公开(公告)号：US11923208B2

公开(公告)日：2024-03-05

申请号：US15599980

申请日：2017-05-19

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Steven Kenneth Christie ,  Brent Allan Best

IPC: H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  C01B7/19 ,  C11D3/39 ,  H01L21/30 ,  H01L21/304

CPC classification number: H01L21/67046 ,  B08B1/04 ,  C01B7/191 ,  C11D3/391 ,  H01L21/304 ,  H01L21/67028 ,  H01L21/67253 ,  B08B1/007 ,  H01L21/30 ,  H01L21/67

Abstract: Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

公开(公告)号：US11205582B2

公开(公告)日：2021-12-21

申请号：US16564175

申请日：2019-09-09

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Steven Kenneth Christie ,  Brent Allan Best

IPC: H01L21/66 ,  H01L21/677 ,  B24B29/00 ,  H01L21/02 ,  B24D13/14 ,  H01L21/67 ,  B24B53/14 ,  B24B57/02

Abstract: A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.

公开(公告)号：US20240058893A1

公开(公告)日：2024-02-22

申请号：US18449086

申请日：2023-08-14

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Brent Allan Best

IPC: B23K26/08 ,  B23K37/053

CPC classification number: B23K26/0823 ,  B23K37/053

Abstract: Systems and methods of forming a brush for advanced semiconductor contact cleaning applications are disclosed. For example, a contact surface or surfaces, such as a nodule, of a brush can be cut by a laser cutting system. The use of a laser cutting system allows for uniform cutting of the contact surface across a length of the brush.

公开(公告)号：US20210074556A1

公开(公告)日：2021-03-11

申请号：US16996224

申请日：2020-08-18

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Erik Scott Nelson ,  Corey Alan Hughes ,  Brent Allan Best

IPC: H01L21/67 ,  A46B9/00 ,  A46B13/04 ,  A46B9/02

Abstract: Provided is a disclosure for a brush for cleaning a surface, where the brush comprises a center core and cleaning material around the center core. Modules are found on the cleaning material, where nodule density on the cleaning material varies. Accordingly, a first nodule density of a first region of the cleaning material is different than a second nodule density of a second region of the cleaning material

公开(公告)号：US20180337102A1

公开(公告)日：2018-11-22

申请号：US15600021

申请日：2017-05-19

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Steven Kenneth Christie ,  Brent Allan Best

IPC: H01L21/66 ,  H01L21/677 ,  B24B29/00 ,  H01L21/02 ,  B24D13/14

CPC classification number: H01L22/26 ,  B24B29/005 ,  B24B53/14 ,  B24B57/02 ,  B24D13/145 ,  H01L21/0201 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67253 ,  H01L21/67703

Abstract: Provided is a disclosure for embodiments that perform effluent monitoring for brush conditioning, where the monitored data may be fed back for use in the conditioning.

公开(公告)号：US20240112926A1

公开(公告)日：2024-04-04

申请号：US18375202

申请日：2023-09-29

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes

IPC: H01L21/67 ,  A46B1/00 ,  A46B9/00 ,  A46B11/06 ,  A46B13/00 ,  A46B13/02 ,  B08B1/00 ,  B08B1/02 ,  B08B1/04

CPC classification number: H01L21/67046 ,  A46B1/00 ,  A46B9/005 ,  A46B11/06 ,  A46B13/001 ,  A46B13/02 ,  B08B1/002 ,  B08B1/02 ,  B08B1/04 ,  A46B2200/3073

Abstract: An example brush for cleaning of a substrate includes: a porous polymeric brush body having one or more contact surfaces for cleaning the substrate, the one or more contact surfaces comprising a microtexture; and a brush support configured to mechanically couple the brush body to an actuator.

公开(公告)号：US20200288857A1

公开(公告)日：2020-09-17

申请号：US16890535

申请日：2020-06-02

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  H01L21/67 ,  A46B9/00 ,  A46D3/00 ,  B29C45/16 ,  H01L21/02

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

公开(公告)号：US20190090624A1

公开(公告)日：2019-03-28

申请号：US15712212

申请日：2017-09-22

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  B29C45/16 ,  A46B9/00 ,  A46D3/00 ,  H01L21/02

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

公开(公告)号：US20180337071A1

公开(公告)日：2018-11-22

申请号：US15599980

申请日：2017-05-19

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Corey Alan Hughes ,  Erik Scott Nelson ,  Steven Kenneth Christie ,  Brent Allan Best

IPC: H01L21/67 ,  H01L21/304 ,  B08B1/04 ,  C01B7/19 ,  C11D3/39

CPC classification number: H01L21/67046 ,  B08B1/007 ,  B08B1/04 ,  C01B7/191 ,  C11D3/391 ,  H01L21/30 ,  H01L21/304 ,  H01L21/67 ,  H01L21/67028 ,  H01L21/67253

Abstract: Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

公开(公告)号：US11684144B2

公开(公告)日：2023-06-27

申请号：US16890535

申请日：2020-06-02

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  H01L21/67 ,  A46B9/00 ,  A46D3/00 ,  B29C45/16 ,  H01L21/02 ,  A46B13/02 ,  B08B3/10 ,  B29K31/00 ,  B29L31/42

CPC classification number: A46B9/06 ,  A46B9/005 ,  A46D3/00 ,  B29C45/1615 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67046 ,  A46B13/02 ,  A46B2200/3073 ,  B08B3/10 ,  B29K2031/04 ,  B29L2031/42

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.