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公开(公告)号：US09837380B2
公开(公告)日：2017-12-05
申请号：US14165720
申请日：2014-01-28
发明人： Tian San Tan , Theng Chao Long
IPC分类号： H01L23/00 , H01L25/065 , H01L21/56 , H01L23/31 , H01L25/00 , H01R4/00 , H01L25/07 , H01L23/433 , H01L23/495
CPC分类号： H01L25/0655 , H01L21/56 , H01L23/3107 , H01L23/3121 , H01L23/4334 , H01L23/49513 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/48 , H01L24/70 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/89 , H01L24/97 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/05554 , H01L2224/05609 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/37011 , H01L2224/37013 , H01L2224/37026 , H01L2224/3719 , H01L2224/40227 , H01L2224/40245 , H01L2224/40499 , H01L2224/48227 , H01L2224/48245 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83143 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/84143 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/84825 , H01L2224/8484 , H01L2224/8485 , H01L2224/84855 , H01L2224/97 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/1425 , H01L2924/14252 , H01L2924/14253 , H01L2924/181 , H01R4/00 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/83 , H01L2224/84
摘要： A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.
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公开(公告)号：US09484280B2
公开(公告)日：2016-11-01
申请号：US14153003
申请日：2014-01-11
发明人： Tiam Meng Pon , Tian San Tan , Theng Chao Long
IPC分类号： H01L23/34 , H01L23/367 , H01L21/48 , H01L23/13 , H01L23/14 , H01L23/31 , H01L23/495 , H01L23/467
CPC分类号： H01L23/367 , H01L21/4878 , H01L23/13 , H01L23/14 , H01L23/3107 , H01L23/3157 , H01L23/467 , H01L23/49503 , H01L23/49541 , H01L23/49568 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion.
摘要翻译： 提供一种半导体器件，其中半导体器件包括载体，其中载体包括构造成保持半导体芯片的第一部分; 以及第二部分，其被配置用于将所述半导体器件安装到支撑件上，所述第二部分还包括构造成连接到所述支撑件的第一特征; 以及至少一个第二特征，其被配置为便于将热量从所述第一部分传出，其中所述至少一个第二特征增加所述第二部分的表面积。
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公开(公告)号：US20150214189A1
公开(公告)日：2015-07-30
申请号：US14165720
申请日：2014-01-28
发明人： Tian San Tan , Theng Chao Long
CPC分类号： H01L25/0655 , H01L21/56 , H01L23/3107 , H01L23/3121 , H01L23/4334 , H01L23/49513 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/48 , H01L24/70 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/89 , H01L24/97 , H01L25/072 , H01L25/50 , H01L2224/04026 , H01L2224/05554 , H01L2224/05609 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/37011 , H01L2224/37013 , H01L2224/37026 , H01L2224/3719 , H01L2224/40227 , H01L2224/40245 , H01L2224/40499 , H01L2224/48227 , H01L2224/48245 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83143 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/84143 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/84825 , H01L2224/8484 , H01L2224/8485 , H01L2224/84855 , H01L2224/97 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/1425 , H01L2924/14252 , H01L2924/14253 , H01L2924/181 , H01R4/00 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/83 , H01L2224/84
摘要： A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.
摘要翻译： 半导体器件包括器件载体，安装在器件载体上的第一半导体芯片和安装在器件载体上的第二半导体芯片。 此外，半导体器件包括接合到第一半导体芯片的第一电极的第一接触夹，与第二半导体芯片的第一电极接合的第二接触夹和被配置为保持第一接触夹和第二接触的绝缘连接器 夹在一起
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