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公开(公告)号：US10957030B2
公开(公告)日：2021-03-23
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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公开(公告)号：US10886647B2
公开(公告)日：2021-01-05
申请号：US16201367
申请日：2018-11-27
发明人： Wei Wang , WeiFeng Zhang , YanLong Hou , Ben Wu , Miao Zhang
摘要： According to some embodiments, a socket for an electronic device includes a housing and pins connected to the housing. The housing includes a base extending laterally and having an inner face and an outer face; a riser connected to the base and extending away from the outer face; a wall extending laterally, connected to the riser, and having an exterior face and an interior face that faces the outer face of the base; mounting ports extending through the base from the inner face to the outer face; and exit ports extending through the wall from the interior face to the exterior face. Each pin includes a portion extending at least partially though one mounting port; a portion extending between the base and the wall; and a portion extending through one exit port.
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公开(公告)号：US10535970B2
公开(公告)日：2020-01-14
申请号：US15415355
申请日：2017-01-25
发明人： Qiuyi Yu , Na Fan , Zhao Lin , Xingquan Dong , WeiFeng Zhang
摘要： An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.
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公开(公告)号：US10286471B2
公开(公告)日：2019-05-14
申请号：US15924484
申请日：2018-03-19
发明人： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
IPC分类号： B23K3/00 , B23K35/22 , H05K3/22 , B23K1/018 , B23K1/00 , B23K3/04 , B23K3/08 , B23K35/26 , B23K35/30 , B23K35/36 , B23K35/02 , B23K31/02 , B23K31/12 , H05K3/34 , B23K101/42
摘要： A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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公开(公告)号：US20200169017A1
公开(公告)日：2020-05-28
申请号：US16201367
申请日：2018-11-27
发明人： Wei Wang , WeiFeng Zhang , YanLong Hou , Ben Wu , Miao Zhang
IPC分类号： H01R12/71 , H01R12/70 , H01R13/24 , H01R13/506 , H01R43/20
摘要： According to some embodiments, a socket for an electronic device includes a housing and pins connected to the housing. The housing includes a base extending laterally and having an inner face and an outer face; a riser connected to the base and extending away from the outer face; a wall extending laterally, connected to the riser, and having an exterior face and an interior face that faces the outer face of the base; mounting ports extending through the base from the inner face to the outer face; and exit ports extending through the wall from the interior face to the exterior face. Each pin includes a portion extending at least partially though one mounting port; a portion extending between the base and the wall; and a portion extending through one exit port.
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公开(公告)号：US20200058117A1
公开(公告)日：2020-02-20
申请号：US16103178
申请日：2018-08-14
发明人： Jiayu Zheng , Tao Song , Zexin Luo , WeiFeng Zhang , Lingle Guo , Mingman Li , Zhen Wang
摘要： System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
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公开(公告)号：US10286472B2
公开(公告)日：2019-05-14
申请号：US15924523
申请日：2018-03-19
发明人： Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
IPC分类号： B23K3/00 , B23K35/22 , H05K3/22 , B23K1/018 , B23K1/00 , B23K3/04 , B23K3/08 , B23K35/26 , B23K35/30 , B23K35/36 , B23K35/02 , B23K31/02 , B23K31/12 , H05K3/34 , B23K101/42
摘要： A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
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公开(公告)号：US10061309B1
公开(公告)日：2018-08-28
申请号：US15841869
申请日：2017-12-14
发明人： WeiFeng Zhang , Guo Wei , Lin Zhao , Zhipeng Wang , Qiuyi Yu , Zhongfeng Yang , YanLong Hou
IPC分类号： G06F19/00 , G05B19/418
CPC分类号： G05B19/41885 , G05B2219/42058 , G05B2219/45026 , Y02P90/02
摘要： In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.
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公开(公告)号：US20180074094A1
公开(公告)日：2018-03-15
申请号：US15264963
申请日：2016-09-14
发明人： Wei Guo , Yanlong Hou , WeiFeng Zhang , Lin Zhao
CPC分类号： G01R31/2801 , G01R1/06722
摘要： A method of testing a printed circuit board (PCB) with an in-circuit test (ICT) probe having an improved probe-to-via contact is provided. The ICT probe includes a tip attached to a spindle; a housing having a cavity, a portion of the spindle insertable into the cavity; and a heating element wrapped helically around the spindle, the heating element coupled to the housing. The probe is contacted with a surface of a flux layer of a test via of the PCB, said contact compressing the heating element and recessing the insertable portion of the spindle into the cavity. The tip of the probe is heated with the heating element to a temperature capable of at least partially melting the flux layer, the tip at least partially penetrating the flux layer to contact a surface of a solder plugging the test via.
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公开(公告)号：US20170276713A1
公开(公告)日：2017-09-28
申请号：US15077955
申请日：2016-03-23
发明人： Wei Guo , LiCen Mu , Qiuyi Yu , WeiFeng Zhang , Lin Zhao
IPC分类号： G01R31/00 , B23P19/04 , H05K3/30 , G01R19/165
CPC分类号： G01R31/001 , B23P19/04 , G01R19/165 , H01L27/0248 , H05K3/30
摘要： A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history
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