MEMORY MIGRATION WITHIN A MULTI-HOST DATA PROCESSING ENVIRONMENT

    公开(公告)号:US20230036054A1

    公开(公告)日:2023-02-02

    申请号:US17388993

    申请日:2021-07-29

    Abstract: A destination host includes a processor core, a system fabric, a memory system, and a link controller communicatively coupled to the system fabric and configured to be communicatively coupled, via a communication link, to a source host with which the destination host is non-coherent. The destination host migrates, via the communication link, a state of a logical partition from the source host to the destination host and page table entries for translating addresses of a dataset of the logical partition from the source host to the destination host. After migrating the state and page table entries, the destination host initiates execution of the logical partition on the processor core while at least a portion of the dataset of the logical partition resides in the memory system of the source host and migrates, via the communication link, the dataset of the logical partition to the memory system of the destination host.

    Completion logic performing early commitment of a store-conditional access based on a flag

    公开(公告)号:US11281582B2

    公开(公告)日:2022-03-22

    申请号:US16742380

    申请日:2020-01-14

    Abstract: A data processing system includes multiple processing units all having access to a shared memory system. A processing unit includes a lower level cache configured to serve as a point of systemwide coherency and a processor core coupled to the lower level cache. The processor core includes an upper level cache, an execution unit that executes a store-conditional instruction to generate a store-conditional request that specifies a store target address and store data, and a flag that, when set, indicates the store-conditional request can be completed early in the processor core. The processor core also includes completion logic configured to commit an update of the shared memory system with the store data specified by the store-conditional request based on whether the flag is set.

    Multiple chip bridge connector
    7.
    发明授权

    公开(公告)号:US10991635B2

    公开(公告)日:2021-04-27

    申请号:US16517568

    申请日:2019-07-20

    Abstract: The present invention includes a bridge connector with one or more semiconductor layers in a bridge connector shape. The shape has one or more edges, one or more bridge connector contacts on a surface of the shape, and one or more bridge connectors. The bridge connectors run through one or more of the semiconductor layers and connect two or more of the bridge connector contacts. The bridge connector contacts are with a tolerance distance from one of the edges. In some embodiments the bridge connector is a central bridge connector that connects two or more chips disposed on the substrate of a multi-chip module (MCM). The chips have chip contacts that are on an interior corner of the chip. The interior corners face one another. The central bridge connector overlaps the interior corners so that each of one or more of the bridge contacts is in electrical contact with each of one or more of the chip contacts. In some embodiments, overlap is minimized to permit more access to the surface of the chips. Arrays of MCMs and methods of making bridge connects are disclosed. Bridge connector shapes include: rectangular, window pane, plus-shaped, circular shaped, and polygonal-shaped.

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