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公开(公告)号:US12093100B2
公开(公告)日:2024-09-17
申请号:US17033753
申请日:2020-09-26
申请人: Intel Corporation
发明人: Vivek Garg , Ankush Varma , Krishnakanth Sistla , Nikhil Gupta , Nikethan Shivanand Baligar , Stephen Wang , Nilanjan Palit , Timothy Yee-Kwong Kam , Adwait Purandare , Ujjwal Gupta , Stanley Chen , Dorit Shapira , Shruthi Venugopal , Suresh Chemudupati , Rupal Parikh , Eric Dehaemer , Pavithra Sampath , Phani Kumar Kandula , Yogesh Bansal , Dean Mulla , Michael Tulanowski , Stephen Paul Haake , Andrew Herdrich , Ripan Das , Nazar Syed Haider , Aman Sewani
CPC分类号: G06F1/28 , G06F1/30 , G06F13/20 , G06F2213/40
摘要: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.
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公开(公告)号:US20220100247A1
公开(公告)日:2022-03-31
申请号:US17033753
申请日:2020-09-26
申请人: Intel Corporation
发明人: Vivek Garg , Ankush Varma , Krishnakanth Sistla , Nikhil Gupta , Nikethan Shivanand Baligar , Stephen Wang , Nilanjan Palit , Timothy Kam , Adwait Purandare , Ujjwal Gupta , Stanley Chen , Dorit Shapira , Shruthi Venugopal , Suresh Chemudupati , Rupal Parikh , Eric Dehaemer , Pavithra Sampath , Phani Kumar Kandula , Yogesh Bansal , Dean Mulla , Michael Tulanowski , Stephen Haake , Andrew Herdrich , Ripan Das
摘要: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.
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公开(公告)号:US11567555B2
公开(公告)日:2023-01-31
申请号:US16557657
申请日:2019-08-30
申请人: Intel Corporation
发明人: Jason Seung-Min Kim , Sundar Ramani , Yogesh Bansal , Nitin N. Garegrat , Olivia K. Wu , Mayank Kaushik , Mrinal Iyer , Tom Schebye , Andrew Yang
摘要: Embodiments include an apparatus comprising an execution unit coupled to a memory, a microcode controller, and a hardware controller. The microcode controller is to identify a global power and performance hint in an instruction stream that includes first and second instruction phases to be executed in parallel, identify a local hint based on synchronization dependence in the first instruction phase, and use the first local hint to balance power consumption between the execution unit and the memory during parallel executions of the first and second instruction phases. The hardware controller is to use the global hint to determine an appropriate voltage level of a compute voltage and a frequency of a compute clock signal for the execution unit during the parallel executions of the first and second instruction phases. The first local hint includes a processing rate for the first instruction phase or an indication of the processing rate.
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