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    Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
    3.
    发明授权
    Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method 有权

    公开(公告)号：US10349531B2

    公开(公告)日：2019-07-09

    申请号：US15209930

    申请日：2016-07-14

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Nobuaki Miyamoto ,  Michiya Kohiki

    IPC分类号： H05K3/40 ,  H05K3/20 ,  H05K3/18 ,  H05K3/00

    摘要： Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.

    Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
    6.
    发明申请
    Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board 有权

    公开(公告)号：US20210362475A1

    公开(公告)日：2021-11-25

    申请号：US16498010

    申请日：2019-04-22

    申请人： JX Nippon Mining & Metals Corporation

    发明人： Nobuaki Miyamoto ,  Atsushi Miki

    IPC分类号： B32B15/20 ,  H05K1/09 ,  B32B15/04 ,  B32B15/01 ,  C22C9/04

    摘要： A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni concentration of 0.1 to 15.0 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO2) for 1 minute. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.