SENSING CHIP
    7.
    发明申请

    公开(公告)号:US20170184584A1

    公开(公告)日:2017-06-29

    申请号:US14983568

    申请日:2015-12-30

    CPC classification number: G01N33/54393 G01N33/54353 G01N33/54373 G01N33/553

    Abstract: A sensing chip including a substrate, a plurality of metal nanostructures, a first surface modified layer and a second surface modified layer is provided. The metal nanostructures are disposed on the substrate. The first surface modified layer is disposed on a surface of the metal nanostructures, wherein the first surface modified layer includes a plurality of thiol group-containing molecules. The second surface modified layer is disposed on a surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules.

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