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公开(公告)号：US20130252019A1
公开(公告)日：2013-09-26
申请号：US13989839
申请日：2011-12-26
CPC分类号： H01B7/40 , B32B15/20 , B32B27/16 , B32B2310/14 , C08J7/123 , C08J2367/03 , C23C18/1664 , C25D7/00 , Y10T428/12556 , Y10T428/24355 , Y10T428/31678
摘要： Provided is a copper-clad laminate comprising a metal conductor layer formed by dry plating and/or wet plating on a surface obtained by subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa. Further provided is a copper-clad laminate comprising a liquid crystal polymer film having a surface roughness after the plasma treatment of 0.15 μm or less in terms of arithmetic mean roughness Ra and 0.20 μm or less in terms of root-mean-square roughness Rq. Further provided is a method for manufacturing a copper-clad laminate, wherein a metal conductor layer is formed by dry plating and/or wet plating after subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa.
摘要翻译： 提供一种覆铜层压板，其包括通过在氧气氛或氮气氛中以气体压力对液晶聚合物膜的表面进行等离子体处理而获得的表面上通过干式电镀和/或湿式电镀形成的金属导体层 2.6〜15Pa。还提供了一种覆铜层压板，其包含在等离子体处理后的表面粗糙度为0.15μm以下的液晶聚合物膜，其算术平均粗糙度Ra为0.20μm以下， 均方粗糙度Rq。 还提供了一种制造覆铜层压板的方法，其中通过在氧气氛或氮气氛中对液晶聚合物膜的表面进行等离子体处理之后通过干电镀和/或湿法电镀形成金属导体层 气压为2.6〜15Pa。
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2.发明申请Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method for Producing Same 审中-公开液晶聚合物膜基铜包覆层及其制造方法公开(公告)号：US20140023881A1
公开(公告)日：2014-01-23
申请号：US14000318
申请日：2012-02-15
CPC分类号： B32B15/08 , B32B7/12 , B32B15/20 , B32B2307/202 , B32B2457/202 , C08J7/123 , C08J2367/03 , C09K19/38 , C09K2219/03 , H05K1/0346 , H05K3/022 , H05K3/381 , H05K3/388 , H05K2201/0141 , H05K2203/095 , Y10T428/12535 , Y10T428/31678
摘要： Provided is a liquid crystal polymer film based copper-clad laminate characterized in that a surface of one side or each of both sides of a liquid crystal polymer film has a nitrogen atom content of 10 at % or more, and a metal conductor layer formed by dry plating and/or wet painting is provided on the surface of the liquid crystal polymer film having the nitrogen atom content of 10 at % or more. The liquid crystal polymer film based copper-clad laminate is characterized by having arithmetic average roughness Ra of 0.15 μm or less and a root-mean-square roughness Rq of 0.20 μm or less as surface roughness of the liquid crystal polymer film. Also provided is a method for producing a liquid crystal polymer film based copper-clad laminate characterized by performing plasma processing on the surface of the liquid crystal polymer film under a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa, followed by forming the metal conductor layer by dry plating and/or wet plating.
摘要翻译： 本发明提供一种液晶聚合物膜系覆铜层压板，其特征在于，液晶聚合物膜的一面或两面的表面的氮原子含量为10原子％以上，金属导体层由 在氮原子含量为10原子％以上的液晶聚合物膜的表面上设置有干电镀和/或湿法涂布。 液晶聚合物膜基覆铜层压板的特征在于，作为液晶聚合物膜的表面粗糙度，算术平均粗糙度Ra为0.15μm以下，均方根粗糙度Rq为0.20μm以下。 还提供了一种用于制备液晶聚合物膜基覆铜层压板的方法，其特征在于在氮气气氛下在气压为2.6至15Pa的条件下，在液晶聚合物膜的表面上进行等离子体处理，然后形成金属 导体层通过干电镀和/或湿电镀。
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3.发明申请公开(公告)号：US20140011047A1
公开(公告)日：2014-01-09
申请号：US13983786
申请日：2012-01-25
CPC分类号： H05K1/0346 , C23C14/022 , C23C14/025 , C23C14/20 , C23C14/205 , C23C28/00 , C25D7/00 , Y10T428/12569 , Y10T428/24975
摘要： A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 μm is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 μm is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11. The present invention aims at discovering; as a consequence of performing surface characterization by subjecting the PI film surface to XPS analysis before and after the plasma treatment, and of evaluating the dissolution properties and adhesive strength of the PI film before and after the plasma treatment; a two-layered copper-clad laminate material that is ideal to be processed during a wet PI etching step, and a production method for said two-layered copper-clad laminate material.
摘要翻译： 通过在氧气气氛中的辉光放电等离子体处理对厚度为12.5〜50μm的聚酰亚胺膜的一面或两面进行改性处理的双层覆铜层叠材料， 在改性处理之后，通过溅射或电镀在聚酰亚胺膜的一个表面或两个表面上形成厚度为1至5μm的铜层; 其特征在于，通过分析等离子体处理后聚酰亚胺膜表面的光电子能谱（XPS）光谱获得的287〜290eV的C1S峰与283〜287eV的C1S峰的积分强度比在 范围为0.03〜0.11。 本发明旨在发现; 作为通过在等离子体处理之前和之后对PI膜表面进行XPS分析并且评估PI膜在等离子体处理之前和之后的溶解性能和粘合强度进行表面表征的结果的结果。 在湿式PI蚀刻步骤中理想的加工的双层覆铜层压材料以及所述两层覆铜层压材料的制造方法。
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公开(公告)号：US20130256006A1
公开(公告)日：2013-10-03
申请号：US13884650
申请日：2011-11-08
申请人： Kazuhiko Sakaguchi , Hajime Inazumi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi
CPC分类号： H05K3/06 , C23F1/02 , C23F1/14 , C23F1/16 , C23F1/44 , H05K1/0393 , H05K1/09 , H05K3/388 , H05K2201/0154 , H05K2201/0355 , Y10T29/49128
摘要： A method for forming a circuit on a flexible laminate substrate, wherein when a circuit is formed using an adhesive-free flexible laminate having a polyimide film that serves as a flexible laminate substrate at least one surface of which is plasma-treated, a tie-coat layer A formed on the polyimide film, a metal conductor layer B formed on the tie-coat layer, and a nickel-copper alloy layer as an alloy layer C on the metal conductor layer, a photoresist is applied on the alloy layer C formed on the metal conductor layer, the photoresist is exposed and developed, the sputter layer C, the metal conductor layer B, and the alloy layer C are removed by etching using the same etching solution so as to retain a circuit portion, and the photoresist of the circuit portion is further removed so as to form the circuit.
摘要翻译： 一种在柔性层压基板上形成电路的方法，其中当使用不含粘合剂的柔性层压体形成电路时，该层压板具有聚酰亚胺膜，该聚酰亚胺膜用作至少一个表面被等离子体处理的柔性层压基板， 形成在聚酰亚胺膜上的涂层A，在接合涂层上形成的金属导体层B和在金属导体层上作为合金层C的镍 - 铜合金层，在形成的合金层C上施加光致抗蚀剂 在金属导体层上，曝光和显影光致抗蚀剂，通过使用相同的蚀刻溶液进行蚀刻来去除溅射层C，金属导体层B和合金层C，以便保持电路部分，并且光致抗蚀剂 电路部分被进一步去除以形成电路。
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公开(公告)号：US20130001186A1
公开(公告)日：2013-01-03
申请号：US13577493
申请日：2011-02-04
申请人： Kazuhiko Sakaguchi , Hajime Inazumi
发明人： Kazuhiko Sakaguchi , Hajime Inazumi
IPC分类号： H05K3/06
CPC分类号： H05K3/062 , C23F1/02 , C23F1/14 , C23F1/18 , C23F1/26 , C23F1/44 , H05K1/0393 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2203/095
摘要： Disclosed is a method of forming a circuit on a flexible laminate substrate. When forming a circuit using an adhesiveless flexible laminate which includes a polyimide film as the flexible laminate substrate in which at least one surface thereof is subject to plasma treatment, a tie-coat layer A formed on the polyimide film, a metal conductor layer B formed on the tie-coat layer, and a layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the following method is used. The photoresist is coated on the layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the photoresist is exposed and developed, the layer C other than the circuit forming parts thereof is selectively removed in advance via pre-etching, the conductor layer B is thereafter removed by supplemental etching with leaving the circuit portion, and the photoresist of the circuit portion is further removed so as to form the circuit. By forming a tie-coat layer or a metal or alloy that is equivalent to the tie-coat layer on the metal conductor layer of the adhesiveless flexible laminate, simultaneously achieved are the inhibition of side etching, which interferes with the achievement of finer pitches of circuit wiring, and the improvement of linearity of the wiring.
摘要翻译： 公开了一种在柔性层压基板上形成电路的方法。 当使用包括聚酰亚胺膜作为其至少一个表面进行等离子体处理的柔性层压基板的无粘合剂柔性层压体形成电路时，形成在聚酰亚胺膜上的粘结层A，形成的金属导体层B 在连接层上形成的层C和与金属导体层上形成的结合层相同的层C，使用以下方法。 光致抗蚀剂被涂覆在具有与形成在金属导体层上的结合层相同成分的层C上，光致抗蚀剂被曝光和显影，除了其电路形成部分之外的层C被预先选择性地去除 通过预蚀刻，然后通过补充蚀刻除去导体层B，留下电路部分，并且进一步去除电路部分的光致抗蚀剂以形成电路。 通过形成与无粘合剂柔性层压体的金属导体层上的粘结层相当的粘结层或金属或合金，同时实现的侧蚀刻的抑制，这妨碍了更好的间距 电路布线，线路线性的提高。
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6.发明授权公开(公告)号：US06319621B1
公开(公告)日：2001-11-20
申请号：US09451317
申请日：1999-11-30
申请人： Hideta Arai , Kazuhiko Sakaguchi
发明人： Hideta Arai , Kazuhiko Sakaguchi
IPC分类号： B32B1501
CPC分类号： C25D3/56 , H05K3/244 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12715 , Y10T428/12722 , Y10T428/12778 , Y10T428/12792 , Y10T428/12847 , Y10T428/12854 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993
摘要： To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidation resistance characterized by a composite layer containing chromium, zinc, phosphorus, and nickel formed on the glossy surface of the foil and also to a method of manufacturing the same by electrolysis.
摘要翻译： 为了建立进一步提高具有含铬，锌和磷的复合层的铜箔的光泽表面的抗氧化性的技术，通过具有优异的抗氧化性的铜箔，其特征在于包含含有 铬，锌，磷和镍形成在箔的光泽表面上，还涉及通过电解制造其的方法。
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公开(公告)号：US5507975A
公开(公告)日：1996-04-16
申请号：US266155
申请日：1994-06-27
申请人： Mitsuhiro Koden , Tomoaki Kuratate , Fumiaki Funada , Kazuhiko Sakaguchi , Yutaka Shiomi , Tohru Kitamura
发明人： Mitsuhiro Koden , Tomoaki Kuratate , Fumiaki Funada , Kazuhiko Sakaguchi , Yutaka Shiomi , Tohru Kitamura
CPC分类号： C09K19/42 , C09K19/46 , C09K19/3405
摘要： A ferroelectric liquid crystal device having a pair of substrates each provided with voltage applying means, an orientation control layer formed on at least one of the substrates, and a layer of ferroelectric liquid crystal composition disposed between the pair of substrates, the ferroelectric liquid crystal composition comprising at least one compound (a) having an optically active group of the formula (I): ##STR1## at least one compound (b) which is reverse to the compound (a) in the direction of a helical pitch induced in a nematic phase and at least one liquid crystal compound (c) exhibiting a smectic C phase, the liquid crystal composition exhibiting at least a smectic C phase, smectic A phase and nematic phase.
摘要翻译： 一种具有一对基板的铁电液晶装置，每个基板设置有电压施加装置，形成在至少一个基板上的取向控制层以及设置在该对基板之间的铁电液晶组合物层，铁电液晶组合物 包含至少一种具有式（I）的光学活性基团的化合物（a）：（I）至少一种与化合物（a）相反的化合物（b）在螺旋桨诱导的方向上 在向列相和至少一种显示近晶相C的液晶化合物（c）中，该液晶组合物至少表现出近晶C相，近晶A相和向列相。
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公开(公告)号：US5366814A
公开(公告)日：1994-11-22
申请号：US153327
申请日：1993-11-16
CPC分类号： H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S428/935 , Y10T428/12438 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both. The roughened layer is electrolytically overcoated with the treatment layer following the formation of a copper plating layer, which, when necessary, is anti-corrosively treated.
摘要翻译： 用于印刷电路的铜箔具有形成在箔的与基底结合的一侧上的粗糙层，该粗糙层由许多包含铬钨或两者的突出铜电沉积物组成。 还可以具有覆盖粗糙层的铜镀层和覆盖铜镀层的处理层，并且由选自铜，铬，镍，铁，钴和锌的金属形成，或者由 两种或更多种这样的金属。 必要时，铜箔可以含有在处理层上进一步形成的各种铬酸盐处理层的防腐层。 铜箔通过在酸性铜电解槽中以接近临界密度的电流密度电解原料箔作为阴极，由此形成粗糙层，电解槽含有0.001-5g / l的铬离子钨离子 或两者。 在形成镀铜层之后，用处理层对粗化层进行电解过涂层，当需要时，其被抗腐蚀处理。
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9.发明授权Liquid crystalline compounds, liquid crystal compositions containing the same and use thereof 失效液晶化合物，含有它们的液晶组合物及其应用
公开(公告)号：US5338482A
公开(公告)日：1994-08-16
申请号：US557777
申请日：1990-07-26
申请人： Kazuhiko Sakaguchi , Tohru Kitamura
发明人： Kazuhiko Sakaguchi , Tohru Kitamura
IPC分类号： G02F1/13 , C07D239/26 , C07D303/22 , C07D307/33 , C07D405/12 , C09K19/34 , C09K19/44 , C07D309/00 , C09K19/00
CPC分类号： C07D307/33 , C07D405/12 , C09K19/3466 , C09K19/3405
摘要： Liquid crystalline compounds having an optically active .gamma.-lactone ring of the general formula (A): ##STR1## wherein R.sup.1 is a group selected from the class consisting of ##STR2## n and e are each independently 0 or 1, R.sup.3 is an alkyl group having 1 to 15 carbon atoms or an alkenyl group having 2 to 15 carbon atoms, said alkyl and alkenyl groups having each optionally one or more asymmetric carbon atoms, X and Y are each hydrogen atom, a halogen atom or a cyano group, R.sup.2 is an alkyl group having 1 to 15 carbon atoms or an alkenyl group having 2 to 15 carbon atoms, said alkyl and alkenyl groups having each optionally one or more asymmetric carbon atoms, and * means an asymmetric carbon atom, a liquid crystal composition Containing the same and an element for opto-electronics devices comprising the liquid crystal composition.
摘要翻译： 具有通式（A）的光学活性的γ-内酯环的液晶化合物：其中R 1是选自下列的基团：其中R 1是选自下列的基团： 独立地为0或1，R3为具有1至15个碳原子的烷基或具有2至15个碳原子的烯基，所述烷基和烯基各自为一个或多个不对称碳原子，X和Y各自为氢原子， 卤素原子或氰基，R 2为碳原子数为1〜15的烷基或碳原子数为2〜15的烯基，所述烷基和烯基各自为一个以上的不对称碳原子，*表示不对称的 碳原子，含有该液晶组合物的液晶组合物和包含液晶组合物的光电子器件的元件。
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公开(公告)号：US5210201A
公开(公告)日：1993-05-11
申请号：US906348
申请日：1992-06-30
IPC分类号： C07C43/178 , C07C43/315 , C07C45/29 , C07C45/51 , C07C45/56 , C07C45/66 , C07C47/277 , C07C49/255 , C07C49/753 , C07C69/734 , C07D261/20
CPC分类号： C07D261/20 , C07C43/1782 , C07C43/1787 , C07C43/315 , C07C45/29 , C07C45/296 , C07C45/515 , C07C45/56 , C07C45/66 , C07C47/277 , C07C49/255 , C07C49/753 , C07C69/734
摘要： The present invention relates to novel optically active isoxazole derivatives represented by general formula: ##STR1## which are useful as intermediates for synthesis of prostaglandin and a process for producing the same as well as novel aldehyde compounds represented by general formula: ##STR2## which are intermediates for preparing the compounds [XI] described above and a process for preparation thereof. In the compounds shown by these formulae, R.sup.1 represents an alkyl group or a cycloalkyl group which may have an alkoxy group or a group shown by --Ra--A--B (wherein Ra is an alkyl group; A is a hetero atom or an single bond; and B is an aromatic or hetero ring which may have a substituent(s)); and R.sup.2 and R.sup.3, which may be the same or different, each represents an aralkyl group, a silyl group or an acyl group.
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