公开(公告)号：US20170019350A1

公开(公告)日：2017-01-19

申请号：US14800552

申请日：2015-07-15

申请人： INTEL CORPORATION

发明人： Bahaa Fahim ,  Yen-Cheng Liu ,  Chung-Chi Wang ,  Donald C. Soltis, JR. ,  Terry C. Huang ,  Tejpal Singh ,  Bongjin Jung ,  Nazar Syed Haider

IPC分类号： H04L12/933 ,  H04L12/937

CPC分类号： H04L49/103 ,  G06F11/1064 ,  G06F13/4022 ,  H04L49/254

摘要： A shared mesh comprises a mesh station. The mesh station is used to couple to at least a first core component and a second core component. The mesh station includes a logic unit. The mesh station is shared by at least the first core component and the second core component. A memory is coupled to the mesh station.

摘要翻译： 共享网格包括网格站。 网状站用于耦合到至少第一核心组件和第二核心组件。 网格站包括一个逻辑单元。 网状站由至少第一核心组件和第二核心组件共享。 存储器耦合到网格站。

公开(公告)号：US12093100B2

公开(公告)日：2024-09-17

申请号：US17033753

申请日：2020-09-26

申请人： Intel Corporation

发明人： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Yee-Kwong Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Paul Haake ,  Andrew Herdrich ,  Ripan Das ,  Nazar Syed Haider ,  Aman Sewani

IPC分类号： G06F1/28 ,  G06F1/30 ,  G06F13/20

CPC分类号： G06F1/28 ,  G06F1/30 ,  G06F13/20 ,  G06F2213/40

摘要： Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US10193826B2

公开(公告)日：2019-01-29

申请号：US14800552

申请日：2015-07-15

申请人： INTEL CORPORATION

发明人： Bahaa Fahim ,  Yen-Cheng Liu ,  Chung-Chi Wang ,  Donald C. Soltis, Jr. ,  Terry C. Huang ,  Tejpal Singh ,  Bongjin Jung ,  Nazar Syed Haider

IPC分类号： H04L12/933 ,  H04L12/937 ,  G06F13/40 ,  G06F11/10

摘要： A shared mesh comprises a mesh station. The mesh station is used to couple to at least a first core component and a second core component. The mesh station includes a logic unit. The mesh station is shared by at least the first core component and the second core component. A memory is coupled to the mesh station.