Vertical transistors with multiple gate lengths

    公开(公告)号:US11251267B2

    公开(公告)日:2022-02-15

    申请号:US16684022

    申请日:2019-11-14

    摘要: A pair of vertical fin field effect transistors (FinFETs) having different gate lengths, includes, a first bottom source/drain on a first region of a substrate, wherein the first bottom source/drain includes a first tier having a first height adjacent to a first vertical fin and a second tier having a second height greater than the first tier removed from the first vertical fin; and a second bottom source/drain on a second region of the substrate, wherein the second bottom source/drain includes a third tier having a third height adjacent to a second vertical fin and a fourth tier having a fourth height greater than the third tier removed from the second vertical fin, wherein the third height is less than the first height and the fourth height is equal to the second height.

    Transistor with reduced gate resistance and improved process margin of forming self-aligned contact

    公开(公告)号:US11195754B2

    公开(公告)日:2021-12-07

    申请号:US16155498

    申请日:2018-10-09

    IPC分类号: H01L21/768

    摘要: A semiconductor structure is provided that includes a gate conductor structure having a middle portion that has a vertical thickness that is greater than a vertical thickness of each end portion, and a self-aligned dielectric gate cap located on the gate conductor structure and having a middle portion that has a vertical thickness that is less than a vertical thickness of each end portion. The aforementioned gate conductor structure, which is taller in the middle and shorter at the edges, has reduced gate resistance, while the aforementioned self-aligned dielectric gate cap, which is taller at the edges and shorter in the middle, increases process margin for contact formation.

    Integrating extra gate VFET with single gate VFET

    公开(公告)号:US10957599B2

    公开(公告)日:2021-03-23

    申请号:US16182848

    申请日:2018-11-07

    摘要: Embodiments of the present invention are directed to techniques for integrating an extra gate (EG) vertical field effect transistor (VFET) with a single gate (SG) VFET. In a non-limiting embodiment of the invention, a bottom source or drain (S/D) layer is formed over a substrate. A first semiconductor fin is formed over the bottom S/D layer in a first region of the substrate and a second semiconductor fin is formed over the bottom S/D layer in a second region of the substrate. A block mask is formed over the first semiconductor fin and the second semiconductor fin is recessed. The second semiconductor fin is exposed to an isotropic or anisotropic fin trim.