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公开(公告)号：US20230178428A1
公开(公告)日：2023-06-08
申请号：US17543199
申请日：2021-12-06
发明人： Thorsten Meyer , Fee Hoon Wendy Wong , Thomas Behrens , Eric Lopez Bonifacio , Chau Fatt Chiang , Irmgard Escher-Poeppel , Giovanni Ragasa Garbin , Martin Gruber , Tien Shyang Law , Mohamad Azian Mohamed Azizi , Si Hao Vincent Yeo
IPC分类号： H01L21/768 , H01L21/56 , H01L23/31 , H01L21/48
CPC分类号： H01L21/76838 , H01L21/563 , H01L23/31 , H01L21/4839
摘要： A method includes providing a lead frame with a central metal plate and a plurality of leads extending away from the central metal plate, the central metal plate including an upper surface that includes a first mesa that is elevated from recessed regions, mounting a semiconductor die on the upper surface of central metal plate such that a lower surface of the semiconductor die is at least partially disposed on the first mesa, forming electrical interconnections between terminals of the semiconductor die and the leads, forming an encapsulant body on the central metal plate such that the semiconductor die is encapsulated by the encapsulant body and such that the leads protrude out from edge sides of the encapsulant body, and thinning the central metal plate from a rear surface of the central metal plate so as to isolate the first mesa at a lower surface of the encapsulant body.
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公开(公告)号：US20220037222A1
公开(公告)日：2022-02-03
申请号：US17386654
申请日：2021-07-28
IPC分类号： H01L23/31 , H01L21/48 , H01L21/56 , H01L23/538 , H01L23/00
摘要： A semiconductor package includes a semiconductor die, an encapsulation encapsulating the semiconductor die, the encapsulation having a first side and an opposing second side, a plurality of contact pads for electrically contacting the semiconductor die, the contact pads being arranged on the first side of the encapsulation, and a plurality of inspection holes arranged in communication with the contact pads and extending from the first side to the second side, such that solder joints on the first side of the encapsulation are optically inspectable using the inspection holes viewed from the second side of the encapsulation.
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公开(公告)号：US20210391298A1
公开(公告)日：2021-12-16
申请号：US17412787
申请日：2021-08-26
IPC分类号： H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/495 , H01L23/29 , H01L25/065 , H01L23/52
摘要： A packaged semiconductor includes an electrically insulating encapsulant body having an upper surface, a first semiconductor die encapsulated within the encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the encapsulant body, a second semiconductor die encapsulated within the encapsulant body and disposed laterally side by side with the first semiconductor die, the second semiconductor die having a main surface with a second conductive pad that faces the upper surface of the encapsulant body, and a first conductive track that is formed in the upper surface of the encapsulant body and electrically connects the first conductive pad to the second conductive pad. The encapsulant body includes a laser activatable mold compound.
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公开(公告)号：US10777536B2
公开(公告)日：2020-09-15
申请号：US16213478
申请日：2018-12-07
发明人： Chau Fatt Chiang , April Coleen Tuazon Bernardez , Junny Abdul Wahid , Roslie Saini bin Bakar , Kon Hoe Chin , Hock Heng Chong , Kok Yau Chua , Hsieh Ting Kuek , Chee Hong Lee , Soon Lee Liew , Nurfarena Othman , Pei Luan Pok , Werner Reiss , Stefan Schmalzl
IPC分类号： H01L25/075 , H01L25/065 , H01L23/498 , B81B7/00 , H01L23/31 , B81C1/00 , H01L23/10
摘要： Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.
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公开(公告)号：US10595132B1
公开(公告)日：2020-03-17
申请号：US16129419
申请日：2018-09-12
发明人： Chau Fatt Chiang , Kok Yau Chua
摘要： A device includes: a first sidewall including a first opening extending through the first sidewall; a first sensor attached to an interior surface of the first sidewall, wherein the first sensor is aligned to at least partially cover the first opening; a second sidewall opposite the first sidewall; a third sidewall attaching the first sidewall to the second sidewall; and a first contact pad disposed on an exterior surface of the third sidewall, wherein the first contact pad is configured to provide at least one of a power connection or a signal connection for the first sensor.
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公开(公告)号：US10549985B2
公开(公告)日：2020-02-04
申请号：US15692938
申请日：2017-08-31
发明人： Dominic Maier , Matthias Steiert , Chau Fatt Chiang , Christian Geissler , Bernd Goller , Thomas Kilger , Johannes Lodermeyer , Franz-Xaver Muehlbauer , Chee Yang Ng , Beng Keh See , Claus Waechter
摘要： A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
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公开(公告)号：US20190023561A1
公开(公告)日：2019-01-24
申请号：US15653234
申请日：2017-07-18
发明人： Sook Woon Chan , Chau Fatt Chiang , Kok Yau Chua , Swee Kah Lee , Chee Yang Ng
摘要： An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.
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公开(公告)号：US10163812B2
公开(公告)日：2018-12-25
申请号：US15297744
申请日：2016-10-19
发明人： Chau Fatt Chiang , Kok Yau Chua , Swee Kah Lee , Chee Yang Ng , Valentyn Solomko
IPC分类号： H01L23/498 , H01L23/552 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/66 , H01L23/00
摘要： A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
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公开(公告)号：US20230170226A1
公开(公告)日：2023-06-01
申请号：US17536538
申请日：2021-11-29
发明人： Chau Fatt Chiang , Thorsten Meyer , Chan Lam Cha , Wern Ken Daryl Wee , Chee Hong Lee , Swee Kah Lee , Norliza Morban , Khay Chwan Andrew Saw
IPC分类号： H01L21/48 , H01L23/31 , H01L23/498 , H01L23/367 , H01L21/56 , H01L25/00 , H01L25/18
CPC分类号： H01L21/4853 , H01L23/31 , H01L23/49811 , H01L23/367 , H01L21/568 , H01L25/50 , H01L25/18
摘要： A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.
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公开(公告)号：US11302613B2
公开(公告)日：2022-04-12
申请号：US16924851
申请日：2020-07-09
发明人： Chau Fatt Chiang , Swee Kah Lee , Josef Maerz , Thomas Stoek , Chee Voon Tan
IPC分类号： H01L23/495 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/18
摘要： A method of producing a molded semiconductor package includes: attaching a first load terminal at a first side of a semiconductor die to a leadframe, the semiconductor die having a second load terminal at a second side opposite the first side and a control terminal at the first side or the second side; encapsulating the semiconductor die in a laser-activatable mold compound so that the leadframe is at least partly exposed from the laser-activatable mold compound at a first side of the molded semiconductor package, and the second load terminal is at least partly exposed from the laser-activatable mold compound at a second side of the molded semiconductor package opposite the first side; and laser activating a first region of the laser-activatable mold compound to form a first laser-activated region that is electrically conductive.
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