公开(公告)号：US20200288857A1

公开(公告)日：2020-09-17

申请号：US16890535

申请日：2020-06-02

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  H01L21/67 ,  A46B9/00 ,  A46D3/00 ,  B29C45/16 ,  H01L21/02

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

公开(公告)号：US20190090624A1

公开(公告)日：2019-03-28

申请号：US15712212

申请日：2017-09-22

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  B29C45/16 ,  A46B9/00 ,  A46D3/00 ,  H01L21/02

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

公开(公告)号：US11684144B2

公开(公告)日：2023-06-27

申请号：US16890535

申请日：2020-06-02

Applicant: Illinois Tool Works Inc.

Inventor： Bradley Scott Withers ,  Yuyan Luo ,  Erik Scott Nelson ,  Brent Allan Best

IPC: A46B9/06 ,  H01L21/67 ,  A46B9/00 ,  A46D3/00 ,  B29C45/16 ,  H01L21/02 ,  A46B13/02 ,  B08B3/10 ,  B29K31/00 ,  B29L31/42

CPC classification number: A46B9/06 ,  A46B9/005 ,  A46D3/00 ,  B29C45/1615 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67046 ,  A46B13/02 ,  A46B2200/3073 ,  B08B3/10 ,  B29K2031/04 ,  B29L2031/42

Abstract: Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.