过 诸如柔性窗帘的移动部件。 感光处理装置有效地利用从光源发出的光。

    Programming method of a non-volatile memory device having a charge storage layer between a gate electrode and a semiconductor substrate
    4.
    发明授权
    Programming method of a non-volatile memory device having a charge storage layer between a gate electrode and a semiconductor substrate 失效
    在栅电极和半导体衬底之间具有电荷存储层的非易失性存储器件的编程方法

    公开(公告)号:US07170794B2

    公开(公告)日:2007-01-30

    申请号:US10971201

    申请日:2004-10-21

    IPC分类号: G11C11/34

    CPC分类号: G11C16/0425

    摘要: A programming method of a non-volatile memory device includes a pre-program of the non-volatile memory device, and a main-program of the pre-programmed non-volatile memory device. The non-volatile memory device may include a tunnel dielectric layer, a charge storage layer, a blocking dielectric layer, and a gate electrode, which are sequentially stacked on a semiconductor substrate. The charge storage layer may be an electrically-floated conductive layer, or a dielectric layer having a trap site. By performing a main-program after performing a pre-program, to increase the threshold voltage of the non-volatile memory device, the program current can be effectively reduced.

    摘要翻译: 非易失性存储器件的编程方法包括非易失性存储器件的预编程以及预编程的非易失性存储器件的主程序。 非易失性存储器件可以包括依次堆叠在半导体衬底上的隧道介电层,电荷存储层,阻挡介电层和栅电极。 电荷存储层可以是具有陷阱位置的电浮动导电层或介电层。 通过在执行预编程之后执行主程序,为了增加非易失性存储器件的阈值电压,可以有效地减少编程电流。

    Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
    5.
    发明授权
    Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same 有权
    具有浮动阱式非易失性存储单元的半导体器件及其制造方法

    公开(公告)号:US07045850B2

    公开(公告)日:2006-05-16

    申请号:US10844783

    申请日:2004-05-13

    IPC分类号: H01L29/76

    摘要: The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed. The semiconductor device can be manufactured according to the present invention to have a reduced processing time and a reduced change of impurity doping profile. The thickness of a blocking oxide layer and a high voltage gate oxide layer can be controlled.

    摘要翻译: 本发明公开了一种具有浮动阱式非易失性存储单元的半导体器件及其制造方法。 该方法包括提供具有非易失性存储区域,第一区域和第二区域的半导体衬底。 依次形成由半导体衬底上的隧道氧化物层,电荷存储层和第一沉积氧化物层构成的三层,然后除去非易失性存储区域之外的半导体衬底上的三层。 第二沉积氧化物层形成在半导体衬底的包括去除三层的第一和第二区域的整个表面上。 去除第二区域上的第二沉积氧化物层,并且在包括除去第二沉积氧化物层的第二区域的半导体衬底的整个表面上形成第一热氧化物层。 可以根据本发明制造半导体器件以减少处理时间和降低杂质掺杂分布的变化。 可以控制阻挡氧化物层和高电压栅极氧化物层的厚度。

    Non-volatile memory device having a charge storage oxide layer and operation thereof
    7.
    发明申请
    Non-volatile memory device having a charge storage oxide layer and operation thereof 失效
    具有电荷存储氧化物层的非易失性存储器件及其操作

    公开(公告)号:US20050184334A1

    公开(公告)日:2005-08-25

    申请号:US11047764

    申请日:2005-02-02

    摘要: A non-volatile memory device includes a pair of source/drain regions disposed in a semiconductor substrate, having a channel region between them. A charge storage oxide layer is disposed on the channel region and overlaps part of each of the pair of source/drain regions. A gate electrode is disposed on the charge storage oxide layer. At least one halo implantation region is formed in the semiconductor substrate adjacent to one of the pair of source/drain regions, and overlapping the charge storage oxide layer. A program operation is performed by trapping electrons in the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed, and an erase operation is performed by injecting holes into the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed.

    摘要翻译: 非易失性存储器件包括设置在半导体衬底中的一对源极/漏极区域,它们之间具有沟道区域。 电荷存储氧化物层设置在沟道区上,并且与一对源极/漏极区的每一个的一部分重叠。 栅电极设置在电荷存储氧化物层上。 至少一个卤素注入区域形成在与一对源极/漏极区域中的一个相邻的半导体衬底中,并与电荷存储氧化物层重叠。 通过在位于形成有卤素离子注入区域的源极/漏极区附近的电荷存储氧化物层中俘获电子来执行编程操作,并且通过将空穴注入位于源/漏区附近的电荷存储氧化物层中来执行擦除操作, 漏区,其中形成有卤素离子注入区。

    Programming method of a non-volatile memory device having a charge storage layer between a gate electrode and a semiconductor substrate
    8.
    发明申请
    Programming method of a non-volatile memory device having a charge storage layer between a gate electrode and a semiconductor substrate 失效
    在栅电极和半导体衬底之间具有电荷存储层的非易失性存储器件的编程方法

    公开(公告)号:US20050088879A1

    公开(公告)日:2005-04-28

    申请号:US10971201

    申请日:2004-10-21

    CPC分类号: G11C16/0425

    摘要: A programming method of a non-volatile memory device includes a pre-program of the non-volatile memory device, and a main-program of the pre-programmed non-volatile memory device. The non-volatile memory device may include a tunnel dielectric layer, a charge storage layer, a blocking dielectric layer, and a gate electrode, which are sequentially stacked on a semiconductor substrate. The charge storage layer may be an electrically-floated conductive layer, or a dielectric layer having a trap site. By performing a main-program after performing a pre-program, to increase the threshold voltage of the non-volatile memory device, the program current can be effectively reduced.

    摘要翻译: 非易失性存储器件的编程方法包括非易失性存储器件的预编程以及预编程的非易失性存储器件的主程序。 非易失性存储器件可以包括依次堆叠在半导体衬底上的隧道介电层,电荷存储层,阻挡介电层和栅电极。 电荷存储层可以是具有陷阱位置的电浮动导电层或介电层。 通过在执行预编程之后执行主程序,为了增加非易失性存储器件的阈值电压,可以有效地减少编程电流。

    Semiconductor device having gate all around type transistor and method of forming the same
    9.
    发明授权
    Semiconductor device having gate all around type transistor and method of forming the same 有权
    具有栅极全周型晶体管的半导体器件及其形成方法

    公开(公告)号:US06794306B2

    公开(公告)日:2004-09-21

    申请号:US10463554

    申请日:2003-06-17

    IPC分类号: H01L2100

    摘要: A semiconductor device having a transistor of gate all around (GAA) type and a method of fabricating the same are disclosed. A SOI substrate composed of a SOI layer, a buried oxide layer and a lower substrate is prepared. The SOI layer has at least one unit dual layer of a silicon germanium layer and a silicon layer. The SOI layer is patterned to form an active layer pattern to a certain direction. An insulation layer is formed to cover the active layer pattern. An etch stop layer is stacked on the active layer pattern covered with the insulation layer. The etch stop layer is patterned and removed at a gate region crossing the active layer pattern at the channel region. The insulation layer is removed at the gate region. The silicon germanium layer is isotropically etched and selectively removed to form a cavity at the channel region of the active layer pattern. In the state that the silicon germanium layer is selectively removed, a gate insulation layer is formed to cover the exposed surface of the active layer pattern. A gate conductivity layer is stacked on the substrate by a chemical vapor deposition (CVD) to fill the gate region including the cavity. The middle part of the channel region of the active layer pattern can be patterned to be divided by multiple patterns that are formed in a line.

    摘要翻译: 公开了具有栅极全部(GAA)型晶体管的半导体器件及其制造方法。 制备由SOI层,掩埋氧化物层和下基板构成的SOI衬底。 SOI层具有硅锗层和硅层的至少一个单元双层。 图案化SOI层,以形成一定方向的有源层图案。 形成绝缘层以覆盖有源层图案。 在覆盖有绝缘层的有源层图案上堆叠蚀刻停止层。 蚀刻停止层被图案化并在沟道区域与有源层图案交叉的栅极区域去除。 绝缘层在栅极区域被去除。 硅锗层被各向同性地蚀刻并选择性地去除以在有源层图案的沟道区域形成空腔。 在选择性地去除硅锗层的状态下,形成栅极绝缘层以覆盖有源层图案的暴露表面。 通过化学气相沉积(CVD)将栅极导电层层叠在基板上,以填充包括空腔的栅极区域。 有源层图案的沟道区域的中间部分可以被图案化以被划分成一行形成的多个图案。

    Semiconductor transistor using L-shaped spacer and method of fabricating the same
    10.
    发明授权
    Semiconductor transistor using L-shaped spacer and method of fabricating the same 有权
    使用L形间隔件的半导体晶体管及其制造方法

    公开(公告)号:US06693013B2

    公开(公告)日:2004-02-17

    申请号:US10103759

    申请日:2002-03-25

    IPC分类号: H01L21336

    摘要: The present invention provides a semiconductor transistor using an L-shaped spacer and a method of fabricating the same. The semiconductor transistor includes a gate pattern formed on a semiconductor substrate and an L-shaped third spacer formed beside the gate pattern and having a horizontal protruding portion. An L-shaped fourth spacer is formed between the third spacer and the gate pattern, and between the third spacer and the substrate. A high-concentration junction area is positioned in the substrate beyond the third spacer, and a low-concentration junction area is positioned under the horizontal protruding portion of the third spacer. A medium-concentration junction area is positioned between the high- and low-concentration junction areas. A method of fabricating the semiconductor transistor includes a process, where the high- and medium-concentration junction areas are formed simultaneously by the same ion-implantation step and the substrate is annealed before forming the low-concentration junction area.

    摘要翻译: 本发明提供一种使用L形间隔物的半导体晶体管及其制造方法。 半导体晶体管包括形成在半导体衬底上的栅极图案和形成在栅极图案旁边并具有水平突出部分的L形第三间隔物。 在第三间隔物和栅极图案之间以及在第三间隔物和基底之间形成L形的第四间隔物。 高浓度接合区域位于第三间隔物之外的基板中,并且低浓度接合区域位于第三间隔物的水平突出部分的下方。 中等浓度接合区域位于高浓度和低浓度接合区域之间。 制造半导体晶体管的方法包括一个过程,其中通过相同的离子注入步骤同时形成高浓度和中等浓度的结区,并且在形成低浓度结区之前将衬底退火。